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1.发明公开편광판용 접착제 조성물, 이를 포함하는 편광판용 접착 필름, 이를 포함하는 편광판 및 이를 포함하는 광학 표시 장치 有权用于偏振板的粘合组合物，包含该粘合剂的粘合膜，包含该粘合剂的偏光板和包含该粘合剂的光学显示装置
公开(公告)号：KR1020150044778A
公开(公告)日：2015-04-27
申请号：KR1020130124259
申请日：2013-10-17
Applicant: 제일모직주식회사
IPC: C09J183/08 , G02B5/30 , C09J7/02 , G02F1/13
CPC classification number: C09J183/08 , C09J7/22 , C09J7/35 , C09J7/38 , C09J2201/606 , C09J2201/61 , C09J2203/318 , G02B5/3025 , G02B5/305 , G02F1/1303 , G02F1/1313
Abstract: 본발명은화학식 1의화합물과개시제를포함하는편광판용접착제조성물, 이를포함하는편광판용접착필름, 이를포함하는편광판및 이를포함하는광학표시장치에관한것이다.
Abstract translation: 在本发明中，公开了包含引发剂和化学式1的化合物的偏振片用粘合剂组合物，包含该化合物的化合物的偏振片用粘合剂膜，包含该化合物的化合物的偏振片，含有该化合物的化合物的光学显示装置。
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公开(公告)号：KR101397705B1
公开(公告)日：2014-05-23
申请号：KR1020110147632
申请日：2011-12-30
Applicant: 제일모직주식회사
IPC: C09J129/04 , C09J11/04 , C09J7/02 , G02B5/30
Abstract: 본 발명의 편광판 접착제 조성물은 폴리비닐알코올계 수지; 제1가교제와 제2가교제를 포함하는 가교제; 및 금속산화물을 포함하고, 상기 제1가교제는 글리옥살이며, 상기 제2 가교제는 무기 가교제이고, 상기 제1가교제와 상기 제2 가교제의 중량비는 1: 2~4 : 1인 것을 특징으로 한다. 상기 편광판 접착제 조성물은 접착성이 우수할 뿐만 아니라, 양호한 외관으로 면내의 균일한 접착성을 가지며, 제품 합지부터 건조구간까지의 환경에서 소자의 크랙 발생을 줄일 수 있다.
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公开(公告)号：KR101340543B1
公开(公告)日：2013-12-11
申请号：KR1020100130083
申请日：2010-12-17
Applicant: 제일모직주식회사
IPC: C09J201/06 , C09J11/06 , C09J129/04 , G02B5/30
Abstract: 본 발명은 히드록삼산 작용기를 갖는 화합물 및 방향족 술포닐기를 갖는 반응 개시제를 접착제 조성물에 포함시켜 고 접착성, 고 내구성 및 고 신뢰성을 제공하는 편광판용 접착제 조성물에 관한 것이다.
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公开(公告)号：KR1020130078607A
公开(公告)日：2013-07-10
申请号：KR1020110147632
申请日：2011-12-30
Applicant: 제일모직주식회사
IPC: C09J129/04 , C09J11/04 , C09J7/02 , G02B5/30
CPC classification number: C09J129/04 , C09J7/22 , C09J7/381 , C09J11/04 , C09J2201/606 , C09J2203/318 , C09J2205/102 , G02B5/3025 , G02B5/305
Abstract: PURPOSE: A polarizing plate adhesive composite and a polarizing plate using the same are provided to have equal and excellent adhesive force with a good appearance and to reduce a crack of a device in an environment from a product boding section to a dry section. CONSTITUTION: A polarizing plate adhesive composite includes polyvinylalcohol resin, a cross linking agent including a first cross linking agent and a second cross linking agent, and a metal oxide. The second cross linking agent is inorganic, a weight ratio between the first and the second cross linking agents is 1:2-4:1, and the average particle diameter of the metal oxide is 10-100nm. A polarizing plate includes a polarizer (13) and a protective film attached to one or both of sides of the polarizer by using the polarizing plate adhesive composite.
Abstract translation: 目的：提供一种偏振片粘合剂复合物和使用其的偏振片，以具有相同和优异的粘合力，外观良好，并且可以减少在从产品编织部分到干燥部分的环境中的装置的裂纹。 构成：偏振片粘合剂复合材料包括聚乙烯醇树脂，包括第一交联剂和第二交联剂的交联剂和金属氧化物。 第二交联剂是无机的，第一和第二交联剂之间的重量比为1:2-4:1，金属氧化物的平均粒径为10-100nm。 偏振片包括通过使用偏振片粘合剂复合物而附着在偏振片的一侧或两侧的偏振片（13）和保护膜。
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公开(公告)号：KR1020120076267A
公开(公告)日：2012-07-09
申请号：KR1020100138346
申请日：2010-12-29
Applicant: 제일모직주식회사
IPC: C09J9/00 , C09J133/04 , C09J11/06 , C09J7/02
CPC classification number: C09J7/0246 , C08L33/06 , C09J7/22 , C09J7/38 , C09J133/06 , C09J2201/622 , C09J2203/318 , C09J2433/00 , Y10T428/28 , C09J9/00 , C09J7/385 , C09J11/06 , C09J133/04
Abstract: PURPOSE: An adhesive composition is provided to improve light-leakage phenomenon by increasing elasticity of an adhesive, and to have excellent durability under high temperatures and high humidity by not using an oligomer shape molecule. CONSTITUTION: An adhesive composition has a storage modulus of 8×10^5 - 1×10^8 dyne/cm^2, and has gel fraction of 83-95% In formula 1: gel fraction(%)=A/B × 100. In formula 1, A is residual weight after solving at room temperature(23°C) for 48 hours, and drying for 24 hours, and B is an initial mass. The adhesive composition comprises (meth)acrylate copolymer and a crosslinking agent. The (meth)acrylate copolymer comprises a (meth)acrylate resin of which glass transition temperature is 200-250 K, and a (meth)acrylate resin of which glass transition temperature is 250-300K.
Abstract translation: 目的：提供粘合剂组合物，通过增加粘合剂的弹性来改善漏光现象，并且通过不使用低聚物形状分子在高温和高湿度下具有优异的耐久性。 组成：粘合剂组合物的储能模量为8×10 ^ 5 -1×10 ^ 8达因/厘米2，凝胶分数为83-95％。在配方1中：凝胶分数（％）= A / B× 在式1中，A是在室温（23℃）下解析48小时后的残留重量，干燥24小时，B是初始质量。 粘合剂组合物包含（甲基）丙烯酸酯共聚物和交联剂。 （甲基）丙烯酸酯共聚物包含玻璃化转变温度为200-250K的（甲基）丙烯酸酯树脂和玻璃化转变温度为250-300K的（甲基）丙烯酸酯树脂。
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Patent Agency Ranking
公开(公告)号：KR100996349B1
公开(公告)日：2010-11-23
申请号：KR1020070078527
申请日：2007-08-06
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J183/04 , C09J7/02 , C09J7/00
Abstract: 본 발명은 페녹시수지; 수산기, 에폭시기를 함유하는 엘라스토머 수지; 에폭시계 수지; 페놀형 에폭시 수지 경화제 또는 방향족 아민계 경화제; 잠재성 촉매형 경화제 및 경화촉매로 이루어진 군으로부터 선택된 1종 이상의 물질; 실란 커플링제;및 충진제를 포함하는 것을 특징으로 하는 반도체 조립용 접착 필름 조성물에 관한 것으로서, 본 발명의 반도체 조립용 접착 필름 조성물은 페녹시 수지를 함유함으로써 웨이퍼와 웨이퍼 혹은 PCB와의 부착력이 우수하고, 인장 모듈러스 향상으로 점착층과의 픽업성을 유리하게 하고, 열가소성 성질로 인하여 다이 어태치 공정시 발생하는 기포를 최소화할 뿐만 아니라 PCB 기판과 같은 거친 표면을 메우는 효과가 우수하기 때문에높은 신뢰성을 확보할 수 있는 반도체 조립용 접착 필름을 제공할 수 있다.
반도체 조립용 접착 필름, 에폭시기 함유형 엘라스토머 수지, 에폭시계 수지, 페놀계 혹은 아민형 경화제, 이미다졸계 경화촉매, 실란 커플링제.-
公开(公告)号：KR1020100066789A
公开(公告)日：2010-06-18
申请号：KR1020080125261
申请日：2008-12-10
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J11/00
CPC classification number: C09J11/06 , C09J9/00 , C09J11/00 , C09J133/00 , C09J161/06 , C09J163/00 , C09J2203/326
Abstract: PURPOSE: An adhesive composition for a semiconductor device is provided to prevent the reliability of a semiconductor chip from getting fallen due to transition metal or transition metal ions and to enhance the reliability by increasing the tensile strength of a film. CONSTITUTION: An adhesive composition for a semiconductor device comprises: a polymer binder including a monomer with a transition metal-capturing group; an epoxy resin; a phenolic curable resin; a curing catalyst; a silane coupling agent; and a filler. The transition metal-capturing group oxidizes or reduces transition metal or hinders the mobility of the transition metal. The transition metal-capturing group includes one or more which are selected from -CN, -COOH, -NCO, -SH, or -NH.
Abstract translation: 目的：提供一种用于半导体器件的粘合剂组合物，以防止半导体芯片由于过渡金属或过渡金属离子而导致的可靠性降低，并且通过增加膜的拉伸强度来提高可靠性。 构成：用于半导体器件的粘合剂组合物包括：包含具有过渡金属捕获基团的单体的聚合物粘合剂; 环氧树脂; 酚醛树脂; 固化催化剂; 硅烷偶联剂; 和填料。 过渡金属捕获基团氧化或还原过渡金属或阻碍过渡金属的迁移率。 过渡金属捕获基团包括选自-CN，-COOH，-NCO，-SH或-NH中的一种或多种。
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公开(公告)号：KR1020090057697A
公开(公告)日：2009-06-08
申请号：KR1020070124393
申请日：2007-12-03
Applicant: 제일모직주식회사
IPC: C09J163/00 , C09J183/04 , C09J7/02 , C09J7/00
CPC classification number: C09J7/00 , C09J163/00 , C09J183/04 , C09J2203/326
Abstract: A bonding film composition for a semiconductor assembly is provided to prevent separation or curling of an adhesive film caused by frictional heat generating in a dicing process of a semiconductor. A bonding film composition for a semiconductor assembly comprises, based on whole solid 100.0 parts by weight of the composition, an elastomer resin -60 parts by weight containing a hydroxyl group, carboxyl group or epoxy group; a film-forming resin 5-60 parts by weight; an epoxy resin 5-40 parts by weight; a phenol type epoxy hardener 10-30 parts by weight; a curing catalyst 0.01-10 parts by weight; a silane coupling agent 0.01-10 parts by weight; filler 3-60 parts by weight; and thermal stabilizer 0.01-5 parts by weight.
Abstract translation: 提供了一种用于半导体组件的接合膜组合物，用于防止在半导体的切割工艺中由摩擦发热引起的粘合膜的分离或卷曲。 用于半导体组合物的粘合膜组合物包含基于100.0重量份组合物的全固体，含有羟基，羧基或环氧基的-60重量份弹性体树脂; 5-60重量份的成膜树脂; 环氧树脂5-40重量份; 酚类环氧固化剂10-30重量份; 固化催化剂0.01-10重量份; 硅烷偶联剂0.01-10重量份; 填料3-60重量份; 和热稳定剂0.01-5重量份。
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公开(公告)号：KR1020080060608A
公开(公告)日：2008-07-02
申请号：KR1020060134920
申请日：2006-12-27
Applicant: 제일모직주식회사
IPC: C09J133/08 , C09J133/10 , C09J183/00 , C09J7/02
CPC classification number: C09J7/00 , C09J133/08 , C09J167/00 , C09J183/00 , C09J2203/326
Abstract: A radical curable adhesive film composition for semiconductor packaging is provided to reduce the time required for fabricating semiconductors by a cure skip process using radical polymerization. A radical curable adhesive film composition for semiconductor packaging comprises: a radical polymerizable elastomer resin; an adhesion enhancing crystalline polyester-based film-forming resin; a radical polymerizable resin; a radical polymerizable thermal initiator; a silane coupling agent; a filler; additives; and an organic solvent. The radical polymerizable elastomer resin is formed by bonding a (meth)acrylate monomer to an elastomer having a hydroxyl, carboxyl or epoxy group.
Abstract translation: 提供了用于半导体封装的自由基固化粘合剂膜组合物，以通过使用自由基聚合的固化跳过工艺来减少半导体制造所需的时间。 一种用于半导体封装的可自由基固化的粘合膜组合物，包括：可自由基聚合的弹性体树脂; 粘合增强结晶聚酯基成膜树脂; 可自由基聚合的树脂; 可自由基聚合的热引发剂; 硅烷偶联剂; 填料; 添加剂; 和有机溶剂。 可自由基聚合的弹性体树脂通过将（甲基）丙烯酸酯单体粘合到具有羟基，羧基或环氧基的弹性体而形成。
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公开(公告)号：KR100826420B1
公开(公告)日：2008-04-29
申请号：KR1020060138652
申请日：2006-12-29
Applicant: 제일모직주식회사
CPC classification number: H01L24/26 , H01L21/67092 , H01L21/78
Abstract: An adhesive film composition for assembling a semiconductor, an adhesive film for assembling a semiconductor formed from the composition, and a semiconductor wafer dicing die bonding film containing the adhesive film are provided to improve the adhesive strength of an inorganic material and to enhance heat resistance and humid resistance. An adhesive film composition for assembling a semiconductor comprises 10-85 wt% of the rubber containing at least one double bond at a main chain; 5-80 wt% of a phenolic resin; 0.1-10 wt% of a curing agent; 5-50 wt% of distilled water; 5-50 wt% of a filler which has a size of 5 nm to 4 micrometers; and 4.9-20 wt% of an organic solvent. Preferably the filler is a spherical or amorphous inorganic filler.
Abstract translation: 提供一种用于组装半导体的粘合膜组合物，用于组合由该组合物形成的半导体的粘合膜以及含有该粘合剂膜的半导体晶片切割芯片接合膜，以提高无机材料的粘合强度并提高耐热性， 耐湿性。 用于组装半导体的粘合膜组合物包含10-85重量％的在主链上含有至少一个双键的橡胶; 5-80重量％的酚醛树脂; 0.1-10重量％的固化剂; 5-50％重量的蒸馏水; 5-50重量％的尺寸为5nm至4微米的填料; 和4.9-20重量％的有机溶剂。 优选地，填料是球形或无定形无机填料。
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