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    PRESSURE SENSOR PACKAGE WITH STRESS ISOLATION FEATURES
    21.
    发明授权
    PRESSURE SENSOR PACKAGE WITH STRESS ISOLATION FEATURES 有权
    压力传感器套件具有应力隔离功能

    公开(公告)号：EP3095756B1

    公开(公告)日：2018-04-11

    申请号：EP16170089.3

    申请日：2016-05-18

    Applicant: Rosemount Aerospace Inc.

    Inventor： POTASEK, David P. ,  STUELKE, Robert

    IPC: B81B7/00

    CPC classification number: B81B7/0058 ,  B81B7/0048 ,  B81B2207/015 ,  H01L2224/48247

    Abstract: A sensor package (100) includes a manifold (102) and a MEMS die (104). The manifold (102) includes a cylindrical body (106), a flange (110), and a mounting surface (120). The cylindrical body (106) defines a first passage (112) that extends longitudinally along a central axis from a first exterior end (114) to an interior end (116) of the cylindrical body (106). The flange (110) extends from the cylindrical body (106) and has an outer periphery that is configured to support a print circuit board (126). The mounting surface (120) is disposed at the interior end (116) of the first passage (112). The surface area of the mounting surface (120) is less than the surface area of a MEMS die (104) configured to mate with the mounting surface (120).

    A FUSE ASSEMBLY AND METHOD OF MAKING
    22.
    发明公开
    A FUSE ASSEMBLY AND METHOD OF MAKING 审中-公开

    公开(公告)号：EP3742467A1

    公开(公告)日：2020-11-25

    申请号：EP19210644.1

    申请日：2019-11-21

    Applicant: ROSEMOUNT AEROSPACE INC.

    Inventor： POTASEK, David P. ,  PING-TAO FOK, Ben ,  BACKMAN, Roger Alan

    IPC: H01H69/02 ,  H01H85/10 ,  H01H85/041

    Abstract: Disclosed is a thin-film micro-fuse assembly having: a substrate (116); an insulating layer disposed on the substrate, the insulating layer comprising silicon dioxide; a conductor (130) disposed on the insulating layer, the conductor forming: an inlet terminal (130a), an outlet terminal (130b) and a fuse element (130c) between the inlet terminal and the outlet terminal, the inlet terminal and the outlet terminal widthwise converging toward the fuse element, and the fuse element having a first thickness and a first width that is between 1 and 5 times the first thickness.

    MICROMECHANICAL REDUNDANT PIEZORESISTIVE ARRAY PRESSURE SENSOR
    23.
    发明公开
    MICROMECHANICAL REDUNDANT PIEZORESISTIVE ARRAY PRESSURE SENSOR 审中-公开

    公开(公告)号：EP3742146A1

    公开(公告)日：2020-11-25

    申请号：EP19215739.4

    申请日：2019-12-12

    Applicant: ROSEMOUNT AEROSPACE INC.

    Inventor： DAUP, Michael Robert ,  POTASEK, David P.

    IPC: G01L9/00 ,  G01L9/04 ,  G01L15/00 ,  G01L27/00

    Abstract: A micromechanical piezoresistive pressure sensor (40;340) includes a diaphragm (44) configured to mechanically deform in response to an applied load, a sensor substrate located on the diaphragm, and a number of piezoresistive resistance devices located on the sensor substrate. The piezoresistive resistance devices are arranged in a first planar array defining a grid pattern having two or more rows, each row being aligned in a first direction. The piezoresistive resistance devices are configured to be electrically connected in a number of bridge circuits (30), whereby the piezoresistive resistance devices in each row is electrically connected in an associated bridge circuit. A method of using the micromechanical piezoresistive pressure sensor is also disclosed.

    PRESSURE TRANSDUCER INCLUDING KOVAR INTEGRATED PACKAGES
    24.
    发明公开
    PRESSURE TRANSDUCER INCLUDING KOVAR INTEGRATED PACKAGES 审中-公开

    公开(公告)号：EP3736553A1

    公开(公告)日：2020-11-11

    申请号：EP19210205.1

    申请日：2019-11-19

    Applicant: ROSEMOUNT AEROSPACE INC.

    Inventor： GOLDEN, Jim ,  POTASEK, David P. ,  STUELKE, Robert

    IPC: G01L19/00 ,  G01L19/04

    Abstract: A pressure sensor assembly is formed by: forming an inlet channel (108) by brazing a transition portion (114) to a pressure port (116) with a high temperature brazing processes, wherein the transition portion and the pressure port are both hollow tubular members and are formed of different materials, the pressure port including a base (202) and a projection (204) extending therefrom; after the inlet channel is formed, joining a header (122) and a sensor (104) to the pressure port with a soldering process that is at a lower temperature than the high temperature brazing process, wherein the header is joined to the base of the pressure port and the sensor is joined to the projection of the pressure port and is in fluid communication with a fluid to be measured through the pressure port; and welding a cover (120) to the header.

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