Abstract:
An inertial sensor with failure threshold includes: a first body (2) and a second body (18), which can move relatively with respect to one another and are constrained by a plurality of elastic elements; and at least one sample element (6) connected between the first body (2) and the second body (18) and shaped so as to be subjected to a stress when the second body (18) is outside of a relative resting position with respect to the first body (2). The sample element (6) has at least one weakened region (9, 10).
Abstract:
The microactuator (9) is attached to a first face (43) of a coupling (8) formed on a suspension (5), so that the R/W transducer (6) projects from the opposite face (44). A hole (41; 56) in the coupling (8) permits passage of an adhesive mass (42) interposed between the rotor (11) of the microactuator (9) and the R/W transducer (6). A strip (40) of adhesive material extends between the die (25) accommodating the microactuator (9) and the coupling (8), and externally surrounds the microactuator (9). The coupling (8) acts as a protective shield for the microactuator (9), both mechanically and electrically; it covers the microactuator (9) at the front, and prevents foreign particles from blocking the microactuator (9); in addition it electrically insulates the R/W transducer (6), sensitive to magnetic fields, from regions of the microactuator biased to a high voltage. With the gimbal (8), the strip (40) forms a sealing structure, which in practice surrounds the microactuator (9) on all sides.
Abstract:
The method comprises the steps of: forming an integrated device (54) including a microactuator (10) in a semiconductor material wafer (29); forming an immobilisation structure (45,47) of organic material on the wafer; simultaneously forming a securing flange (51) integral with the microactuator (10) and electrical connections for connecting the integrated device to a read/write head; bonding a transducer (6,55) supporting the read/write head to the securing flange (51); connecting the electrical connections to the read/write head; cutting the wafer into dices; bonding the actuator unit to a suspension; and removing the immobilisation structure (45,47).
Abstract:
In a microelectromechanical device (1), a mobile mass (2) is suspended above a substrate (3) via elastic suspension elements (5), and is rotatable about said elastic suspension elements (5), a cover structure (10) is set above the mobile mass (2) and has an internal surface (10a) facing the mobile mass (2), and a stopper structure (12, 14) is arranged at the internal surface (10a) of the cover structure (10) and extends towards the mobile mass (2) in order to stop a movement of the mobile mass (10) away from the substrate (3) along an axis (z) transverse to the substrate (3). The stopper structure (12, 14) is arranged with respect to the mobile mass (2) so as to reduce an effect of reciprocal electrostatic interaction, in particular so as to minimize a resultant twisting moment of the mobile mass (2) about the elastic suspension elements (5).
Abstract:
An integrated gyroscope (1), including an acceleration sensor (23) formed by: a driving assembly (16); a sensitive mass (6) extending in at least one first and second directions (X, Y) and being moved by the driving assembly (16) in the first direction (X); and by a capacitive sensing electrode (20), facing the sensitive mass. The acceleration sensor (23) has an rotation axis (A) parallel to the second direction (Y), and the sensitive mass (6) is sensitive to forces acting in a third direction (Z) perpendicular to the other directions. The capacitive sensing electrode (20) is formed by a conductive material region extending underneath the sensitive mass (6) and spaced therefrom by an air gap.
Abstract:
The gyroscope (1) is formed by a driving system (16) including a driving mass (5) having an open concave shape; an accelerometer including a sensing mass (6) and comprising mobile sensing electrodes (18); a linkage (24) connecting the driving mass (5) to the sensing mass (6). The sensing mass is surrounded on three sides by the driving mass and has a peripheral portion not facing the sensing mass. The mobile sensing electrodes (18) extend integral with the sensing mass from the peripheral portion not facing the driving mass (5) and are interleaved with fixed sensing electrodes (19a, 19b). Thereby, there are no passing electrical connections extending below the sensing mass (6). Moreover the linkage includes springs (24) placed equidistant from the center of gravity (G2) of the accelerometer, and the gyroscope (1) is anchored to the substrate with anchoring springs (10) placed equidistant from the center of gravity (G1) of the assembly formed by the driving system (16) and by the accelerometer (23).