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    TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED
    23.
    发明公开
    TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED 审中-公开
    传输方法，制造方法，装置和微型LED的电子装置

    公开(公告)号：EP3207572A1

    公开(公告)日：2017-08-23

    申请号：EP15886926.3

    申请日：2015-04-01

    Applicant: Goertek. Inc

    Inventor： ZOU, Quanbo ,  WANG, Zhe

    IPC: H01L33/36

    CPC classification number: H01L25/0753 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2933/0066

    Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming a micro-LED on a laser-transparent original substrate; bringing the micro-LED into contact with a pad preset on a receiving substrate; and irradiating the original substrate with laser from the original substrate side to lift-off the micro-LED from the original substrate.

    Abstract translation: 本发明公开了一种微型LED的转移方法，制造方法，装置和电子设备。 微型LED的传输方法包括：在激光透明的原始基板上形成微型LED; 使微型LED与预设在接收基板上的垫片接触; 以及从原始衬底侧用激光照射原始衬底以将微型LED从原始衬底抬起。

    MEMS DEVICE WITH VALVE MECHANISM
    24.
    发明公开
    MEMS DEVICE WITH VALVE MECHANISM 审中-公开
    具有阀机构的MEMS装置

    公开(公告)号：EP3186979A1

    公开(公告)日：2017-07-05

    申请号：EP14900342.8

    申请日：2014-08-27

    Applicant: Goertek. Inc

    Inventor： WANG, Zhe ,  ZOU, Quanbo ,  TAO, Jifang

    IPC: H04R19/04 ,  H04R1/08

    CPC classification number: H04R1/083 ,  H04R1/023 ,  H04R3/007 ,  H04R19/005 ,  H04R19/016 ,  H04R19/04 ,  H04R2201/003

    Abstract: The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.

    Abstract translation: MEMS器件（100）被提供。 MEMS装置（100）包括印刷电路板（110），附接到印刷电路板（110）以形成壳体的盖（120），形成在壳体中的至少一个音孔（112），换能器 140）以及在壳体内部的隔膜（142）以及壳体内部的至少一个活门结构（150）。 每个活门结构（150）围绕相应的音孔（112）安装到外壳。 每个活门结构（150）包括设置在壳体的内表面附近的可移动部件（156），所述可移动部件具有形成在其中的至少一个气隙和可移动部分（1563）以及具有至少一个通气孔 1521）。 可移动部件（156）连接在基板（152）和壳体之间，并且可移动部分（1563）在常规压力下保持在打开位置，使得从音孔（112）到 穿过可移动部件（156）的基板（152）的至少一个通气孔（1521）打开，并且在高外部压力下移动到第一关闭位置以阻塞至少一个通气孔（1521）并关闭空气 流动路径。

    MEMS MICROPHONE
    26.
    发明公开
    MEMS MICROPHONE 审中-公开

    公开(公告)号：EP3518558A1

    公开(公告)日：2019-07-31

    申请号：EP17832031.3

    申请日：2017-11-30

    Applicant: Goertek Inc.

    Inventor： ZOU, Quanbo ,  WANG, Zhe ,  DONG, Yongwei

    IPC: H04R19/00 ,  H04R19/04

    Abstract: The present invention discloses a MEMS microphone, which comprises a substrate, a first vibrating diaphragm and a second vibrating diaphragm. A sealed cavity is formed between the first vibrating diaphragm and the second vibrating diaphragm. A back electrode unit is located in the sealed cavity, forms a capacitor structure with the first vibrating diaphragm and with the second vibrating diaphragm respectively, and is provided with a plurality of through holes that penetrate through two sides thereof. The sealed cavity is filled with a gas whose viscosity coefficient is smaller than that of air. According to the MEMS microphone disclosed by the present invention, by filling the sealed cavity with a gas whose viscosity coefficient is smaller than that of air, the acoustic resistance when the two vibrating diaphragms move relative to the back electrode can be reduced greatly, thereby reducing the noise of the microphone. Meanwhile, by the use of a gas with a low viscosity coefficient for filling, the pressure in the sealed cavity is consistent with the pressure of an external environment, thereby avoiding the problem of vibrating diaphragm deflection caused by pressure difference and ensuring the performances of the microphone.

    TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED
    30.
    发明公开
    TRANSFERRING METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARATUS OF MICRO-LED 审中-公开

    公开(公告)号：EP3248226A1

    公开(公告)日：2017-11-29

    申请号：EP15907618.1

    申请日：2015-11-04

    Applicant: Goertek Inc.

    Inventor： ZOU, Quanbo ,  LU, Manen ,  WANG, Zhe

    IPC: H01L33/00

    Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LEDs comprises: forming a mask layer on the backside of a laser-transparent original substrate, wherein micro-LEDs are formed on the front-side of the original substrate; bringing the micro-LEDs on the original substrate in contact with preset pads on a receiving substrate; and irradiating the original substrate from the original substrate side with laser through the mask layer, to lift-off micro-LEDs from the original substrate.

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