公开(公告)号：AU3138995A

公开(公告)日：1996-02-16

申请号：AU3138995

申请日：1995-07-19

Applicant: TESSERA INC

Inventor： DISTEFANO THOMAS H ,  SMITH JOHN W ,  KARAVAKIS KONSTANTINE ,  KOVAK ZLATA ,  FJELSTAD JOSEPH

IPC: H01R12/50 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H01R9/09

Abstract: An interposer for interconnection between microelectronic circuit panels (260) has contacts (250) at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad (262) on the engaged circuit panel. Thus, when the circuit panels (260) are compressed with the interposers, the contacts expand radially and wipe across the pads (262). The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material (246) carried on the contacts themselves.

公开(公告)号：WO9828955A2

公开(公告)日：1998-07-02

申请号：PCT/US9723949

申请日：1997-12-12

Applicant: TESSERA INC

Inventor： SMITH JOHN W ,  FJELSTAD JOSEPH

IPC: H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H05K

CPC classification number: H01L23/49816 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81805 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00

Abstract: A structure (13) including a conductive, preferably metallic conductive layer (26) is provided with leads (12) on a bottom surface. The leads have fixed (16) ends permanently attached to the structure and free ends (18) detachable from the structure. The structure is engaged with a microelectronic element (22) such as a semiconductor chip or wafer, the free ends of the leads are bonded to the microelectronic element, and the leads are bent by moving the structure relative to the microelectronic element. Portions of the conductive layer are removed, leaving residual portions of the conductive layer as separate electrical terminals (32) connected to at least some of the leads. The conductive layer mechanically stabilizes the structure before bonding, and facilitates precise registration of the leads with the microelectronic element. After the conductive layer is converted to separate terminals, it does not impair free movement of the terminals relative to the microelectronic element.

Abstract translation: 包括导电优选金属导电层（26）的结构（13）在底表面上设置有引线（12）。 引线具有永久地附接到结构的固定的（16）端部，并且可自由结构的自由端（18）可拆卸。 该结构与诸如半导体芯片或晶片的微电子元件（22）接合，引线的自由端接合到微电子元件，并且通过相对于微电子元件移动结构来使引线弯曲。 导电层的一部分被去除，导致导电层的剩余部分作为连接到至少一些引线的单独的电端子（32）。 导电层在结合之前机械稳定结构，并且有助于引线与微电子元件的精确对准。 在将导电层转换成单独的端子之后，它不会损害端子相对于微电子元件的自由移动。

公开(公告)号：EP0764352A4

公开(公告)日：2000-03-15

申请号：EP95923103

申请日：1995-06-07

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  SMITH JOHN W ,  DISTEFANO THOMAS H ,  WALTON A CHRISTIAN ,  ZACCARDI JAMES

IPC: H01R33/76 ,  B23K1/19 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/48 ,  H01L21/60 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R4/02 ,  H01R12/00 ,  H01R12/52 ,  H01R12/57 ,  H01R12/70 ,  H01R12/71 ,  H01R13/24 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/08 ,  H05K7/10 ,  H01R9/09 ,  H01R23/68

CPC classification number: H05K7/1084 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06733 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81899 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H01R13/2485 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A connector for microelectronic elements includes a sheet-like body (30) having a plurality of holes (36), desirably arranged in a regular grid pattern. Each hole is provided with a resilient laminar contact (38) having a plurality of projections (42) extending inwardly over the hole in the body. Microelectronic elements (68) having bump leads (70) such as solder balls thereon may be engaged with the connector by advancing the bump leads into the holes of the connector to engage the bump leads with the contacts. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.

Abstract translation: 用于微电子元件的连接器包括具有多个孔（36）的片状体（3），期望地布置成规则的格子图案。 每个孔设置有弹性层状接触件（38），其具有向内延伸到主体中的孔的多个突起（42）。 具有诸如其上的焊球的凸起引线（70）的微电子元件（68）可以通过使凸块引线进入连接器的孔而与连接器接合，以使触点与触点接合。 可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

公开(公告)号：EP0901695A4

公开(公告)日：2000-04-12

申请号：EP97926707

申请日：1997-05-22

Applicant: TESSERA INC

Inventor： FJELSTAD JOSEPH ,  DISTEFANO THOMAS H ,  KARAVAKIS KONSTANTINE ,  FARACI ANTHONY B ,  NGUYEN TAN

IPC: H01R11/01 ,  G01R31/28 ,  H01L23/32 ,  H01L23/48 ,  H01L23/498 ,  H01R12/52 ,  H01R33/76 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K7/10 ,  H01R9/09

CPC classification number: H01L23/32 ,  H01L23/49827 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/45144 ,  H01L2224/73251 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81901 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01R12/52 ,  H05K3/326 ,  H05K3/3436 ,  H05K3/4092 ,  H05K7/1061 ,  H05K2201/0397 ,  H05K2201/049 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: A connector (10) for microelectronic elements includes a sheetlike body (24) having a plurality of active contacts (22) arranged in a regular grid pattern. The active contacts (22) may include several metallic projections (28) extending inwardly around a hole (27) in the sheetlike element (24), on a first major surface (32). A support structure such as a grid array of noncollapsing structural posts (23) is on a second major surface (33), and each of the posts (23) is electrically connected to one of the active contacts (22). The grid array of the posts (23) and the grid array of active contacts (22) are offset from one another so that an active contact (22) is surrounded by several posts (23). The posts (23) support the sheetlike element (24) spaced away from a substrate (41) to which the posts (23) are attached. A microelectronic element (45) having bump leads (46) thereon may be engaged by contacting the bump leads (46) with the active contacts (22), and deflecting the sheetlike element (24) between the bump leads (46) on one side and the posts (23) on the other side.