公开(公告)号：DE10005494A1

公开(公告)日：2001-08-16

申请号：DE10005494

申请日：2000-02-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  BAUER MONIKA

IPC: H01L23/31 ,  H01L23/50 ,  H01L21/60

Abstract: An electronic component (1) comprises a semiconductor chip (3) having integrated circuits and metallic contact surfaces (2); and a housing (4) from which contact humps (7) protrude. The humps are connected to the contact surfaces of the chip via a layer (5) with metallic conducting pathways. The pathways are formed together with the contact humps as one-piece integral component (8) made from a pre-finished metallic foil. An independent claim is also included for the production of an electronic component comprising forming a metallic foil with contact humps as a one-piece integral component; producing a self-supporting support layer (10) with openings for the humps and through-holes (27); connecting the foil to the humps and the support layer to form a composite part; structuring the foil to form a conducting path pattern; and connecting the conducting pathways to the contact surfaces of the chip in the region of the through-holes of the support layer.

公开(公告)号：DE10139985B4

公开(公告)日：2005-10-27

申请号：DE10139985

申请日：2001-08-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN

IPC: H01L23/498 ,  H01L23/528 ,  H01L23/50 ,  H01L21/60

Abstract: The invention relates to an electronic component with a semiconductor chip and a rewiring plate including a bond channel for bond connections between contact surfaces of the semiconductor chip and contact terminal pads on the rewiring plate. The contact surfaces extend in two parallel rows in a first portion and in one row in at least one other portion. A method for fabricating the inventive electronic component is also described.

公开(公告)号：DE10139985A1

公开(公告)日：2003-03-13

申请号：DE10139985

申请日：2001-08-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN

IPC: H01L23/498 ,  H01L23/528 ,  H01L23/50 ,  H01L21/60

Abstract: The invention relates to an electronic component with a semiconductor chip and a rewiring plate including a bond channel for bond connections between contact surfaces of the semiconductor chip and contact terminal pads on the rewiring plate. The contact surfaces extend in two parallel rows in a first portion and in one row in at least one other portion. A method for fabricating the inventive electronic component is also described.

公开(公告)号：DE10116069C2

公开(公告)日：2003-02-20

申请号：DE10116069

申请日：2001-04-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  REIS MARTIN

IPC: H01L23/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H01L21/56

Abstract: The electronic component has a semiconductor chip mounted to a wiring board. The chip is bonded to the wiring board with adhesive strips that leave free a through-cutout, an additional cutout, and separating joints. The additional cutout provides for a plastic reservoir from which the separating joint between the adhesive strips is filled with plastic material.

公开(公告)号：DE10152694A1

公开(公告)日：2003-01-02

申请号：DE10152694

申请日：2001-10-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  WINDERL JOHANN

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/32 ,  H01L23/50 ,  H01L23/28

Abstract: Electronic component comprises a semiconductor chip (4) mounted on a wiring plate (6) and electrically connected to it; and a plastic housing (14) partially surrounding the plate. At least the chip is partially surrounded on all sides by a pressing composition of the plastic housing. An Independent claim is also included for a process for the production of the electronic component.

公开(公告)号：DE10023823A1

公开(公告)日：2001-12-06

申请号：DE10023823

申请日：2000-05-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： NEUMAYER MARTIN ,  HAUSER CHRISTIAN ,  WENNEMUTH INGO

IPC: H01L25/065 ,  H01L23/50 ,  H01L23/053

Abstract: The multi-chip housing device has a carrier (12) provided with at least one terminal surface (50,60) and at least 2 chip components (2,3) supported by the carrier one on top of the other, each having at least one electrical contact with the terminal surface or with the other chip component. The lowermost chip component has one main surface provided with at least one contact (10) facing towards the carrier and coupled via a bonding wire (5) passed through an opening in the carrier to a terminal surface on the opposite side of the carrier.

公开(公告)号：DE10153211A1

公开(公告)日：2003-01-30

申请号：DE10153211

申请日：2001-10-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN

IPC: H01L23/13 ,  H01L23/24 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/485 ,  H01L21/60

Abstract: Electronic component comprises a semiconductor chip (2) and a wiring plate (3). The surface of the wiring plate is connected to the active surface (5) of the chip using a double-sided adhering film (6). Electronic component comprises a semiconductor chip (2) and a wiring plate (3). The surface of the wiring plate is connected to the active surface (5) of the chip using a double-sided adhering film (6). The wiring plate has a metal layer (9) structured in wiring lines (8) on its lower side (7). Each wiring line has a bond end (10) and an outer contact surface (11). Each wiring line has a solder stop surface (12) on its transition to the bond end and/or on its transition to the outer contact surface. Independent claims are also included for the following: (1) a system support for several electronic components; a process for the production of the system support; and (2) a process for the production of the electronic component.

公开(公告)号：DE10127010A1

公开(公告)日：2002-12-12

申请号：DE10127010

申请日：2001-06-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN

IPC: H01L23/34 ,  H01L23/498 ,  H01L23/13 ,  H01L23/50

Abstract: An electronic component with contact surfaces (3) in the region of a bond channel (5) or in bond surfaces in bonding pads and with a substrate (6) glued via an adhesive layer (14) on to the active chip surface, for wiring of the contact connection surfaces, and conductor paths (8), solder contact surfaces (9) and a solder stop layer (12), in which the substrate is provided with expansion joints (15) An Independent claim is given for a method of manufacturing an electronic component.

公开(公告)号：DE10116069A1

公开(公告)日：2002-10-17

申请号：DE10116069

申请日：2001-04-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  REIS MARTIN

IPC: H01L23/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50

Abstract: The electronic component has a semiconductor chip mounted to a wiring board. The chip is bonded to the wiring board with adhesive strips that leave free a through-cutout, an additional cutout, and separating joints. The additional cutout provides for a plastic reservoir from which the separating joint between the adhesive strips is filled with plastic material.

公开(公告)号：DE10049288A1

公开(公告)日：2002-04-18

申请号：DE10049288

申请日：2000-10-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HAUSER CHRISTIAN ,  WINDERL JOHANN ,  REIS MARTIN

IPC: H01L23/057 ,  H01L23/08 ,  H01L23/31 ,  H01L23/50