公开(公告)号：WO1994021009A1

公开(公告)日：1994-09-15

申请号：PCT/US1994001829

申请日：1994-02-28

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  MONIE, Wayne, G. ,  RAFFLES, Scott, J. ,  RICHIE, Benjamin, L., Jr. ,  WOODLEY, Joseph, V.

IPC: H01R33/95

CPC classification number: B60R16/0239 ,  H01H85/20 ,  H01H85/2035 ,  H01H2085/0275 ,  H01H2085/208 ,  H01R13/113

Abstract: A planar fuse panel (10) is presented. A multiplicity of circuits may be included in the planar fuse panel depending on the number of circuits desired. The circuits may have any suitable planar shape. In a preferred embodiment, each circuit has an overall rectangular shape with a first portion consisting of an "L" shaped element (13) and a second portion comprising a rectangular shaped element (15) located in the shoulder of the first element. Spaces (17) are formed bridging the two portions of each circuit with bent tabs (22, 24) extending into each space to frictionally engage a blade-type terminal from a fuse or the like. The conductive metal is appropriately finished and/or plated and then insulative layers (30, 32), such as polyester or polyimide film, are applied (e.g., laminated) to both surfaces of the metal in sheet form.

Abstract translation: 提出了一种平面保险丝面板（10）。 根据所期望的电路的数量，平面保险丝面板中可以包括多个电路。 电路可以具有任何合适的平面形状。 在优选实施例中，每个电路具有总体矩形形状，其中第一部分由“L”形元件（13）组成，第二部分包括位于第一元件的肩部中的矩形元件（15）。 形成了跨越每个电路的两部分的空间（17），其中弯曲的突片（22,24）延伸到每个空间中，从而将熔断器等与叶片式端子摩擦接合。 导电金属被适当地完成和/或镀覆，然后将绝缘层（30,32）（例如聚酯或聚酰亚胺膜）施加（例如层压）到片状金属的两个表面。

公开(公告)号：WO1990014751A1

公开(公告)日：1990-11-29

申请号：PCT/US1990002258

申请日：1990-04-25

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  NELSON, Gregory, H. ,  LEBOW, Sanford ,  NOGAVICH, Eugene

IPC: H05K03/00

CPC classification number: H05K3/4673 ,  H01L23/142 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/0035 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09918 ,  H05K2203/0152 ,  H05K2203/0726 ,  Y10S428/901 ,  Y10T29/49121 ,  Y10T428/24273 ,  Y10T428/24917 ,  H01L2924/00

Abstract: An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has two layers of circuitry, one for signal transmission (16) and one for voltage plane (20A). The interconnect device is made by a processing on a stainless steel carrier plate (10) to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias (22) between signal and voltage (power or ground) plane layers (16, 20A).

公开(公告)号：WO1989007845A1

公开(公告)日：1989-08-24

申请号：PCT/US1989000554

申请日：1989-02-10

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  OWENS, Mark, J. ,  SIMPSON, Scott, S.

IPC: H01R09/09

CPC classification number: H05K7/1061 ,  H01R12/714

Abstract: An electrical connector system for electrically connecting an integrated circuit chip unit (10) having a plurality of arrays of first contacts arranged in a first pattern with a circuit board (12) having a plurality of arrays of second contact pads arranged in a second pattern. The system includes a member (22) adapted to support the integrated circuit chip unit over the circuit board, a plurality of rigid contact carriers (24), and a plurality of multi-conductor flexible circuits (14, 16) extending between portions of the first and second patterns. Each flexible circuit has one end of its conductors on the module member for electrical connection to contacts of the integrated circuit chip unit (10) and the other end of each flexible circuit secured to a corresponding contact carrier (24) with contact pads at those other conductor ends for electrical connection to contact pads of the circuit board. A clamping device (18) causes movement of the contact carriers inwardly on the circuit board to produce wiping.

公开(公告)号：WO1989005570A1

公开(公告)日：1989-06-15

申请号：PCT/US1988004318

申请日：1988-12-02

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  HERNANDEZ, Jorge, M.

IPC: H05K01/18

CPC classification number: H05K1/141 ,  H05K1/0231 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/10727 ,  H05K2203/1572

Abstract: A socket (10, 40, 70, 100) for a leadless ceramic chip carrier (34, 66, 96) comprised of a ceramic material which is preferably substantially identical to the ceramic material composing the leadless chip carrier (34, 66, 96) (typically alumina). The use of the ceramic socket (10, 40, 70, 100) of the present invention provides an essentially exact match between the coefficients of thermal expansion of the chip carrier (34, 66, 96) and the socket and thereby eliminates the problems of the prior art regarding catastrophic failure of the solder joints. Another important feature of the novel leadless chip carrier socket (10, 40, 70, 100) of the present invention (in addition to its ceramic composition) is the incorporation of the decoupling function in the ceramic socket itself. As a result, undesirable lead inductance (present in prior art plastic molded sockets) is reduced as well as more efficient (relative to conventional decoupling schemes) utilization of printed wiring board (36, 68, 98, 106) ''real estate''.

Abstract translation: 一种用于无引线陶瓷芯片载体（34,66,96）的插座（10,40,70,100），其由优选与组成无引线芯片载体（34,66,96）的陶瓷材料基本相同的陶瓷材料组成， （通常为氧化铝）。 本发明的陶瓷插座（10,40,70,100）的使用提供了芯片载体（34,66,96）与插座之间的热膨胀系数之间的基本精确匹配，从而消除了 关于焊点的灾难性故障的现有技术。 本发明的新型无引线芯片载体插座（10,40,70,100）（除了其陶瓷组合物之外）的另一个重要特征是在陶瓷插座本身中并入解耦功能。 结果，不利的引线电感（存在于现有技术的塑料模制插座中）被降低，并且更有效（相对于传统的去耦方案），印刷电路板（36,68,98,106）的“不动产” 。

公开(公告)号：WO1985003596A1

公开(公告)日：1985-08-15

申请号：PCT/US1985000183

申请日：1985-02-04

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  HARPER, William, P. ,  LUNT, Michael, S.

IPC: H01J01/62

CPC classification number: H05B33/12 ,  H05B33/10 ,  H05B33/20 ,  H05B33/28

Abstract: It is discovered that a liquid dispersion of polymer powder particles, predominantly of polyvinylidene fluoride, simultaneously: (a) can suspend electrical property additives, such as crystalline, hard, dense particles of generally spherical shape, uniformly in desired concentrations; (b) while containing a useful concentration of any of a wide range of such particles, can be deposited by high shear transfer to a substrate in accurately controllable thickness and contour; (c) when so deposited can be fused into a continuous uniform film which has low absorptivity, e.g., of moisture, and acts as a barrier film; (d) where desired, can, as one layer, be fused with other such layers, containing other electrical property additives, to form a monolithic electrical component; and, (e) in general, can meet all requirements for the making of any useful electrical circuit components, including electroluminescent lamps, by printing and coating techniques with a high degree of accuracy and controllability.

Abstract translation: 发现主要是聚​​偏二氟乙烯的聚合物粉末颗粒的液体分散体同时地：（a）可以均匀地悬浮具有所需浓度的一般为球形的结晶，硬质致密颗粒等电性能添加剂; （b）同时含有大范围的这种颗粒的有用浓度，可以通过高剪切转移沉积到具有精确可控的厚度和轮廓的基材上; （c）当这样沉积时可以熔融成具有低吸湿性（例如湿气）并且用作阻挡膜的连续均匀的膜; （d）如果需要，可以作为一层与包含其它电性能添加剂的其它这样的层熔合以形成单片电气部件; 和（e）一般来说，可以通过高精度和可控性的印刷和涂布技术来满足制造任何有用的电路元件（包括电致发光灯）的所有要求。