中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

45 records (took 0.042 seconds)

    ELECTRICAL CONNECTIONS IN SUBSTRATES
    21.
    发明专利
    ELECTRICAL CONNECTIONS IN SUBSTRATES 未知

    公开(公告)号：HK1084236A1

    公开(公告)日：2006-07-21

    申请号：HK06104564

    申请日：2006-04-13

    Applicant: SILEX MICROSYSTEMS AB

    Inventor： KAELVESTEN EDVARD ,  EBEFORS THORBJOERN ,  SVEDIN NIKLAS ,  RANGSTEN PELLE ,  HUHTAOJA TOMMY

    IPC: B81B20060101 ,  B81B7/00 ,  H01L20060101 ,  H01L21/768 ,  H01L23/48

    Abstract: A method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate includes creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of the substrate, defined by the trench. Also described is a product usable as a starting substrate for the manufacture of micro-electronic and/or micro-mechanic devices, including a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least one electrically conducting member extending through the substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and includes the same material as the substrate, i.e. it is made from the wafer material.

    26.
    发明专利
    未知

    公开(公告)号：SE0700172L

    公开(公告)日：2008-07-26

    申请号：SE0700172

    申请日：2007-01-25

    Applicant: SILEX MICROSYSTEMS AB

    Inventor： EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  BAUER TOMAS

    Abstract: A starting substrate in the form of a semiconductor wafer (1) has a first side and a second side, the sides being plane-parallel with respect to each other, and has a thickness rendering it suitable for processing without significant risk of being damaged, for the fabrication of combined analogue and digital designs, the wafer including at least two partitions (A1, A2; DIGITAL, ANALOGUE) electrically insulated from each other by insulating material (2; 38; 81; L) extending entirely through the wafer. A method for making such substrates including etching trenches in a wafer, and filling trenches with insulating material is also described.

    ELECTRICAL CONNECTIONS IN SUBSTRATES
    29.
    发明专利
    ELECTRICAL CONNECTIONS IN SUBSTRATES 未知

    公开(公告)号：CA2519893A1

    公开(公告)日：2004-09-30

    申请号：CA2519893

    申请日：2004-03-22

    Applicant: SILEX MICROSYSTEMS AB

    Inventor： HUHTAOJA TOMMY ,  EBEFORS THORBJOERN ,  KAELVESTEN EDVARD ,  RANGSTEN PELLE ,  SVEDIN NIKLAS

    IPC: H01L21/60 ,  B81B7/00 ,  H01L21/768 ,  H01L23/48 ,  H01L29/40

    Abstract: The invention relates to a method of making an electrical connection between a first (top) and a second (bottom) surface of a conducting or semi-conducting substrate. It comprising creating a trench in the first surface, and establishing an insulating enclosure entirely separating a portion of said substrate, defined by said trench. It also relates to a product usable as a starting substrate for the manufacture of micro-electronic and/or micro- mechanic devices, comprising a flat substrate of a semi-conducting or conducting material, and having a first and a second surface and at least on e electrically conducting member extending through said substrate. The electrically conducting member is insulated from surrounding material of the flat substrate by a finite layer of an insulating material, and comprises th e same material as the substrate, i.e. it is made from the wafer material.

Patent Agency Ranking