公开(公告)号：WO1992022422A1

公开(公告)日：1992-12-23

申请号：PCT/US1992005094

申请日：1992-06-17

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  GAZIT, Samuel ,  ADAMS, Gary, W.

IPC: B32B03/10

CPC classification number: H05K1/0373 ,  C08G59/42 ,  C08K3/013 ,  H01L23/145 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/057 ,  H05K2201/068 ,  H01L2924/00 ,  C08L63/00

Abstract: A printed circuit board composed of a low Tg epoxy filled with a low CTE filler in the range of 45 to 65 % by volume and laminated to electrically conductive sheets is presented. The printed circuit board of this invention does not include any woven or nonwoven fabrics. The printed circuit board is flexible in the sense that it can be bent to any desired multiplanar shape and will retain that shape after installation as required by electronic interconnection systems.

Abstract translation: 提出了一种印刷电路板，其由填充有45至65体积％的低CTE填料的低Tg环氧树脂组成并层压到导电片上。 本发明的印刷电路板不包括任何织造或非织造织物。 印刷电路板的灵活性在于它可以弯曲成任何所需的多平面形状，并且在电气互连系统所要求的安装之后将保持该形状。

公开(公告)号：WO1990012432A1

公开(公告)日：1990-10-18

申请号：PCT/US1990001697

申请日：1990-03-30

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  GORDON, Herman, B. ,  OWENS, Mark, J. ,  SIMPSON, Scott

IPC: H01R09/07

CPC classification number: H01R12/79 ,  H05K3/365

Abstract: An electrical connector (10) is presented for effecting a non-wiping pressure mated connection between at least a pair of flexible circuits (18, 20) and another circuit device (22) in a compact package with allowance for very tight tolerances on pad width and spacing.

Abstract translation: 电连接器在紧凑外壳中的至少一对柔性电路和另一电路装置之间提供成对的无摩擦电连接，对于垫的间隔和宽度具有非常严格的公差。

公开(公告)号：WO1990004319A1

公开(公告)日：1990-04-19

申请号：PCT/US1989004180

申请日：1989-09-26

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  LANDI, Vincent, R.

IPC: H05K01/02

CPC classification number: H05K3/20 ,  B29C45/14827 ,  B29K2995/0005 ,  B29L2031/3456 ,  H01Q15/141 ,  H01Q21/0087 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/002 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2203/0156 ,  H05K2203/0264 ,  H05K2203/0793 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: A highly accurate circuit pattern (14) in intimate contiguous relationship with a curved plastic body (12) and a method of manufacture thereof. In accordance with the present invention, circuit pattern (14) is detachably fixed to a flexible substrate (16) and is placed into a mold (20). A molding compound (22) is then forced into the mold pressing the circuit against the mold wall and filling all of the mold voids. The molded product is thereafter removed from the mold. The flexible substrate (16), on which the metallic circuit is printed, is removed from the molded product leaving the metallic circuit pattern (14) imbedded into the molded product.

公开(公告)号：WO1989010985A1

公开(公告)日：1989-11-16

申请号：PCT/US1989001810

申请日：1989-04-28

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  BARTON, Carlos, L. ,  HUDSON, Adrienne, Lindsay ,  HENSON, Samuel, Wayne

IPC: C25D05/02

CPC classification number: H05K3/4691 ,  H05K1/0393 ,  H05K3/0094 ,  H05K3/022 ,  H05K3/064 ,  H05K3/108 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4076 ,  H05K3/426 ,  H05K3/427 ,  H05K2201/0154 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2203/1394

Abstract: A multilayer through-hole contacted flexible circuit and method of manufacture thereof is presented. The flexible circuit is made by providing through-holes (58) to a standard single sided laminate (50). Conductive material (60) is vacuum deposited into the through-holes and at the same time a conductive seed-layer is deposited on the polymer side of the standard laminate. Plating resist (62) is applied to both sides of the material and the seed-layer side of the material is patterned such that circuit traces, pads, and through-holes can be electroplated with additional copper (64). The plating resist (62) is stripped and the very thin layer of copper in the non-conductive areas is flash etched to produce semi-additive circuit features on the seed-layer side. Etch resist is then applied to both sides of the material and circuit patterns fabricated on the foil-side of the material. A cover film (66) and (68) coated with adhesive (70) and (72) is then provided over the exposed circuit patterns.

公开(公告)号：WO1991001567A1

公开(公告)日：1991-02-07

申请号：PCT/US1990003558

申请日：1990-06-21

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  GORDON, Herman, B. ,  OWENS, Mark, J. ,  RUBINSTEIN, Leon ,  SIMPSON, Scott

IPC: H01K05/00

CPC classification number: H01R12/57 ,  H01R12/79

Abstract: A flexible circuit connector (10) is presented which is used to electrically and mechanically connect a flexible circuit (20) to a circuit board (18) or other electronic device. The connector (10) also functions to wipe off any residue or debris on the electrical contacts before final connection. The connector (10) is comprised of a male plug (12) and a female adapter (14). The male plug (12) comprises two interlocking pieces including a block (22) and a cover (24). These two pieces allow for easy assembly and disassembly of the plug (12) in conjuction with a flexible circuit (20). The female adapter (14) comprises a hood (70) which may be fastened directly to a circuit board. Alternatively, the hood (70) may be fastened to a base plate (68) which has gold plated contacts (88) and conductive pins (90) which pass through and which are soldered to the circuit board.

公开(公告)号：WO1990001413A1

公开(公告)日：1990-02-22

申请号：PCT/US1989003172

申请日：1989-07-24

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  HERNANDEZ, Jorge, M.

IPC: B32B27/14

CPC classification number: H05K1/162 ,  H01G4/20 ,  H05K1/0298 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09309 ,  Y10S428/901 ,  Y10T428/24157 ,  Y10T428/24826 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252 ,  Y10T428/31678

Abstract: A high capacitance flexible dielectric sheet material (10) is comprised of a monolayer of multilayer or single layer high dielectric (e.g. ceramic) chips or pellets (12) of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips (12) are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive (14) to define a cohesive sheet with the polymer (14) binding the array of high dielectric (e.g. ceramic) chips (12) together. Next, the opposite planar surfaces of the array (including the polymer) are electroless plated or electroded by vacuum metal deposition, or sputtering, to define opposed metallized surfaces (28 and 30). The end result is a relatively flexible high capacitance dielectric film or sheet material (10) which is drillable, platable, printable, etchable, laminable and reliable.

公开(公告)号：WO1990001374A1

公开(公告)日：1990-02-22

申请号：PCT/US1989003173

申请日：1989-07-24

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  TRASKOS, Richard, T. ,  FLEISCHER, Cathy, A. ,  BARTON, Carlos, Lee ,  NODDIN, David, B.

IPC: B05B03/06

CPC classification number: B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/034 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/427 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2203/056

Abstract: A method of ablating fluoropolymer composite materials is presented wherein it has been found that small holes (less than 100 mu m) can be formed in fluoropolymer composite laminate materials using UV lasers. The resulting holes can be used to produce vias and plated through-holes having smooth side walls with little or no debris or residue remaining in the holes and minimal damage to the polymer. Thus, the vias and plated through-holes can be plated without further cleaning processes. In addition, the holes are formed at a relatively fast rate.

公开(公告)号：WO1987007470A1

公开(公告)日：1987-12-03

申请号：PCT/US1987001150

申请日：1987-05-19

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  RUBINSTEIN, Leon ,  SCOTT, Roger, André

IPC: H05K01/00

CPC classification number: H05K7/1053 ,  H05K1/141 ,  H05K3/365

Abstract: A high frequency electrical connector system for electrically interconnecting corresponding first and second circuit elements includes a first planar array (14) of pad-type contact terminals disposed on a substrate (11) and connected to a first circuit on the substrate, together with first guide structure (18) adjacent the first array of contact terminals. A cooperating second array (40) of pad-type contact terminals is mounted on a rigid nonconductive contact support structure (42) that includes a resilient contact terminal array mounting (74), camming structure (90) and second guide structure (84, 86) for cooperation with the first guide structure. The contact support structure is resiliently coupled to a carrier structure (44) that includes cooperating camming structure (56). Flexible multi-conductor interconnection structure (36) has one end electrically connected to a cooperating electrical circuit secured to the carrier structure and its other end connected to corresponding terminals of the second array. Fastener structure (88) is adapted to secure the carrier structure and the substrate together with guide structures in engagement. As the fastener structure moves the carrier structure towards the substrate, the camming structures interact and move the contact support structure laterally (parallel to the plane of the contact arrays) in transverse wiping action, as directionally guided by the engaged first and second guide structures, to remove debris or other foreign matter (such as corrosive films) which may adversely affect electrical circuit performance.

Abstract translation: 用于电互连对应的第一和第二电路元件的高频电连接器系统包括设置在基板（11）上并连接到基板上的第一电路的焊盘型接触端子的第一平面阵列（14） 结构（18）邻近第一阵列接触端子。 一种配合的第二阵列（40）的垫式接触端子安装在刚性非导电接触支撑结构（42）上，该结构包括弹性接触端子阵列安装件（74），凸轮结构（90）和第二引导结构（84,86 ）与第一指导结构合作。 接触支撑结构弹性地联接到包括配合的凸轮结构（56）的载体结构（44）。 柔性多导体互连结构（36）的一端电连接到固定到载体结构的协作电路，其另一端连接到第二阵列的相应端子。 紧固件结构（88）适于将载体结构和基底与引导结构一起接合。 当紧固件结构将载体结构移动到基板时，凸轮结构在横向擦拭作用下横向地（平行于接触阵列的平面）相互作用并移动接触支撑结构，如接合的第一和第二引导结构一样， 以去除可能不利地影响电路性能的碎屑或其他异物（如腐蚀性膜）。

公开(公告)号：WO1987004568A1

公开(公告)日：1987-07-30

申请号：PCT/US1987000104

申请日：1987-01-15

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  ZIFCAK, Mark, S. ,  KOSA, Bruce, G. ,  SIMPSON, Scott, S. ,  GORDON, Herman, B. ,  BERRY, Richard, C. ,  OTTO, Jeffrey, B. ,  TRASKOS, Richard, T. ,  HOFFMAN, Claudette, M.

IPC: H01R09/09

CPC classification number: H01R13/2435

Abstract: Area array connector device (12) for providing electrical interconnection from contacts on a first printed circuit board surface (15) to corresponding contacts on a second opposed surface (17) consists of an electrically nonconductive support member (13) disposed between opposed board surfaces, the support member having apertures therethrough in regions of the support member generally corresponding to alignment of corresponding opposed pairs of contacts (34, 36), and electrically conductive metallic interconnect members (22) extending in elastomeric material in the regions. The metallic interconnect members extend through the elastomer, and have end surfaces (26, 28) exposed for metal-to-metal, electricity-conductive contact with the contacts, with total resistance between contacts less than about 25 milli-ohms. The member end surfaces deflect under pressure and are restored upon release of pressure, at least in part by the restorative effect of the elastomer. Preferably, the interconnect member is bodily-rotatable.

Abstract translation: 用于提供从第一印刷电路板表面（15）上的触点到第二相对表面（17）上的对应触点的电互连的区域阵列连接器装置（12）由设置在相对的板表面之间的非导电支撑构件（13） 所述支撑构件在所述支撑构件的区域中具有穿过其中的孔，其大体上对应于对应的相对的触点对（34,36）的对准，以及在所述区域中以弹性体材料延伸的导电金属互连构件（22）。 金属互连构件延伸穿过弹性体，并且具有暴露于金属对金属的端面（26,28），与触点的导电接触，触点之间的总电阻小于约25毫欧。 构件端表面在压力下偏转并且在压力释放时恢复，至少部分地由弹性体的恢复作用而恢复。 优选地，互连构件是可以旋转的。

公开(公告)号：WO1997020255A1

公开(公告)日：1997-06-05

申请号：PCT/US1996018958

申请日：1996-11-27

Applicant: ROGERS CORPORATION

Inventor： ROGERS CORPORATION ,  SMITH, William, D.

IPC: G03G15/02

CPC classification number: G03G15/0233

Abstract: Extremely smooth surface on conductive foam cellular elastomeric rollers used in electrophotographic printing is provided, through the use of electrically conductive heat shrinkable tubing. The electrical conductivity of such rollers is insensitive to changes in temperature and humidity. The smooth surfaced rollers produced from the disclosed method increase the quality of the electrophotographic printing.

Abstract translation: 通过使用导电的热收缩管，提供了用于电子照相印刷的导电泡沫细胞弹性体辊上的非常光滑的表面。 这种辊子的电导率对温度和湿度的变化不敏感。 由所公开的方法制造的光滑表面辊增加了电子照相印刷的质量。