公开(公告)号：DE10014304B4

公开(公告)日：2007-08-02

申请号：DE10014304

申请日：2000-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  WINDERL JOHANN ,  NEU ACHIM ,  HAUSER CHRISTIAN ,  NEUMAYER MARTIN

IPC: H01L23/31 ,  H01L23/50

Abstract: A semiconductor component includes a semiconductor chip having contact pads on its main face, and a wiring foil, in which are recesses for the contact pads, applied to the main face. The foil has conductor tracks on a side facing away from the main side. The conductor tracks connect the contact pads to solder contacts. The contact pads located in the recess are electrically connected via wire connections to adjacent conductor track ends. Each wire connection is surrounded with a sealing compound of a first and a second layer. A method for manufacturing a semiconductor component includes applying wiring foil to a main side of the chip, producing the wire connection between contact pads and adjacent conductor track ends, applying sealing compound to locations on the recess to completely cover the wire connection with the sealing compound, and only curing the surface of the sealing compound.

公开(公告)号：DE10014304A1

公开(公告)日：2001-10-04

申请号：DE10014304

申请日：2000-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： REIS MARTIN ,  WINDERL JOHANN ,  NEU ACHIM ,  HAUSER CHRISTIAN ,  NEUMAYER MARTIN

IPC: H01L23/31

Abstract: The wire bonding to contact pads (2) in a recess (9) in a semiconductor element (1) is sealed in a two stage filling process in which two separate layers (15,16) are formed. A semiconductor element comprises chip recessed contact pads (2) electrically bonded to neighboring conductor (6) by wiring foil and having a recessed solder connection (17). Each wire bonding is covered with a sealer filler (14), which comprises both first (15) and second (16) layers. An Independent claim also included for a method of production of the above comprising completely covering the wire bonding with the sealant.

公开(公告)号：DE10107399A1

公开(公告)日：2002-09-12

申请号：DE10107399

申请日：2001-02-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WINDERL JOHANN ,  NEUMAYER MARTIN

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/28 ,  H01L23/50 ,  H01L21/56 ,  H01L21/301

Abstract: Device comprises: an electronic component; a mechanically and electrically connected wiring plate (4) with contact connections (6); and a flexible layer around the peripheral edges of the rear side (21) of the electronic component facing away from the wiring plate. An Independent claim is also included for a process for the production of the device. Preferred Features: The flexible layer is fixed to the edge of the wiring plate protruding over the electronic component. The layer has a recess (12) which exposes the rear side of the electronic component up to a peripheral edge along the edge of the rear side.

公开(公告)号：DE10206661A1

公开(公告)日：2002-09-26

申请号：DE10206661

申请日：2002-02-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WINDERL JOHANN ,  NEUMAYER MARTIN

IPC: H01L21/68 ,  H01L23/31 ,  H01L29/06 ,  H01L23/04

Abstract: Electronic component (1) comprises a semiconductor chip (2) having an active upper side (3) and a passive rear side (4) and surrounded by a sawn edge (5). The edge has contours (6) profile-sawn from semiconductor material and surrounded by a plastic composition (8) forming a plastic edge (7). The plastic composition engages in a form-locking manner with the profile-sawn contours. An Independent claim is also included for a process for manufacturing the above electronic component.

公开(公告)号：DE10023823A1

公开(公告)日：2001-12-06

申请号：DE10023823

申请日：2000-05-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： NEUMAYER MARTIN ,  HAUSER CHRISTIAN ,  WENNEMUTH INGO

IPC: H01L25/065 ,  H01L23/50 ,  H01L23/053

Abstract: The multi-chip housing device has a carrier (12) provided with at least one terminal surface (50,60) and at least 2 chip components (2,3) supported by the carrier one on top of the other, each having at least one electrical contact with the terminal surface or with the other chip component. The lowermost chip component has one main surface provided with at least one contact (10) facing towards the carrier and coupled via a bonding wire (5) passed through an opening in the carrier to a terminal surface on the opposite side of the carrier.