公开(公告)号：KR1020130042154A

公开(公告)日：2013-04-26

申请号：KR1020110106294

申请日：2011-10-18

Applicant: 삼성전자주식회사

Inventor： 백호선 ,  김학환 ,  최일흥 ,  문경미

IPC: H01L33/44 ,  H01L33/36

CPC classification number: H01L33/62 ,  H01L33/44 ,  H01L2224/16225

Abstract: PURPOSE: A light emitting device and a manufacturing method thereof, and a light emitting device module using the same are provided to improve heat dissipation efficiency using a first and a second bump. CONSTITUTION: A first electrode(130) is formed in the exposed region of a first semiconductor layer(121). A second electrode(140) is formed in a second semiconductor layer(123). A passivation layer exposes the first region of the first electrode and the first region of the second electrode. A first bump is formed in the first region including the first electrode. A second bump is formed in the second region including the second electrode.

Abstract translation: 目的：提供发光器件及其制造方法以及使用其的发光器件模块，以使用第一和第二凸块提高散热效率。 构成：第一电极（130）形成在第一半导体层（121）的暴露区域中。 第二电极（140）形成在第二半导体层（123）中。 钝化层暴露第一电极的第一区域和第二电极的第一区域。 在包括第一电极的第一区域中形成第一凸块。 在包括第二电极的第二区域中形成第二凸块。

公开(公告)号：KR1020130022121A

公开(公告)日：2013-03-06

申请号：KR1020110084894

申请日：2011-08-25

Applicant: 삼성전자주식회사

Inventor： 문경미 ,  김학환

IPC: G02F1/13357 ,  G02F1/1333

CPC classification number: G02B6/0021 ,  G02F1/133615 ,  H01L33/58

Abstract: PURPOSE: A backlight unit is provided to have slim thickness by using a cob type light emitting device module. CONSTITUTION: An LED module(120) includes at least one COB(Chip On Board) type light emitting device chip(122) mounted on a substrate(121). The light entry surface(130a) of a light guide plate(130) receives the light emitted from the light emission surface of the light emitting device chip. The light entry surface includes at least one insertion groove(131) for the light emitting device chip.

Abstract translation: 目的：通过使用芯棒型发光器件模块，提供背光单元以使其厚度变薄。 构造：LED模块（120）包括安装在基板（121）上的至少一个COB（板上芯片）型发光器件芯片（122）。 导光板（130）的光入射表面（130a）接收从发光器件芯片的发光表面发射的光。 光入射表面包括用于发光器件芯片的至少一个插入槽（131）。

公开(公告)号：KR1020120105146A

公开(公告)日：2012-09-25

申请号：KR1020110022761

申请日：2011-03-15

Applicant: 삼성전자주식회사

Inventor： 오관영 ,  송영희 ,  박성수 ,  문경미

IPC: H01L33/62 ,  H01L33/64

CPC classification number: H01L21/67126 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/97 ,  H01L2933/0066 ,  Y10T29/49124 ,  Y10T29/53174 ,  H01L2924/00014

Abstract: PURPOSE: A manufacturing method of a light emitting device package and a manufacturing device of the light emitting device package using the same are provided to improve thermal transfer efficiency from a heater block to a light emitting device in the wire bonding process. CONSTITUTION: A heater block(10) is formed into a flat pattern. The heater block comprises a groove portion(11) and a protrusion portion(12). The groove portion is formed in the area in which a light emitting device package(30) is arranged in the wire bonding. A clamp(40) is arranged on a lead frame(20) of the light emitting device package. One or more grooves are formed on the location corresponding to the protrusion portion of the bottom of the light emitting device package. The height of the upper surface of the heater block and the height of the surface of the protrusion portion are same.

Abstract translation: 目的：提供一种发光器件封装的制造方法和使用其的发光器件封装的制造装置，以提高在引线接合工艺中从加热器块到发光器件的热传递效率。 构成：加热器块（10）形成为平坦的图案。 加热器块包括槽部分（11）和突出部分（12）。 沟槽部分形成在引线接合中布置有发光器件封装（30）的区域中。 夹具（40）布置在发光器件封装的引线框架（20）上。 在对应于发光器件封装的底部的突出部分的位置处形成一个或多个凹槽。 加热器块的上表面的高度和突出部分的表面的高度是相同的。

公开(公告)号：KR1020120091862A

公开(公告)日：2012-08-20

申请号：KR1020110011921

申请日：2011-02-10

Applicant: 삼성전자주식회사

Inventor： 편인준 ,  이영진 ,  문경미 ,  최일흥

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/48

CPC classification number: H01L2224/48091 ,  H01L2924/15157 ,  H01L2924/181 ,  H01L33/62 ,  H01L33/20 ,  H01L33/52 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: PURPOSE: A light emitting device package is provided to improve the reliability of the light emitting device package by arranging a wire to be surrounded with a resin molding unit filled in a cavity. CONSTITUTION: A main body(110) includes a light emitting device mounting unit and a plurality of lead terminals(111,112). A light emitting device(120) is mounted on the light emitting device mounting unit. The light emitting device is electrically connected to the plurality of lead terminals using a plurality of wires(121,122). A resin molding unit is filled in the cavity to limit an area to surround the light emitting device and the plurality of wires. The cavity includes a first cavity(141) which surrounds the light emitting device and a second cavity(142a,142b) which surrounds the wire.

Abstract translation: 目的：提供一种发光器件封装，以通过布置被填充在空腔中的树脂模塑单元包围的导线来提高发光器件封装的可靠性。 构成：主体（110）包括发光装置安装单元和多个引线端子（111,112）。 发光器件（120）安装在发光器件安装单元上。 发光装置使用多根导线（121,122）与多个引线端子电连接。 树脂成型单元填充在空腔中以限制围绕发光装置和多根电线的区域。 空腔包括围绕发光器件的第一腔（141）和围绕线的第二腔（142a，142b）。

公开(公告)号：KR1020120083663A

公开(公告)日：2012-07-26

申请号：KR1020110004925

申请日：2011-01-18

Applicant: 삼성전자주식회사

Inventor： 옥정태 ,  김학환 ,  백호선 ,  김권중 ,  문경미 ,  김민정 ,  허한나

IPC: H01L33/36

CPC classification number: H01L33/62 ,  H01L24/11 ,  H01L33/38 ,  H01L33/44 ,  H01L2224/0401 ,  H01L2933/0016

Abstract: PURPOSE: Bumps for light emitting device and fabrication method thereof are provided to reduce processing steps and costs by directly forming bumps with a UBM layer on a metal pad of an emitting element including Ti group metal materials. CONSTITUTION: An emitting element (110) where a transparent substrate (111), first semiconductor layer (112), active layer (113), and second semiconductor layer (114) are includes electrode pads (115,116,117) including Ti group metal materials. A passivation layer(120) is formed to expose an electrode pad on the emitting element. A bump(130) which is either a shoulder or cupper pillar bump is formed on the exposed electrode pad through the passivation layer.

Abstract translation: 目的：提供用于发光器件的冲击件及其制造方法，以通过在包括Ti族金属材料的发光元件的金属焊盘上直接与UBM层形成凸块来减少加工步骤和成本。 构成：透明基板（111），第一半导体层（112），有源层（113）和第二半导体层（114）的发光元件（110）包括包括Ti族金属材料的电极焊盘（115,116,117）。 形成钝化层（120）以暴露发射元件上的电极焊盘。 通过钝化层在暴露的电极焊盘上形成凸起（130），其是肩部或杯形突起。

公开(公告)号：KR1020110121927A

公开(公告)日：2011-11-09

申请号：KR1020100041445

申请日：2010-05-03

Applicant: 삼성전자주식회사

Inventor： 문경미 ,  송영희 ,  최일흥 ,  이정욱 ,  이영진

IPC: F21K99/00 ,  F21V29/83 ,  F21V29/507 ,  F21V23/06 ,  F21Y101/02 ,  F21Y103/00

CPC classification number: F21V23/06 ,  F21K9/275 ,  F21V29/507 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12044 ,  F21K9/00 ,  F21K9/27 ,  F21Y2101/00 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PURPOSE: An illumination apparatus employing a light emitting device package is provided to making a lighting device light by using a lead frame having an exposed structure. CONSTITUTION: In an illumination apparatus employing a light emitting device package, a light source is comprised of at least one light module(100) having a lead frame. The lead frame interlinks a plurality of light-emitting device chips. A diffusion cover(210) has an internal space accepting the light source module. The diffusion cover diffuses the light coming out from the light source module. A mounting unit(240) is formed in the diffusion cover adjacency to be adjunct to the light source module.

Abstract translation: 目的：提供采用发光器件封装的照明装置，通过使用具有暴露结构的引线框来使照明装置发光。 构成：在采用发光器件封装的照明装置中，光源由至少一个具有引线框架的光模块（100）组成。 引线框架连接多个发光器件芯片。 扩散罩（210）具有容纳光源模块的内部空间。 扩散罩扩散从光源模块出来的光。 一个安装单元（240）形成在扩散盖相邻中以附加到光源模块。