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公开(公告)号：KR1020090056570A
公开(公告)日：2009-06-03
申请号：KR1020070123779
申请日：2007-11-30
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J183/04 , C09J7/02 , H01L21/48
CPC classification number: C09J7/00 , C09J163/00 , C09J183/04 , C09J2203/326 , H01L21/48
Abstract: An adhesive film composition for a semiconductor assembly is provided to remove void remaining in precure by increasing fluidity and lowering viscosity at a die attach temperature. An adhesive film composition for a semiconductor assembly comprises a thermoplastic resin 5-40 parts by weight which has a softening point of 0-90 °C and an average molecular weight of 200-10,000; a sphere filler 0.1-50 parts by weight; an elastomeric resin 5-60 parts by weight containing a hydroxyl group, a carboxyl group or an epoxy group; an epoxy-based resin 5-60 parts by weight; a phenol type epoxy hardener 5-30 parts by weight; a curing catalyst 0.01-5 parts by weight selected from the group consisting of a phosphine-, boron- and imidazole-based curing catalysts; and a silane coupling agent 0.01-10 parts by weight.
Abstract translation: 提供一种用于半导体组件的粘合剂膜组合物，用于通过增加流动性并降低管芯附着温度下的粘度来去除保留在预固化物中的空隙。 用于半导体组合物的粘合膜组合物包括5-40重量份的软化点为0-90℃，平均分子量为200-10,000的热塑性树脂; 球填料0.1-50重量份; 含有羟基，羧基或环氧基的5-60重量份的弹性体树脂; 环氧基树脂5-60重量份; 苯酚型环氧固化剂5-30重量份; 0.01-5重量份选自磷化氢，硼和咪唑的固化催化剂的固化催化剂; 和硅烷偶联剂0.01-10重量份。
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公开(公告)号：KR1020090041246A
公开(公告)日：2009-04-28
申请号：KR1020070106849
申请日：2007-10-23
Applicant: 제일모직주식회사
IPC: C09J171/10 , C09J163/00 , C09J7/02 , C09J7/00
CPC classification number: C09J7/00 , C09J11/04 , C09J163/00 , C09J171/10 , C09J2203/326
Abstract: An adhesive film composition for a semiconductor assembly is provided to reduce the generation of burr or chipping in a sawing process by increasing a tensile modulus before curing of the adhesive film. An adhesive film composition for a semiconductor assembly comprises, based on solid portion, (i) phenoxy resin 2-15 weight%; (ii) ester-based thermoplastic resin 10-30 weight%; (iii) elastomer resin 30-60 weight% containing an hydroxyl group or epoxy group; (iv) epoxy-based resin 5-20 weight%; (v) at least one resin 2-20 weight% selected from the group consisting of a phenol type resin hardener or aromatic amine-based hardener resin as a hardener; and (vi) at least one catalyst 0.01-5 weight% selected from the group consisting of phosphine-based, boron-based and imidazole-based curing catalyst.
Abstract translation: 提供一种用于半导体组件的粘合膜组合物，用于通过增加粘合剂膜固化前的拉伸模量来减少锯切过程中的毛刺或碎屑的产生。 用于半导体组合物的粘合剂膜组合物基于固体部分包含（i）2-15重量％的苯氧基树脂; （ii）10-30重量％的酯基热塑性树脂; （iii）含有羟基或环氧基的30-60重量％弹性体树脂; （iv）环氧树脂5-20重量％树脂; （v）至少一种选自苯酚型树脂固化剂或芳族胺类固化剂树脂作为硬化剂的2-20重量％的树脂; 和（vi）至少一种选自磷化氢基，硼基和咪唑基固化催化剂的0.01-5重量％的催化剂。
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公开(公告)号：KR100885794B1
公开(公告)日：2009-02-26
申请号：KR1020060134920
申请日：2006-12-27
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/10 , C09J183/00 , C09J7/02
Abstract: 본 발명은 반도체 조립용 접착필름 조성물에 관한 것으로서, 더욱 상세하게는 수산기, 카르복실기 또는 에폭시기로부터 라디칼 중합을 가능하게 하는 라디칼 중합형 엘라스토머 수지, 0℃ 내지 200℃범위의 높은 유리전이온도(Tg)를 갖는 접착증진 결정성 폴리에스터 필름형성 수지, (메타)아크릴레이트계 수지 및 모노머, (메타)아크릴레이트 수지 경화제, 첨가제,실란 커플링제, 충진제, 및 유기 용매를 포함하는 것을 특징으로 하는 반도체 조립용 접착필름 조성물에 관한 것이다. 본 발명의 반도체 조립용 접착필름 조성물은, 라디칼중합으로 경화가 이루어짐으로써 반도체 제조 공정시 빠른 경화로 인하여 공정성을 향상시킬 수 있는 반도체 조립용 접착필름을 제공할 수 있다.
반도체 조립용 접착필름, 라디칼 중합형 엘라스토머, 퍼옥시드, 실란 커플링제, 다이쉐어값, 반도체공정-
公开(公告)号：KR100787721B1
公开(公告)日：2007-12-24
申请号：KR1020060069718
申请日：2006-07-25
Applicant: 제일모직주식회사
CPC classification number: H01L21/6836 , H01L2221/68327
Abstract: A dicing die bond film suitable for processing a thin film wafer is provided to remove a chip flying effect by increasing fixing force to a ring frame. A dicing die bond film includes a supporting base layer, an adhesive layer, and a fixing adhesive layer. The adhesive layer includes a lower adhesive layer(32) and an upper adhesive layer(22). The lower adhesive layer is laminated on the supporting base layer. The upper adhesive layer is laminated on the lower adhesive layer. The peel strength between the lower adhesive layer and the ring frame is 0.007N/mm to 1.000N/mm. The peel strength between the upper adhesive and the fixing adhesive layer is 0.002N/mm to 0.020N/mm after the peel strength. Further, the upper adhesive layer contains 30-90 wt.% of acryl copolymer, 10-70 wt.% of acryl compound and 0.1-10 wt.% of photoinitiator based on 100 wt.% of the upper adhesive layer.
Abstract translation: 提供适于处理薄膜晶片的切割模片接合薄膜，以通过增加对环形框架的固定力来消除芯片飞行效应。 切割芯片接合膜包括支撑基底层，粘合剂层和固定粘合剂层。 粘合剂层包括下部粘合剂层（32）和上部粘合剂层（22）。 下部粘合剂层层压在支撑基底层上。 上粘合剂层层压在下粘合剂层上。 下粘合剂层和环形框架之间的剥离强度为0.007N / mm至1.000N / mm。 剥离强度后，上粘合剂和固定粘合剂层之间的剥离强度为0.002N / mm至0.020N / mm。 此外，上粘合剂层包含基于100重量％的上粘合剂层的30-90重量％的丙烯酸共聚物，10-70重量％的丙烯酸化合物和0.1-10重量％的光引发剂。
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25.发明授权편광판용 접착제 조성물, 이를 포함하는 편광판용 접착 필름, 이를 포함하는 편광판 및 이를 포함하는 광학 표시 장치 有权用于偏振板的粘合剂组合物，含有相同，偏振板和包括该包括相同的光学显示装置的偏振板粘接膜
公开(公告)号：KR101518504B1
公开(公告)日：2015-05-11
申请号：KR1020130124259
申请日：2013-10-17
Applicant: 제일모직주식회사
IPC: C09J183/08 , G02B5/30 , C09J7/02 , G02F1/13
Abstract: 본 발명은 화학식 1의 화합물과 개시제를 포함하는 편광판용 접착제 조성물, 이를 포함하는 편광판용 접착 필름, 이를 포함하는 편광판 및 이를 포함하는 광학 표시 장치에 관한 것이다.
Abstract translation: 本发明涉及一种包含偏振板的光学显示装置，它包括粘合膜，其用于偏振板，其包括用于偏振板相同的粘合剂组合物，包含化合物和式（I）的引发剂。
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Patent Agency Ranking
公开(公告)号：KR1020130096682A
公开(公告)日：2013-08-30
申请号：KR1020130083822
申请日：2013-07-16
Applicant: 제일모직주식회사
IPC: C09J175/04 , C09J11/00 , G02B5/30
CPC classification number: C09J11/06 , C09J175/04 , G02B5/30
Abstract: PURPOSE: An adhesive composition is provided to have higher water resistance, high temperature water resistance, and high temperature durability in comparison with an adhesive composition comprising water dispersible isocyanate group cross-linker. CONSTITUTION: An adhesive comprises: a compound having isocyanate functional group, and aromatic sulfonic acid ion. The compound is formed by a compound having hydroxamic acid functional group, and a reaction initiator having aromatic group sulfonyl radical. The aromatic sulfonic acid ion is originated from a reaction initiator having non-reacted aromatic sulfonyl radical, or aromatic sulfonic acid formed by a reaction of the reaction initiator with the compound having hydroxamic acid functional group. A polarizing plate comprises: a polarized light device; and a protection film attached on a side or both sides of the polarizing device through the adhesive above.
Abstract translation: 目的：与含有水分散性异氰酸酯基交联剂的粘合剂组合物相比，提供了具有更高耐水性，耐高温性和耐高温性的粘合剂组合物。 构成：粘合剂包括：具有异氰酸酯官能团的化合物和芳族磺酸离子。 该化合物由具有异羟肟酸官能团的化合物和具有芳基磺酰基的反应引发剂形成。 芳香族磺酸离子源自具有未反应的芳族磺酰基的反应引发剂或通过反应引发剂与具有异羟肟酸官能团的化合物反应形成的芳香族磺酸。 偏振片包括：偏振光装置; 以及通过上述粘合剂安装在偏振装置的一侧或两侧的保护膜。
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公开(公告)号：KR1020130075419A
公开(公告)日：2013-07-05
申请号：KR1020110143778
申请日：2011-12-27
Applicant: 제일모직주식회사
IPC: C09J133/04 , C09J7/00 , G02B5/30 , C09J4/00
CPC classification number: C09J133/08 , C08L51/06 , C08L2312/00 , C09J133/02
Abstract: PURPOSE: An adhesive composition for polarizing plates with excellent transparency and reworkability is provided to present a great adhesion layer with excellent adhesion by increasing compatibility with a (meta) acrylic copolymer (acting as an adhesive). CONSTITUTION: An adhesive composition for polarizing plates comprises a (meta) acrylic copolymer, an acrylic-modified petroleum resin tackifier indicated as the following formula 1: R'-CO-O-R and a cross-linking agent. The R' is the petroleum resin. The R is a C1~20 alkyl group or a C6~50 aryl group. The optical member comprises a adhesion layer including the acrylic denaturation petroleum resin tackifier with dilatometric softening temperature of 50-150°C. The optical member has a characteristic of 1or less% of brightness difference according to the following equation 1: ΔL = [ (a + b + d + e)/4] - c. The a, the b, the d and the e are brightness measured at the brightness measuring point of the central location of the panel angular side. The c is brightness of the panel central part.
Abstract translation: 目的：通过提高与（甲基）丙烯酸共聚物（作为粘合剂）的相容性，提供了具有优异透明性和再加工性的偏光板用粘合剂组合物，以提供具有优异粘合性的粘合层。 构成：用于偏振片的粘合剂组合物包括（甲基）丙烯酸共聚物，如下式1所示的丙烯酸改性石油树脂增粘剂：R'-CO-O-R和交联剂。 R'是石油树脂。 R为C1〜20烷基或C6〜50芳基。 光学构件包括具有膨胀软化温度为50-150℃的丙烯酸变性石油树脂增粘剂的粘合层。 根据以下等式1，光学构件具有1或更小的亮度差的特性：ΔL= [（a + b + d + e）/ 4] -c。 a，b，d和e是在面板角度侧的中心位置的亮度测量点处测量的亮度。 c是面板中心部分的亮度。
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公开(公告)号：KR1020120074106A
公开(公告)日：2012-07-05
申请号：KR1020100136065
申请日：2010-12-27
Applicant: 제일모직주식회사
IPC: C09J11/06 , C09J4/02 , C09J133/04 , G02B1/00
CPC classification number: C09J4/06 , C09J9/00 , C09J11/06 , C09J133/08 , C09J133/10 , G02B1/00
Abstract: PURPOSE: An adhesive composition and an optical element using the same are provided to prevent a light leakage phenomenon in small and medium sizes and improve splitting resistance and re-working property. CONSTITUTION: An adhesive composition comprises fluorine-containing polyol and release strength between an adhesive sheet and a glass sheet at 180 degrees according to JIS 2107 reference is 200-350gf/25mm at 300mm/min tension speed. 0.1-10 parts by weight of the fluorine-containing polyol is contained based on 100.0 parts by weight of (meth) acrylate adhesive resin. The fluorine-containing polyol has a refractive index of 1.2-1.3 and an average molecular weight of 50-1,000 g/mol. The fluorine-containing polyol is fluorine-containing alkyl diol acrylate.
Abstract translation: 目的：提供粘合剂组合物和使用其的光学元件，以防止中小尺寸的光泄漏现象，并提高耐裂纹性和再加工性能。 构成：粘合剂组合物包含含氟多元醇，根据JIS 2107参考，180度下的粘合片和玻璃片之间的剥离强度为200-350gf / 25mm，300mm / min的张力。 基于100.0重量份的（甲基）丙烯酸酯粘合树脂，含有0.1-10重量份的含氟多元醇。 含氟多元醇的折射率为1.2-1.3，平均分子量为50-1,000g / mol。 含氟多元醇是含氟烷基二醇丙烯酸酯。
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公开(公告)号：KR100959746B1
公开(公告)日：2010-05-25
申请号：KR1020070106849
申请日：2007-10-23
Applicant: 제일모직주식회사
IPC: C09J171/10 , C09J163/00 , C09J7/02 , C09J7/00
Abstract: 본 발명은 페녹시계 수지 및 폴리에스테르계 열 가소성 수지를 포함하는 반도체 조립용 접착 필름 조성물 및 접착필름에 관한 것이다. 본 발명의 조성물에 의하면 경화 전 인장 모듈러스를 30Kgf/mm2 이상으로 향상시켜 칩 크기로의 절단 공정 이후 접착제간 고착화를 방지하는 것은 물론 점착층과의 픽업성을 유리하게 하고, 또한 다이 어태치 공정 시 발생하는 기포 제거를 용이하게 하여 높은 신뢰성을 확보할 수 있는 반도체 조립용 접착 필름을 제공할 수 있다.
반도체 조립용 접착 필름, 페녹시수지, 에스테르계 열가소성 수지, 에폭시기 함유형 엘라스토머 수지, 에폭시계 수지, 페놀계 혹은 아민형 경화제, 이미다졸계 경화촉매, 실란 커플링제, 무기 충진제-
公开(公告)号：KR1020090060684A
公开(公告)日：2009-06-15
申请号：KR1020070127598
申请日：2007-12-10
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J133/08 , C09J7/02
CPC classification number: C09J7/00 , C09J133/08 , C09J163/00 , C09J2203/326
Abstract: A bonding film composition for a semiconductor assembly is provided to lower tack value, to increase tensile strength by pre-curing UV curable acrylate after drying the adhesive film, and to improve pick-up success rate and processability. A bonding film composition for a semiconductor assembly comprises an elastomer resin containing a hydroxyl group or a carboxyl group, and an epoxy group; a film-forming resin having a glass transition temperature (Tg) of 0~200 °C; an epoxy resin, a phenolic epoxy resin hardening agent; a UV curable polyfunctional acrylate; a photopolymerization initiator; a silane coupling agent; and filler.
Abstract translation: 提供一种用于半导体组件的接合膜组合物以降低粘性值，通过在干燥粘合剂膜之后预固化UV可固化丙烯酸酯来提高拉伸强度，并提高拾取成功率和加工性。 用于半导体组合物的接合膜组合物包括含有羟基或羧基的弹性体树脂和环氧基; 玻璃化转变温度（Tg）为0〜200℃的成膜树脂; 环氧树脂，酚醛环氧树脂硬化剂; UV可固化多官能丙烯酸酯; 光聚合引发剂; 硅烷偶联剂; 和填料。
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