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    Merged-mask micro-machining process
    23.
    发明专利
    Merged-mask micro-machining process 未知

    公开(公告)号：AU5932700A

    公开(公告)日：2001-01-30

    申请号：AU5932700

    申请日：2000-07-13

    Applicant: INPUT/OUTPUT INC

    Inventor： YU LIANZHONG ,  RIED ROBERT P ,  GOLDBERG HOWARD D ,  YU DULI

    IPC: G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224 ,  G01P15/135 ,  G02B26/00 ,  C23F1/00 ,  G03F7/26

    Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

    MERGED-MASK MICRO-MACHINING PROCESS
    24.
    发明公开
    MERGED-MASK MICRO-MACHINING PROCESS 有权
    麻醉师HERSTELLUNGSVERFAHREN MITüBERBLENDETENMASKEN

    公开(公告)号：EP1196788A4

    公开(公告)日：2003-01-15

    申请号：EP00945370

    申请日：2000-07-13

    Applicant: INPUT OUTPUT INC

    Inventor： YU LIANZHONG ,  RIED ROBERT P ,  GOLDBERG HOWARD D ,  YU DULI

    IPC: G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  C23F1/00 ,  G01P15/135 ,  G02B26/00 ,  G03F7/00 ,  G03F7/26

    CPC classification number: G02B26/0816 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/0109 ,  C23F1/02

    Abstract: The present invention provides merged-mask processes for fabricating micro-machined devices in general and mirrored assemblies for use in optical scanning devices in particular. The process includes (a) providing a substrate having a predetermined thickness; (b) applying a first masking layer on a first portion of the substrate and a second masking layer on a second portion of the substrate, said second masking layer being at least as thick as the first masking layer; (c) etching a portion of the second masking layer to provide a first exposed portion of the substrate; (d) etching the first exposed portion of the substrate to a first depth; (e) etching the second masking layer to provide a second exposed portion of the substrate; and (f) etching simultaneously the first exposed portion of the substrate to a second depth and the second exposed portion of the substrate to a first depth. The process further comprises patterning the first masking layer before applying the second masking layer to provide the second portion of the substrate for etching and etching the first masking layer to expose the second portion of the substrate. The first and second masking layers are applied prior to etching the substrate.

    Abstract translation: 本发明提供了用于一般地制造微机械装置和特别是用于光学扫描装置的镜面组件的合并掩模工艺。 一种制造三维结构的方法，包括：提供衬底，将第一掩蔽材料层施加到所述衬底上，将第二掩蔽材料层施加到所述第一掩模材料的所述层上，将所述第二掩模材料的所述层 掩模材料，将第三掩模材料层施加到未被第二掩模材料的图案化层覆盖的部分上，第三掩模材料的层至少与第一和第二掩模材料的层的组合厚度一样厚 掩模材料，图案化第一和第三掩模材料的层，蚀刻衬底的暴露部分，蚀刻第一和第三掩模材料的层的暴露部分并蚀刻衬底的暴露部分。

    MERGED-MASK MICRO-MACHINING PROCESS
    25.
    发明专利
    MERGED-MASK MICRO-MACHINING PROCESS 未知

    公开(公告)号：CA2378725C

    公开(公告)日：2012-09-04

    申请号：CA2378725

    申请日：2000-07-13

    Applicant: INPUT OUTPUT INC

    Inventor： YU LIANZHONG ,  RIED ROBERT P ,  GOLDBERG HOWARD D ,  YU DULI

    IPC: C23F1/00 ,  G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G01P15/135 ,  G02B26/00 ,  G02B26/08 ,  G03F7/20 ,  G03F7/26 ,  G06V30/224

    Abstract: The present invention provides merged-mask processes for fabricating micro-machined devices in general and mirrored assemblies for use in optical scanning devices in particular. The process includes (a) providing a substrate having a predetermined thickness; (b) applying a first masking layer on a first portion of the substrate and a second masking layer on a second portion of the substrate, said second masking layer being at least as thick as the first masking layer; (c) etching a portion of the second masking layer to provide a first exposed portion of the substrate; (d) etching the first exposed portion of the substrate to a first depth; (e) etching the second masking layer to provide a second exposed portion of the substrate; and (f) etching simultaneously the first exposed portion of the substrate to a second depth and the second exposed portion of the substrate to a first depth. The process further comprises patterning the first masking layer before applying the second masking layer to provide the second portion of the substrate for etching and etching the first masking layer to expose the second portion of the substrate. The first and second masking layers are applied prior to etching the substrate.

    27.
    发明专利
    未知

    公开(公告)号：NO20026151D0

    公开(公告)日：2002-12-20

    申请号：NO20026151

    申请日：2002-12-20

    Applicant: INPUT OUTPUT INC

    Inventor： SELVAKUMAR ARJUN ,  YU DULI ,  YU LIANZHONG ,  JONES BEN W

    IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  G01V1/18 ,  G01P

    Abstract: An accelerometer comprising a measuring mass (1405) for detecting acceleration, including a housing having a cavity, one or more spring mass assemblies (1400) positioned within the cavity, wherein each spring mass assembly (1400) includes a support structure (1410), including one or more resilient folded beams (1415a-1415d) coupled to the support structure (1410) and the measuring mass (1405) is coupled to the resilient folded beams (1415a-1415d), wherein one or more electrode patterns are coupled to the spring mass assembly (1400), wherein a top cap wafer, including a top capacitor electrode, is coupled to the measurement mass (1405), and a bottom cap wafer, including a bottom capacitor electrode, is also coupled to measurement mass (1405). The folded beams include circular cutouts so as to provide stress relief at connections between foot and leg positions of each folded beam.

    30.
    发明专利
    未知

    公开(公告)号：NO20020139L

    公开(公告)日：2002-03-12

    申请号：NO20020139

    申请日：2002-01-11

    Applicant: INPUT OUTPUT INC

    Inventor： YU DULI ,  YU LIANZHONG ,  GOLDBERG HOWARD D ,  RIED ROBERT P

    IPC: B81B3/00 ,  G02B26/10 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  G06V30/224 ,  G01P

    Abstract: The present invention provides merged-mask processes for fabricating micromachined devices in general and mirrored assemblies for use in optical scanning devices in particular. A method of fabricating a three dimensional structure, comprising, providing a substrate, applying a layer of a first masking material onto the substrate, applying a layer of a second masking material onto the layer of the first masking material, patterning the layer of the second masking material, applying a layer of a third masking material onto the portions not covered by the patterned layer of the second masking material, the layer of the third masking material is at least as thick as the combined thickness of the layers of the first and second masking materials, patterning the layers of the first and third masking materials, etching the exposed portions of the substrate, etching the exposed portions of the layers of the first and third masking materials and etching the exposed portions of the substrate.

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