Abstract:
PROBLEM TO BE SOLVED: To provide an image display device such as a projection display for reducing speckle noise and reducing the degradation of image quality. SOLUTION: In an illumination optical device in the image display device 1 for displaying images by irradiating a GLV (space modulation element) 6 with a laser beam L and modulating the laser beam on the basis of image signals inputted to the GLV, the GLV is irradiated with a plurality of the laser beams l with an optical path difference longer than the coherence length of the laser beams. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method of growing a nitride III-V group compound semiconductor layer and a method of manufacturing a semiconductor device. SOLUTION: When an in-free nitride III-V group compound semiconductor layer 13 is grown on a substrate 11 formed of material other than nitride III-V group compound semiconductor through a chemical vapor deposition method, the III-V ratio of deposition material is set at 8000 or above preferably 10,000 or above, more preferably 11,000 or above. When an In-containing nitride III-V group compound semiconductor layer 17 is grown on a substrate 11 formed of material other than nitride III-V group compound semiconductor through a chemical vapor deposition method, the V-III-ratio of deposition material is set at 10000 or above, preferably 13,000 or above, more preferably 14,000 or above.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element using a nitride-based Group III-V compound semiconductor, which reduces the threshold current density without increasing the operation voltage practically. SOLUTION: A p-type clad layer of a GaN-based semiconductor laser is configured by two or more semiconductor layers having different band gaps from one another, and a part of an active layer side of the p-type clad layer is configured by a semiconductor layer having a band gap greater than that of the other parts. Specifically, in the GaN-based semiconductor laser with an AlGaN/GaN/GaInN SCH structure, a p-type AlGaN clad layer 10 is configured of: a p-type Al x1 Ga 1-x1 N layer 10a in contact with a p-type GaN optical waveguide layer 9; and a p-type Al x2 Ga 1-x2 N layer 10b on the p-type Al x1 Ga 1-x1 N layer 10a (here, 0≤x2
Abstract:
PROBLEM TO BE SOLVED: To reduce speckle by arranging a diffuser having wavelength selectivity at an intermediate image forming position and also to sufficiently extend luminous flux of every wavelength relative to the diameter of the entrance pupil of a projection optical system without remarkably lowering the efficiency of using light. SOLUTION: The image producing device 1 is constituted by arranging: a light source part having coherent light sources (2R, 2G and 2B) having different wavelength; an optical system 6 receiving light from the light source part and forming an intermediate image; a light scattering part 7 arranged at the intermediate image forming position; and a projection optical system 8 arranged at the post-stage of the light scattering part. The light scattering part 7 is constituted to scatter the light for every wavelength by using a plurality of diffraction gratings having the wavelength selectivity for each wavelength of the light source. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To ensure a stable optical output in spite of a temperature variation in light source equipment using a semiconductor laser. SOLUTION: This light source equipment 1 using a laser light source 2 comprises a temperature detecting means 3 for detecting the temperature of the laser light source 2, a control means 4 for keeping the optical output of the laser light source 2 constant in spite of short-term temperature change, and a power supply unit 5 for supplying power to the laser light source 2 based on the signal received from the control means 4. A current control means 4c uses only the temperature detected by the temperature detecting means 3 as the input information thereof, and sends out a current value controlling signal computed from the temperature information to the power supply unit 5. As a result, the current supplied from the power supply unit 5 to the laser light source 2 is controlled to keep the optical output thereof constant. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a light source device where the number of excitation light sources of excitation light for exciting the gain medium of an optical amplification section is smaller than that of the optical amplifier for amplifying seed light, excitation light from a common excitation light source is introduced at least at one portion of a plurality of optical amplifiers, optical amplification to the seed light having mutually different wavelength regions is made by the gain medium having a sufficient gain to each wavelength in the plurality of optical amplifiers, and to provide an optical device having the light source device and a projector. SOLUTION: In the light source device, optical device, and projector; excitation light from the common excitation light source is introduced at least at one portion of the plurality of optical amplifiers and optical amplification to the seed light at mutually different wavelength regions is made by the gain medium having a sufficient gain to each wavelength in the plurality of optical amplifiers. Then, a device configuration element can be decreased and the utilization efficiency of the excitation light can be improved by the position relationship between each gain medium having a different level system and an excitation light source in the plurality of optical amplifiers. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To enable an n-type AlGaN clad layer and a p-type AlGaN clad layer, which are both superior in quality, to grow so as to manufacture a high- performance semiconductor laser. SOLUTION: In a method of manufacturing a GaN semiconductor laser, the growth temperature of the p-type AlGaN clad layer is set lower than that of the n-type AlGaN clad layer, and the growth temperatures of the p-type AlGaN clad layer and the n-type AlGaN clad layer are set equal to that of a GaInN active layer or above and set at 980°C or below, e.g. 930 to 960°C. It is preferable that the surface of a base is covered with a p-type AlGaN cap layer which has been grown at the growth temperature nearly equal to that of the GaInN active layer or below before the p-type AlGaN clad layer is grown. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing a nitride based III-V compound semiconductor light-emitting element of high quality, in which indium is prevented from being captured into an upper layer of a layer containing indium and crystallinity of the upper layer of the layer containing indium is improved. SOLUTION: This method of manufacturing a semiconductor light-emitting element has a process, in which a III-V compound semiconductor layer containing nitrogen is formed through by crystal growth to take place. A first semiconductor layer (16) as the III-V compound semiconductor containing indium and nitrogen is grown at a first temperature. A second semiconductor layer (18), composed of AlxGa1-xN (where 0
Abstract:
PROBLEM TO BE SOLVED: To improve conductivity by making current easy to flow across a hetero interface in a semiconductor device or a semiconductor light-emitting element containing the hetero interface where two nitride III-V compound semiconductor layers different from each other are in contact with each other and a band discontinuity exists. SOLUTION: In a semiconductor device or a semiconductor light-emitting element containing a hetero interface where two nitride III-V compound semiconductor layers different from each other are in contact with each other and a band discontinuity exists, a superlattice layer or a composition gradient layer extinguishing or decreasing the band discontinuity falsely is inserted in the hetero interface. In a GaN semiconductor laser, an n-type AlGaN/GaN superlattice layer 5 or an n-type AlGaN graded layer is inserted in a hetero interface between an n-type GaN contact layer 4 and an n-type AlGaN clad layer 6, and a p-type AlGaN/GaN superlattice layer 12 or a p-type AlGaN graded layer is inserted in a hetero interface between a p-type AlGaN clad layer 11 and a p-type GaN contact layer 13.
Abstract:
PROBLEM TO BE SOLVED: To provide a method and device for growing a nitride III-V compound semiconductor which enables efficient growth of a nitride-based III-V compound semiconductor of high quality. SOLUTION: The pressure inside a reaction tube 1 of an MOCVD device is set at not less than 1.1 atm., particularly not less than 1.1 atm. and not more than 2 atm., preferably 1.2-1.8 atm., and a nitride-based III-V compound semiconductor, for example, GaN, InGaN or the like is grown. The reaction tube 1 is made of quartz glass so as to obtain sufficient strength for withstanding the difference between inner and outer pressures. The surface of a substrate 3 on which the nitride-based III-V compound semiconductor may face upward or downward.