Abstract:
A connector assembly is provided with opposing and interengageable first and second connector components. Each of the two components has internal cavities that contain terminal assemblies of either plug or receptacle structure and may further include either a plurality of power terminals or differential signal terminals. The terminals have contact portions, tail portions and interconnecting portions that are partially encapsulated by an insulative outer support frames. The shell forms a wafer and two such wafers are combined together to form a terminal assembly. The terminal assemblies are identical in shape, other than for an engagement means that serves to hold two subframes together as a single assembly.
Abstract:
An angular coaxial connector module (12) is provided for installation on a printed circuit board. The module includes at least a pair of angled coaxial conductors (28,30) each including first and second legs (32,34) joined at an elbow (36). The distal end (32a) of each first leg (32) defines a contact end of the respective conductor. The distal end (34a) of each second leg (34) defines a terminal end for attachment to the printed circuit board. A dielectric sheath (26) is disposed about each angled coaxial conductor leaving the distal ends thereof exposed. A tubular conductive shield (14,38) is provided about each dielectric sheath. A grounding means (18,60) couples the shields to the printed circuit board. A unitary dielectric housing (16) is disposed about at least portions (38) of the shields (14,38) to hold the connector in a module.
Abstract:
A SIMM socket with a metal latch (120) for retaining a SIMM therein is provided. The socket includes a housing (160) having a SIMM receiving slot (166) and a plurality of terminals (30) with contact beams extending into the slot. The SIMM is inserted into the slot in a first angular alignment with minimal insertion forces, and is rotted into a second alignment for achieving high quality electrical connection with the contact beams of the respective terminals. A metal latch (120) is provided for releasably retaining the SIMM in the preferred angular alignment within the socket. The latch is stamped and formed from a unitary piece of metallic material and includes a housing engaging portion (122) mounted around a mounting post (174) of the housing and a deflectable SIMM engaging portion (130). The housing includes walls for controlling the types and ranges of deflection that are permitted for the SIMM engaging portion.
Abstract:
A connector is provided that includes a housing and the housing supports a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground terminals that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.
Abstract:
An electrical connector includes a dielectric housing having a mating face, a plurality of openings therein configured as pairs of aligned openings and a receptacle for receiving a plurality of internal modules therein. A plurality of electrically conductive contacts are positioned within the housing with a portion of each contact extending into one of the openings for engaging contacts of a mateable connector. At least one conductive inter-module shield is located within the receptacle and extends generally towards the mating face to define a plurality of module receiving cavities.
Abstract:
A connector and circuit board assembly includes terminals in a connector that are mounted to vias in a circuit board. Signal and ground terminals are thus coupled to signal traces and ground planes in the circuit board. Additional pinning vias that are aligned with the ground vias may be provided in a circuit board to help improve electrical performance at the interface between the terminals in the connector and the signal traces in the circuit board. A signal collar may allow pairs of signal traces to be split and routed around two difference sides of a via before rejoining while maintaining close electrical proximity that provides for relatively consistent electrical coupling between the traces in the pair of signal traces.
Abstract:
A circuit board (400, 600, 800) design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias (402, 551) in a circuit board are surrounded by an opening (410) that is formed within a ground plane (405, 590) disposed on another layer of the circuit board. The vias are connected to traces (552, 612) on the circuit board by way of an exit structure (550, 620) that includes two flag portions (555, 623) and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces(806) that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip (815) disposed on another layer of the circuit board in a triangular pattern when viewed in section.
Abstract:
A circuit board (400, 600, 800) design is disclosed that is useful in high- speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias (402,551) in a circuit board are surrounded by an opening (410) that is formed within a ground plane (405, 590) disposed on another layer of the circuit board. The vias are connected to traces (552, 612) on the circuit board by way of an exit structure (550,620) that includes two flag portions (555, 623) and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces (806) that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip (815) disposed on another layer of the circuit board in a triangular pattern when viewed in section.