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公开(公告)号:DE69838307T2
公开(公告)日:2008-05-21
申请号:DE69838307
申请日:1998-01-16
Applicant: IBM
Inventor: ISMAIL KAHLID EZZELDIN , MEYERSON BERNARD S
IPC: H01L29/80 , H01L29/808 , H01L21/337 , H01L29/10
Abstract: A junction field effect transistor comprises a lightly doped second semiconductor layer (16) over a first semiconductor layer of the same dopant type (14), a third semiconductor layer of opposite type (18) having an opening (24) and a dielectric layer (20) having an opening above the first opening. A fourth semiconductor layer of first type Si1-x Gex, where x increases with thickness is formed in the opening (30) and a fifth layer of first type Si1-y Gey, where y is constant with thickness, is also formed in the opening of the third layer (34). A sixth such layer of Si1-zGez, where z decreases with thickness, (38) is formed in the opening of the dielectric layer. Also claimed is a method of forming the JFET above by sequentially forming the layers and openings as above.
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公开(公告)号:ES2289768T3
公开(公告)日:2008-02-01
申请号:ES98300319
申请日:1998-01-16
Applicant: IBM
Inventor: ISMAIL KAHLID EZZELDIN , MEYERSON BERNARD S
IPC: H01L29/80 , H01L29/808 , H01L21/337 , H01L29/10
Abstract: SE DESCRIBE UN TRANSISTOR DE EFECTO DE CAMPO DE UNION (10) Y UN METODO PARA PRODUCIRLO, QUE INCORPORAN CAPAS SEMICONDUCTORAS HORIZONTALES (14, 16, 18, 30, 34, 38) EN UNA ABERTURA (24) PARA FORMAR UN CANAL (36), Y UNA CAPA SEMICONDUCTORA, A TRAVES DE LA CUAL SE PRACTICA LA ABERTURA, QUE FORMA UN ELECTRODO DE PUERTA (19) QUE RODEA EL CANAL. LAS CAPAS SEMICONDUCTORAS HORIZONTALES PUEDEN SER UNA ALEACION SIGE CON GRADIENTE DE COMPOSICION CERCA DEL EMISOR Y DEL COLECTOR. LA INVENCION SOLUCIONA EL PROBLEMA DE LA FORMACION DE JFETS DE BAJA RESISTENCIA, Y PROPORCIONA UNA LONGITUD DE PUERTA FACILMENTE ESCALABLE A DIMENSIONES INFERIORES AL MICRON PARA CIRCUITOS DE RF, MICROONDAS, MILIMETRICOS Y LOGICOS, SIN EFECTOS DE ACORTAMIENTO DEL CANAL.
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公开(公告)号:CA2062134C
公开(公告)日:1997-03-25
申请号:CA2062134
申请日:1992-03-02
Applicant: IBM
Inventor: LEGOUES FRANCOISE K , MEYERSON BERNARD S
IPC: G02B6/13 , H01L21/20 , H01L29/15 , H01L31/028 , H01L31/036 , H01L31/18 , H01S5/32 , H01S5/327 , H01L29/02 , H01S3/025 , G02B6/12 , G02B5/20 , H01S3/08
Abstract: A multi-layered structure (10) and process for forming it are described, incorporating a single crystal substrate (12), a plurality of epitaxial layers (16, 18, 22, 40, 42, 44, 48) having graded composition wherein the layers have changing lattice spacings not exceeding about 2 percent per 100,0 nm of thickness whereby misfit dislocations (54 ... 59) are formed to relieve strain and then move to the edges of respective layers. The invention overcomes the problem of large numbers of misfit dislocations threading to the surface of the top layer, especially during device processing at at temperatures in a range from 700 to 900 degrees Celsius. Fully relaxed, incommensurate structures having low defect densities are obtained, where arbitrary combinations of materials can be used.
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公开(公告)号:ES2084053T3
公开(公告)日:1996-05-01
申请号:ES91105949
申请日:1991-04-15
Applicant: IBM
Inventor: MEYERSON BERNARD S
IPC: H01L21/205 , H01L21/22 , H01L21/331 , H01L29/73 , H01L29/737
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公开(公告)号:AT135139T
公开(公告)日:1996-03-15
申请号:AT91105949
申请日:1991-04-15
Applicant: IBM
Inventor: MEYERSON BERNARD S
IPC: H01L21/205 , H01L21/22 , H01L21/331 , H01L29/73 , H01L29/737
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公开(公告)号:DE68909977T2
公开(公告)日:1994-05-05
申请号:DE68909977
申请日:1989-01-27
Applicant: IBM
Inventor: BRODSKY MARC H , FANG FRANK F , MEYERSON BERNARD S
IPC: H01L29/73 , H01L21/331 , H01L29/10 , H01L29/15 , H01L29/161 , H01L29/201 , H01L29/737 , H01L29/14
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公开(公告)号:CA2055801A1
公开(公告)日:1992-06-18
申请号:CA2055801
申请日:1991-11-19
Applicant: IBM
Inventor: GRILL ALFRED , HORNG CHENG T , MEYERSON BERNARD S , PATEL VISHNUBHAI V , RUSSAK MICHAEL A
Abstract: A magnetic head slider having a protective coating on the rails thereof, the protective coating comprising a thin adhesion layer and a thin layer of amorphous hydrogenated carbon. The protective coating is deposited on the air bearing surface of the slider after the thin film magnetic heads are lapped to a chosen dimension, but before the pattern of rails is produced on the air bearing surface. The protective coating protects the magnetic head during the rail fabrication process and in usage in a magnetic recording system protects the magnetic head from wear and corrosion damage.
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