公开(公告)号：KR1020080088116A

公开(公告)日：2008-10-02

申请号：KR1020070030556

申请日：2007-03-28

Applicant: 한국과학기술원

Inventor： 유진 ,  지영근 ,  고용호

IPC: H01L23/48

CPC classification number: B23K1/0016 ,  B23K2201/34 ,  B23K2201/40 ,  B23K2203/18 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/16503 ,  H01L2224/8181 ,  H01L2924/00014 ,  H05K3/244 ,  H05K3/3463 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for joining lead-free solders and alloy elements of a metallic surface for prevention of a brittle fracture is provided to prevent causes of the brittle fracture by inducing a change of an intermetal compound. An alloy element joining method includes a process for joining electronic components with each other. One or more metal selected from alloy elements is added to lead-free solders of Cu or Ni surface-processed electronic components, or one of the alloy elements is plated on Cu or Ni surfaces of the electronic components, to generate an intermetal compound. The lead-free solders are selected from Sn-Ag, Sn-Cu, or Sn-Ag-Cu. The alloy elements are one or more elements selected from Zn, Al, Be, Si, Ge, and Mg.

Abstract translation: 提供一种用于接合无铅焊料和用于防止脆性断裂的金属表面的合金元素的方法，以通过引起金属间化合物的改变来防止脆性断裂的原因。 合金元件接合方法包括将电子部件彼此接合的工序。 将一种或多种选自合金元素的金属添加到Cu或Ni表面处理电子部件的无铅焊料中，或者将一种合金元素镀在电子部件的Cu或Ni表面上，以产生金属间化合物。 无铅焊料选自Sn-Ag，Sn-Cu或Sn-Ag-Cu。 合金元素是选自Zn，Al，Be，Si，Ge和Mg中的一种或多种元素。

公开(公告)号：KR100476301B1

公开(公告)日：2005-03-15

申请号：KR1020020044442

申请日：2002-07-27

Applicant: 한국과학기술원

Inventor： 김수현 ,  김종연 ,  유진

IPC: H01L21/60

CPC classification number: C25D5/18 ,  C25D5/12 ,  C25D7/123 ,  H01L21/2885 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014

Abstract: Disclosed is a fabrication method of UBM for flip chip interconnections of a semiconductor device, consisting of dipping a patterned wafer into a plating solution containing materials supplying nickel and copper ions, forming a copper layer at a predetermined current density for connection between a chip pad and a solder bump and for residual stress-buffering, and forming a nickel-copper alloy layer at an increased current density for prevention of diffusion between the solder and the pad. The method is advantageous in terms of low fabrication cost due to not requiring an etching process, while meeting the conditions of wettability, diffusion-barrier function and small residual stress required to form UBM on the patterned wafer.

公开(公告)号：KR1020130093830A

公开(公告)日：2013-08-23

申请号：KR1020120006869

申请日：2012-01-20

Applicant: 한국과학기술원

Inventor： 유진 ,  유정준

IPC: H01G11/22 ,  H01G11/00

CPC classification number: H01G11/26 ,  H01G11/66 ,  H01G11/84 ,  Y02E60/13 ,  Y10T29/417 ,  Y10T156/10

Abstract: PURPOSE: A thin film type super capacitor and a manufacturing method thereof are provided to improve power capability by forming current collectors in both sides of an electrode film. CONSTITUTION: An electrode film (12) is adhered to a substrate (10). In both sides of the electrode film, current collectors are formed. The electrode film is patterned in an in-plane structure. Through the patterning process, two electrodes are formed. The two electrodes are separated.

Abstract translation: 目的：提供薄膜型超级电容器及其制造方法，以通过在电极膜的两侧形成集电体来提高功率能力。 构成：将电极膜（12）粘附到基板（10）上。 在电极膜的两侧形成集电体。 电极膜以面内结构图案化。 通过图案化工艺，形成两个电极。 两个电极分开。

公开(公告)号：KR1020100031915A

公开(公告)日：2010-03-25

申请号：KR1020080090791

申请日：2008-09-16

Applicant: 한국표준과학연구원 ,  한국과학기술원

Inventor： 송재용 ,  유진 ,  유정준 ,  신호선

IPC: B82B3/00 ,  B82Y99/00

CPC classification number: B82B3/0047 ,  B82Y30/00 ,  C01P2004/13 ,  C01P2004/16

Abstract: PURPOSE: An adhesion method using a nanowire and a nanotube is provided to facilitate a conductive/non-conductive adhesion selectively, and to obtain environment-friendly property. CONSTITUTION: An adhesion method using a nanowire and a nanotube uses a physical contact between one adhesion surface attached with the nanotube(110) or the nanowire, and the other adhesion surface attached with the nanotube(210) or the nanowire to mechanically tangle the nanowires or the nanotubes. An adhesion method comprises the following steps: (a)forming multiple nanowires or nanotubes on one adhesion surface and forming multiple nanowires or nanotubes on the other adhesion surface; (b)contacting the multiple nanowires or nanotubes of each adhesion surface together.

Abstract translation: 目的：提供使用纳米线和纳米管的粘合方法，以有选择地促进导电/非导电粘附，并获得环境友好性。 构成：使用纳米线和纳米管的粘合方法使用附着在纳米管（110）或纳米线之间的一个粘附表面与附着有纳米管（210）或纳米线的另一粘附表面之间的物理接触，以机械地缠结纳米线 或纳米管。 粘合方法包括以下步骤：（a）在一个粘合表面上形成多个纳米线或纳米管，并在另一个粘合表面上形成多个纳米线或纳米管; （b）将每个粘合表面的多个纳米线或纳米管接触在一起。

公开(公告)号：KR100852385B1

公开(公告)日：2008-08-14

申请号：KR1020070035097

申请日：2007-04-10

Applicant: 한국표준과학연구원 ,  한국과학기술원

Inventor： 송재용 ,  유진 ,  신호선

IPC: B82B3/00 ,  B82Y40/00

CPC classification number: B82B3/0038 ,  B82Y30/00 ,  B82Y40/00 ,  C01P2004/16

Abstract: A method for manufacturing nanowires is provided to produce metal, metal oxide, or metal-metal oxide composite nanowires by controlling voltage intensity, voltage wave pattern, voltage frequency of an alternating-current power source, or a combination thereof. A method for manufacturing nanowires includes the steps of: immersing a first electrode and a second electrode in an electrolyte contained in an electrolytic bath, wherein the electrolyte is an acidic electrolyte containing ions of a metal material forming nanowires, the first electrode is a template in a predetermined form, and the second electrode is a conductive material; applying an alternating-current power source to the first and second electrodes; and selectively preparing metal, metal oxide, or metal-metal oxide composite nanowires using voltage intensity, voltage wave pattern, voltage frequency of the alternating-current power source, or a combination thereof.

Abstract translation: 提供一种制造纳米线的方法，用于通过控制电压强度，电压波形，交流电源的电压频率或其组合来产生金属，金属氧化物或金属 - 金属氧化物复合纳米线。 一种制造纳米线的方法包括以下步骤：将第一电极和第二电极浸入包含在电解槽中的电解质中，其中所述电解质是含有形成纳米线的金属材料的离子的酸性电解质，所述第一电极是 预定形式，第二电极是导电材料; 将交流电源施加到所述第一和第二电极; 以及使用电压强度，电压波形图，交流电源的电压频率或其组合选择性地制备金属，金属氧化物或金属 - 金属氧化物复合纳米线。

公开(公告)号：KR1020030090383A

公开(公告)日：2003-11-28

申请号：KR1020020028666

申请日：2002-05-23

Applicant: 한국과학기술원

Inventor： 이혁재 ,  유진 ,  김영호

IPC: H05K3/38

CPC classification number: H05K3/386 ,  B32B15/08

Abstract: PURPOSE: A method for fabricating a PCB(Printed Circuit Board) and a PCB fabricated thereby are provided to remove a dummy line and enhance the efficiency by performing a patterning process on a mandrel. CONSTITUTION: A metallic material is plated on a mandrel of a substrate(5) on which patterns are formed. A metallic conductive line(3) is formed by plating the metallic material on the mandrel. A metal layer or a polymer layer is formed or the metal layer and the polymer layer sequentially formed on the substrate(5) in order to enhance the adhesive strength. The polymer is coated on the metallic conductive line(3). A dry process is performed to dry the polymer. The mandrel is removed. The mandrel is formed with one of stainless steel, aluminium, and nickel.

Abstract translation: 目的：提供一种用于制造PCB（印刷电路板）和由此制造的PCB的方法以去除虚拟线，并通过在心轴上执行图案化工艺来提高效率。 构成：将金属材料电镀在其上形成图案的基板（5）的心轴上。 金属导电线（3）通过将金属材料镀在心轴上而形成。 为了提高粘合强度，形成金属层或聚合物层，或者金属层和聚合物层依次形成在基板（5）上。 聚合物涂覆在金属导电线（3）上。 进行干法以干燥聚合物。 去除心轴。 心轴由不锈钢，铝和镍中的一种形成。