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    22.
    发明专利
    未知

    公开(公告)号：DE69533933D1

    公开(公告)日：2005-02-17

    申请号：DE69533933

    申请日：1995-02-15

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： BEERS RUSSELL A ,  BERCZIK DOUGLAS M ,  NOETZEL ALLAN A

    IPC: C23C14/14 ,  C22C9/01 ,  C22C14/00 ,  C23C14/16 ,  C23C14/32 ,  C23C30/00

    Abstract: An oxidation resistant structure is taught comprising a Ti alloy substrate and a uniform coating of a Cu alloy deposited on the substrate, wherein the Cu alloy comprises Cu and from 0 to 10 wt% Al and from 0 to 6 wt% Si and the percentages of Al and Si are not simultaneously zero, the structure having substantially no intermetallic compound formation and substantially no diffusion of coating constituents in the substrate.

    Cathodic arc vapor deposition apparatus
    23.
    发明专利
    Cathodic arc vapor deposition apparatus 未知

    公开(公告)号：SG67546A1

    公开(公告)日：1999-09-21

    申请号：SG1998003308

    申请日：1998-08-27

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： BEERS RUSSELL A ,  HENDRICKS ROBERT E ,  MARSZAL DEAN N ,  NOETZEL ALLAN A ,  WRIGHT ROBERT J ,  ROYAL TYRUS E

    IPC: C23C14/24 ,  H01J37/32 ,  C23C14/32

    Abstract: An apparatus (10) for applying material by cathodic arc deposition to a substrate (12) is provided which includes a vessel (14), means (16) for maintaining a vacuum in the vessel, a cathode (18), a contactor (20), means (24) for selectively sustaining an arc of electrical energy between the cathode and an anode (26), and an actuator (22). The cathode and contactor are positioned inside the vessel, and the contactor is electrically connected to the means for selectively sustaining an arc of electrical energy. The actuator selectively actuates the contactor into electrical contact with the cathode, and thereby electrically connects the cathode to the means for sustaining an arc of electrical energy.

    25.
    发明专利
    未知

    公开(公告)号：DE69840142D1

    公开(公告)日：2008-12-04

    申请号：DE69840142

    申请日：1998-08-28

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： BEERS RUSSELL A ,  HENDRICKS ROBERT E ,  MARSZAL DEAN N ,  WRIGHT ROBERT J ,  NOETZEL ALLAN A ,  ROYAL TYRUS E

    IPC: C23C14/24 ,  H01J37/32

    Abstract: An apparatus (10) for applying material by cathodic arc deposition to a substrate (12) is provided which includes a vessel (14), means (16) for maintaining a vacuum in the vessel, a cathode (18), a contactor (20), means (24) for selectively sustaining an arc of electrical energy between the cathode and an anode (26), and an actuator (22). The cathode and contactor are positioned inside the vessel, and the contactor is electrically connected to the means for selectively sustaining an arc of electrical energy. The actuator selectively actuates the contactor into electrical contact with the cathode, and thereby electrically connects the cathode to the means for sustaining an arc of electrical energy.

    Method and apparatus for cathodic arc deposition of materials on a substrate
    27.
    发明专利
    Method and apparatus for cathodic arc deposition of materials on a substrate 未知

    公开(公告)号：SG123711A1

    公开(公告)日：2006-07-26

    申请号：SG200508038

    申请日：2005-12-13

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： BEERS RUSSELL A ,  KASULE ASUMINI ,  COLLINS KEVIN LEE

    Abstract: A method for applying a coating by a cathodic arc is provided. The method includes the steps of: a) providing a cathodic arc coater that includes a power source and utilizes a disk-shaped cathode, the cathode having an evaporative surface extending between a first end surface and a second end surface, wherein the evaporative surface has an area; b) determining a maximum acceptable power density for the evaporative surface; and c) applying a magnitude of electrical current from the power source to the cathode, wherein the electrical current magnitude divided by the area is equal to or less than the maximum acceptable power density for the evaporative surface.

    28.
    发明专利
    未知

    公开(公告)号：DE69832016D1

    公开(公告)日：2005-12-01

    申请号：DE69832016

    申请日：1998-08-28

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： BEERS RUSSELL A ,  MARSZAL DEAN N ,  NOETZEL ALLAN A ,  SILEO GERARD A ,  HENDRICKS ROBERT E ,  WRIGHT ROBERT J ,  ERVIN DAVID R

    IPC: C23C14/24 ,  C23C14/32 ,  C23C14/56 ,  C23C14/54

    Abstract: A vapor deposition production system (10) for coating substrates (12) is provided which includes a plurality of vapor deposition coaters (14), a plurality of platters (16), a platter docking station (18), a shuttle track (20), and apparatus for transporting the platters between the coaters and the platter docking station. The shuttle track connects the platter docking station and the coaters. Platters selectively removed from the coaters are transported along the shuttle track to the platter docking station where processed substrates are unloaded from the platters and unprocessed substrates loaded on to the platters.

    29.
    发明专利
    未知

    公开(公告)号：DE69533933T2

    公开(公告)日：2005-12-01

    申请号：DE69533933

    申请日：1995-02-15

    Applicant: UNITED TECHNOLOGIES CORP

    Inventor： BEERS RUSSELL A ,  BERCZIK DOUGLAS M ,  NOETZEL ALLAN A

    IPC: C23C14/14 ,  C22C9/01 ,  C22C14/00 ,  C23C14/16 ,  C23C14/32 ,  C23C30/00

    Abstract: An oxidation resistant structure is taught comprising a Ti alloy substrate and a uniform coating of a Cu alloy deposited on the substrate, wherein the Cu alloy comprises Cu and from 0 to 10 wt% Al and from 0 to 6 wt% Si and the percentages of Al and Si are not simultaneously zero, the structure having substantially no intermetallic compound formation and substantially no diffusion of coating constituents in the substrate.

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