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    COOLING OF WIDE BANDGAP SEMICONDUCTOR DEVICES
    21.
    发明公开
    COOLING OF WIDE BANDGAP SEMICONDUCTOR DEVICES 审中-公开
    宽带半导体器件的冷却

    公开(公告)号：EP3232470A1

    公开(公告)日：2017-10-18

    申请号：EP16165167.4

    申请日：2016-04-13

    Applicant: ABB Schweiz AG

    Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Agostini, Francesco ,  Habert, Mathieu ,  Rahimo, Munaf

    IPC: H01L23/427 ,  H01L23/473 ,  F25B25/00 ,  H01L29/16 ,  H01L29/20 ,  H01L29/22

    CPC classification number: H01L23/427 ,  F25B25/005 ,  H01L23/473 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/22 ,  H01L29/7393 ,  H01L29/78 ,  H05K7/20936

    Abstract: A power device (10) comprises at least one power semiconductor module (12) comprising a wide bandgap semiconductor element (18); and a cooling system (16) for actively cooling the wide bandgap semiconductor element (18) with a cooling medium, wherein the cooling system (16) comprises a refrigeration device (40) for lowering a temperature of the cooling medium below an ambient temperature of the power device (10); wherein the cooling system (16) is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor (18) element is below 100° C.

    Abstract translation: 功率器件（10）包括至少一个功率半导体模块（12），该功率半导体模块（12）包括宽带隙半导体元件（18）; 以及用冷却介质主动冷却宽带隙半导体元件（18）的冷却系统（16），其中冷却系统（16）包括用于将冷却介质的温度降低至低于环境温度的制冷设备（40） 该功率装置​​（10）; 其中所述冷却系统（16）适于以这样的方式降低所述冷却介质的温度，使得所述宽带隙半导体（18）元件的温度低于100℃

    VAPOR CHAMBER FOR COOLING AN ELECTRONIC COMPONENT, ELECTRONIC ARRANGEMENT, AND METHOD FOR MANUFACTURING THE VAPOR CHAMBER
    23.
    发明公开
    VAPOR CHAMBER FOR COOLING AN ELECTRONIC COMPONENT, ELECTRONIC ARRANGEMENT, AND METHOD FOR MANUFACTURING THE VAPOR CHAMBER 审中-公开

    公开(公告)号：EP4015966A1

    公开(公告)日：2022-06-22

    申请号：EP20214671.8

    申请日：2020-12-16

    Applicant: ABB Schweiz AG

    Inventor： Agostini, Bruno ,  Torresin, Daniele ,  Petrov, Andrey

    IPC: F28D15/00

    Abstract: A vapor chamber (20) for cooling an electronic component (28) is provided. The vapor chamber (20) comprises: a bottom cover (24) for receiving waste heat from the electronic component (28); a top cover (26), which is arranged on the bottom cover (24), wherein the bottom cover (24) and the top cover (26) are formed such that a vapor cavity (22) for accommodating a liquid is formed between the bottom cover (24) and the top cover (26); a crate element (32) for providing mechanical strength to the vapor chamber (20), wherein the crate element (32) has at least one compartment (34), which is formed by at least three side panels (36) being connected to each other and extending from the bottom cover (24) to the top cover (26), and a top recess (40) facing the top cover (26) and a bottom recess (38) facing the bottom cover (24); and at least one porous pillar (50) for transferring the liquid from the top cover (26) to the bottom cover (24), wherein the porous pillar (50) is arranged in the compartment (34) and extends from the bottom cover (24) through the bottom recess (38) and the top recess (40) to the top cover (26).

    POWER-ELECTRONIC MODULE ARRANGEMENT
    27.
    发明授权
    POWER-ELECTRONIC MODULE ARRANGEMENT 有权

    公开(公告)号：EP3196586B1

    公开(公告)日：2018-09-12

    申请号：EP17150422.8

    申请日：2017-01-05

    Applicant: ABB Schweiz AG

    Inventor： Gradinger, Thomas ,  Agostini, Bruno ,  Agostini, Francesco ,  Habert, Mathieu ,  Torresin, Daniele

    IPC: F28F13/06 ,  F28D15/02 ,  F28F1/02 ,  H05K7/20

    CPC classification number: F28F13/06 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/022 ,  H05K7/20145 ,  H05K7/20936

    Abstract: It is proposed a cooling unit (100) for a power electronic module arrangement. The cooling unit includes a two-phase heat exchanger (101) including a plurality of tube elements (120), each of which having at least one tube extending in a width direction (301) of the cooling unit, within and communicating between an evaporator portion (121) and a condenser portion (122) of the cooling unit (100). The tube elements are arranged in a spaced-apart manner along a depth direction (303) of the cooling unit forming cooling paths (213) for allowing an external cooling medium (130) to flow through the cooling paths, the cooling paths traversing the condenser portion in a length direction (302) of the cooling unit (100). The cooling unit further includes flow guides (141; 142) for forcing an external cooling medium (130) arriving at the heat exchanger through the cooling paths and then away from the cooling unit.

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