21.
    发明专利
    未知

    公开(公告)号:DE69009973D1

    公开(公告)日:1994-07-21

    申请号:DE69009973

    申请日:1990-12-24

    Applicant: GEN ELECTRIC

    Abstract: A polyimide surface is pretreated in preparation for an adhesion promotion treatment and subsequent metallization on the surface, wherein the pretreatment comprises the steps of: (A) contacting the polyimide surface with an aqueous solution of nitric acid having a concentration of about 35 to about 70% by weight or an aqueous solution of hydrochloric acid having a concentration of about 10 to about 38% by weight; (B) rinsing the acid-treated polyimide surface with water so as to substantially remove the acid from the surface of the polyimide; (C) contacting the rinsed polyimide surface with a mild etching agent, resulting in the formation of a residual film on the polyimide surface; (D) contacting the etched polyimide surface with a basic solution, and (E) removing the residual film formed on the surface of the polyimide after contact with the mild etching agent in step (C). The method of this invention allows both filled and unfilled polyimide substrates to be electroless plated in a consistent manner and provides improved adhesion between the polymer and subsequently deposited metals.

    22.
    发明专利
    未知

    公开(公告)号:DE68908488D1

    公开(公告)日:1993-09-23

    申请号:DE68908488

    申请日:1989-05-23

    Applicant: GEN ELECTRIC

    Abstract: An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.

    PHOTOVOLTAIC DEVICES
    23.
    发明专利

    公开(公告)号:AU2013216698A1

    公开(公告)日:2014-03-20

    申请号:AU2013216698

    申请日:2013-08-19

    Applicant: GEN ELECTRIC

    Abstract: Photovoltaic devices are presented. A photovoltaic device includes a window layer and a semiconductor layer including a semiconductor material disposed on window layer. The semiconductor layer includes a first region and a second region, the first region disposed proximate to the window layer, and the second region including a chalcogen-rich region, wherein the first region and the second region include a dopant, and an average atomic concentration of the dopant in the second region is greater than an average atomic concentration of the dopant in the first region. Forming a chalcogen-rich region by contacting at least a portion of the semiconductor material with a chemical agent, 31 wherein the chemical agent comprises iodine Introducing a dopant into the chalcogen-rich region ~32 Contacting at least a portion of the semiconductor material 41 with a chemical agent, wherein the chemical agent comprises iodine Contacting at least a portion of the 42 semiconductor material with copper

    24.
    发明专利
    未知

    公开(公告)号:AT342231T

    公开(公告)日:2006-11-15

    申请号:AT00950631

    申请日:2000-07-25

    Applicant: GEN ELECTRIC

    Abstract: This invention relates to a method for removing impurities from a brine solution, the brine solution comprising a water soluble chelating agent, the method comprising the steps of:a) adjusting the pH of the brine solution to a pH of from about 2 to about 4;b) passing the brine solution through a first functionalized resin; the first functionalized resin having functional groups capable of removing multivalent metal cations from the brine solution;c) adjusting the pH of the brine solution to a pH of from about 9 to about 11.5; andd) passing the brine solution through a second functionalized resin; the second functionalized resin having functional groups capable of removing alkaline earth metal cations from the brine solution.

    Telecommunications apparatus
    30.
    发明专利

    公开(公告)号:GB2270421A

    公开(公告)日:1994-03-09

    申请号:GB9317836

    申请日:1993-08-27

    Applicant: GEN ELECTRIC

    Abstract: Lightweight, distortion-resistant signal-carrying units, including feed horns, waveguides and multiplexers, particularly for satellite communication systems, comprise a body 10 of fiber-reinforced thermoplastic polymer, preferably polyetherimide or fluorinated polyimide, or cyanate ester polymer. A transmissive layer 22 is disposed on adhesion-promoted surfaces of the body. The transmissive layer comprises a primer layer of nickel deposited on the surfaces of the body and an outer, corrosion-resistant layer, preferably of silver, deposited on top of the primer layer. The outer layer may be matched with a mating component to reduce passive intermodulation.

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