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    RADIATION SENSITIVE REFRACTIVE INDEX CHANGING COMPOSITION
    25.
    发明专利
    RADIATION SENSITIVE REFRACTIVE INDEX CHANGING COMPOSITION 未知

    公开(公告)号：CA2406219A1

    公开(公告)日：2002-10-15

    申请号：CA2406219

    申请日：2002-02-18

    Applicant: JSR CORP

    Inventor： KUMANO ATSUSHI ,  BESSHO NOBUO ,  YAMADA KENJI ,  NISHIMURA ISAO

    IPC: G02B5/18 ,  G03F7/00 ,  G03F7/004 ,  G03F7/039 ,  G03F7/075 ,  C08L101/00 ,  G02B3/00 ,  G02B6/00 ,  G02B5/02 ,  G02B6/12

    Abstract: A radiation-sensitive composition capable of having a refractive index distribution which comprises (A) a decomposable compound, (B) a non- decomposable component containing inorganic oxide particles and (C) a radiation-sensitive decomposing agent; and a method for forming a refractive index pattern or an optical material which comprises irradiating the above composition with a radiation and then treating the resulting product with (D ) a stabilizer. The method allows the preparation, with ease and simplicity, o f a refractive index pattern or an optical material having a refractive index distribution including satisfactorily great refractive index change and bein g stable independently of the conditions wherein it is used.

    RADIATION-SENSITIVE COMPOSITION CHANGING IN REFRACTIVE INDEX AND UTILIZATION THEREOF
    27.
    发明公开
    RADIATION-SENSITIVE COMPOSITION CHANGING IN REFRACTIVE INDEX AND UTILIZATION THEREOF 审中-公开
    UNG UNG UNG ICH UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG

    公开(公告)号：EP1375597A4

    公开(公告)日：2004-05-26

    申请号：EP02703943

    申请日：2002-03-08

    Applicant: JSR CORP

    Inventor： NISHIMURA ISAO ,  BESSHO NOBUO ,  KUMANO ATSUSHI ,  YAMADA KENJI

    IPC: G02B1/04 ,  G03F7/00 ,  G03F7/004 ,  G03F7/039 ,  G03F7/075 ,  C08L101/00 ,  C08L101/12 ,  G03F7/09

    CPC classification number: G03F7/039 ,  G02B1/04 ,  G02B6/02033 ,  G03F7/001 ,  G03F7/0042 ,  G03F7/0043 ,  G03F7/0757 ,  C08L85/00 ,  C08L83/04

    Abstract: A composition whose refractive index of a material is changed by a simple method, which can have a sufficiently large refractive index difference, and which provides a stable refractive index pattern and an optical material irrespective of their use conditions and a method for forming the refractive index pattern and the optical material. The above composition comprises (A) a decomposable compound, (B) a hydrolyzate of an alkoxide such as tetrabutoxytitanium, tetramethoxyzirconium, tetramethoxygermanium or tetramethoxysilane, or a halogen compound such as tetrachlorosilane and (C) a radiation sensitive decomposer and is sensitive to radiation.

    Abstract translation: 可以通过简单的方法改变材料的折射率的组合物，其可以具有足够大的折射率差，并且不管其使用条件如何，提供稳定的折射率图案和光学材料，以及形成折射率的方法 图案和光学材料。 上述组合物包含（A）可分解化合物，（B）四丁氧基钛，四甲氧基锆，四甲氧基锗或四甲氧基硅烷等醇盐的水解产物或四氯硅烷等卤素化合物，（C）辐射敏感性分解剂， 对辐射敏感。

    Wafer fixing pellet and wafer processing method using the same
    30.
    发明专利
    Wafer fixing pellet and wafer processing method using the same 审中-公开
    WAFER固定片和使用其的WAFER处理方法

    公开(公告)号：JP2003347253A

    公开(公告)日：2003-12-05

    申请号：JP2002157059

    申请日：2002-05-30

    Applicant: Jsr Corp ,  Jsr株式会社

    Inventor： BESSHO NOBUO ,  HANAMURA MASAAKI ,  YOKOYAMA YASUAKI

    IPC: B24B37/30 ,  H01L21/301 ,  H01L21/304 ,  B24B37/04

    Abstract: PROBLEM TO BE SOLVED: To provide wafer fixing pellets and a semiconductor wafer processing method using the same wherein a semiconductor wafer is brought into close contact with a base such as a hard plate, an elastic carrier (packing material), or a wafer and fixed so as to be held when the wafer is processed, the wafer as a work is easily separated, a fixing agent layer attached to the wafer is easily removed, the wafer is easily cleaned, and the wafer as the work is kept free from contamination. SOLUTION: The wafer fixing pellets contain liquid crystal compounds. The pellets interposed between the semiconductor wafer and the base where the wafer is fixed are heated to be melted, and the wafer and the base are brought into close contact with each other and fixed with each other. After the exposed surface of the wafer is subjected to processing, the wafer is separated from the base and cleaned. COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：为了提供使用其的晶片固定片和半导体晶片处理方法，其中半导体晶片与诸如硬板，弹性载体（包装材料）等的基底紧密接触，或 晶片固定，以便在晶片被处理时被保持，作为工件的晶片容易分离，容易除去附着在晶片上的固定剂层，晶片容易清洁，并且作为工件的晶片保持释放 从污染。 解决方案：晶片固定颗粒含有液晶化合物。 插入在半导体晶片和晶片固定的基板之间的芯片被加热熔化，使晶片和基座彼此紧密接触并彼此固定。 在对晶片的暴露表面进行处理之后，将晶片与基底分离并清洁。 版权所有（C）2004，JPO

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