公开(公告)号：US20190064364A1

公开(公告)日：2019-02-28

申请号：US16046764

申请日：2018-07-26

Applicant: Motion Engine, Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01S17/93 ,  G01S7/486 ,  G05D1/02

Abstract: Systems and methods are provided for determining the position of sensor elements in a sensor system. The sensor system includes a plurality of sensor elements. The platform comprises a plurality of MEMS IMUs, each associated with one of the sensor elements, measuring the acceleration and angular rate of the sensor elements. A controller determines the position and attitude of the sensor elements, based on the acceleration and angular rate measured by each of the MEMS IMUs.

公开(公告)号：US20160320426A1

公开(公告)日：2016-11-03

申请号：US15206935

申请日：2016-07-11

Applicant: Motion Engine, Inc.

Inventor： Robert Mark Boysel ,  Louis Ross

IPC: G01P15/18 ,  G01P15/125 ,  B81B7/00

CPC classification number: B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/00238 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  H01L2224/16145

Abstract: The present invention provides a 3D System (“3DS”) MEMS architecture that enables the integration of MEMS devices with IC chips to form a System on Chip (SoC) or System in Package (SiP). The integrated MEMS system comprises at least one MEMS chip, including MEMS transducers, and at least one IC chip, including not only MEMS processing circuitry, but also additional/auxiliary circuitry to process auxiliary signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducers and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct auxiliary signals, such as power, RF, I/Os, to the IC chip, to be processed the additional circuitry.

Abstract translation: 本发明提供了一种3D系统（“3DS”）MEMS架构，其能够将MEMS器件与IC芯片集成以形成片上系统（SoC）或系统级封装（SiP）。 集成MEMS系统包括至少一个MEMS芯片，包括MEMS换能器，以及至少一个IC芯片，不仅包括MEMS处理电路，还包括用于处理辅助信号的附加/辅助电路。 MEMS芯片可以包括第一和第二绝缘导电路径。 第一路通过传感器和IC芯片之间的MEMS信号进行处理; 并且第二导电路径可以延伸穿过MEMS芯片的整个厚度，以将辅助信号（例如功率，RF，I / O）传送到IC芯片，以便处理附加电路。

公开(公告)号：US20160229684A1

公开(公告)日：2016-08-11

申请号：US15024704

申请日：2014-09-23

Applicant: MOTION ENGINE INC.

Inventor： Robert Mark Boysel

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0078 ,  B81B7/0058 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0163 ,  B81B2207/092 ,  B81C1/00269 ,  B81C2201/013 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/125

Abstract: A micro-electro-mechanical system (MEMS) device and a manufacturing method are provided. The device includes top and bottom cap wafers and a MEMS wafer disposed between the top cap wafer and the bottom cap wafer. The top, bottom and MEMS wafers define sidewalls of a cavity. A MEMS structure is housed within the cavity and is movable relative to the top and bottom caps. At least one electrode is provided in one of the wafers, the electrode being operatively coupled to the MEMS structure to detect or induce a movement thereof. A support structure extends through the cavity from the top cap wafer to the bottom cap wafer to prevent bowing in the top cap and bottom cap wafers.

Abstract translation: 提供了一种微电子机械系统（MEMS）装置和制造方法。 该装置包括顶盖和底盖晶片以及设置在顶盖晶片和底盖晶片之间的MEMS晶片。 顶部，底部和MEMS晶片限定空腔的侧壁。 MEMS结构容纳在腔内并且可相对于顶盖和底盖移动。 在一个晶片中提供至少一个电极，电极可操作地耦合到MEMS结构以检测或引起其移动。 支撑结构通过空腔从顶盖晶片延伸到底盖晶片，以防止在顶盖和底盖晶片中弯曲。