公开(公告)号：US5762258A

公开(公告)日：1998-06-09

申请号：US686241

申请日：1996-07-23

Applicant: Christian Robert Le Coz ,  Donald Ivan Mead ,  Roger James Stockholm

Inventor： Christian Robert Le Coz ,  Donald Ivan Mead ,  Roger James Stockholm

IPC: B23K3/06 ,  H05K3/34 ,  B23K3/00

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  B23K2201/42 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10S269/903 ,  Y10T29/49144 ,  Y10T29/53191

Abstract: A method of precisely positioning a quantity of conductive spacers (e.g., spherically shaped solder balls) on respective conductive pads (e.g., copper pads) of an underlying substrate (e.g., an FR4 printed circuit board or flexible circuit member) wherein the spacers are forcibly retained within a suitable holder and, when engaged with the respective pads, reflowed to effect a plurality of positive electrical connections between the spacers and pads. Such forcible retention allows for partial extension of the spacers from the invention's carrier, which is also disclosed.

公开(公告)号：US5735452A

公开(公告)日：1998-04-07

申请号：US668016

申请日：1996-06-17

Applicant: Roy Yu ,  William Harrington Brearley ,  Kimberley Ann Kelly ,  Patrick Michael O'Leary ,  Arthur Gilman Merryman ,  James Patrick Wood

Inventor： Roy Yu ,  William Harrington Brearley ,  Kimberley Ann Kelly ,  Patrick Michael O'Leary ,  Arthur Gilman Merryman ,  James Patrick Wood

IPC: H01L23/12 ,  B23K3/06 ,  H01L23/50 ,  H05K3/34 ,  B23K31/02

CPC classification number: H05K3/3478 ,  B23K3/0623 ,  B23K2201/42 ,  H01L2924/0002 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/033 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/0415 ,  H05K2203/0557

Abstract: A method for forming a ball grid array to provide a chip carrier with I/O capabilities is described. The method includes combining three distinct steps into one: partitioning a solder sheet into identical solder pieces using a mask provided with openings that match the footprint of the chip carrier; reflowing the solder pieces into solder balls; and joining the balls to the I/O pads of the chip carrier. By combining these three steps into one, a high throughput, high volume, defect free and contamination free operation for forming I/O connections thus results.

Abstract translation: 描述了一种用于形成球栅阵列以提供具有I / O能力的芯片载体的方法。 该方法包括将三个不同的步骤组合成一个：使用具有匹配芯片载体的覆盖区的开口的掩模将焊料片分成相同的焊料片; 将焊料回流焊锡球; 并将球接合到芯片载体的I / O焊盘。 通过将这三个步骤组合在一起，因此产生了高吞吐量，高体积，无缺陷和无污染的用于形成I / O连接的操作。

公开(公告)号：US5722581A

公开(公告)日：1998-03-03

申请号：US655206

申请日：1996-06-07

Applicant: Thierry Sindzingre ,  Stephane Rabia ,  Nicolas Potier

Inventor： Thierry Sindzingre ,  Stephane Rabia ,  Nicolas Potier

IPC: B23K1/08 ,  B23K1/20 ,  B23K3/00 ,  B23K31/02 ,  H05K3/34

CPC classification number: B23K1/20 ,  B23K2201/42 ,  H05K3/3468 ,  H05K3/3489

Abstract: A method for wave soldering a circuit having two or more faces comprising the steps of: (i) passing at least one initial gas mixture comprising at least one of an inert gas, a reducing gas and an oxidizing gas into at least one apparatus for forming excited or unstable gas species; (ii) converting the at least one initial gas mixture into at least one primary gas mixture comprising excited or unstable gas species and substantially free of electrically charged species; (iii) treating each of the two or more faces of the circuit with the at least one primary gas mixture at a pressure close to atmospheric pressure; and (iv) contacting the two or more faces of the circuit with at least one wave of a liquid soldering alloy.

Abstract translation: 一种用于波峰焊接具有两个或更多个面的电路的方法，包括以下步骤：（i）将至少一种包含惰性气体，还原气体和氧化气体中的至少一种的初始气体混合物送入至少一个用于形成的装置 激发或不稳定的气体物种; （ii）将至少一种初始气体混合物转化成至少一种包含激发或不稳定气体物质并且基本上不带电荷的物质的主要气体混合物; （iii）在接近大气压的压力下用至少一种主要气体混合物处理电路的两个或更多个面中的每一个; 和（iv）使电路的两个或更多个面与液体焊接合金的至少一波接触。

公开(公告)号：US5676856A

公开(公告)日：1997-10-14

申请号：US427218

申请日：1995-04-24

Applicant: Hiroshi Haji ,  Isamu Morisako

Inventor： Hiroshi Haji ,  Isamu Morisako

IPC: B23K11/30 ,  B23K20/00

CPC classification number: H01L24/85 ,  B23K11/3063 ,  B23K20/004 ,  H01L24/78 ,  B23K2201/42 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/8501 ,  H01L2224/85045 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/19043

Abstract: A voltage is applied between a first cleaning electrode that in contact with an electrode on a workpiece such as a printed circuit board or a chip, and a second cleaning electrode located in the vicinity of the electrode on the workpiece, from a voltage application circuit so as to produce an electric discharge on the electrode on the workpiece, whereby contamination sticking to the electrode on the workpiece is locally removed by heat generated from the electric discharge.

Abstract translation: 在电压施加电路之间施加电压，该第一清洁电极与位于工件上的电极附近的诸如印刷电路板或芯片的工件上的电极和第二清洁电极接触， 为了在工件上的电极上产生放电，由于从放电产生的热量局部地除去粘附在工件上的电极的污染物。

公开(公告)号：US5674947A

公开(公告)日：1997-10-07

申请号：US514730

申请日：1995-08-14

Applicant: Tetsuya Oishi ,  Kazuo Sugazaki ,  Jin Suzuki

Inventor： Tetsuya Oishi ,  Kazuo Sugazaki ,  Jin Suzuki

IPC: C08F8/00 ,  C08F8/08 ,  C08F8/28 ,  C08F8/30 ,  C08G12/00 ,  C08G59/06 ,  C08G61/00 ,  C08G63/91 ,  C08G65/48 ,  C08G69/48 ,  C08K5/00 ,  C08L23/26 ,  C08L63/00 ,  C08L67/02 ,  C08L71/12 ,  H05K3/34 ,  C08F277/00 ,  C08F271/02 ,  C08F283/08 ,  C08F283/02

CPC classification number: C08L71/126 ,  C08F8/00 ,  C08F8/08 ,  C08F8/28 ,  C08F8/30 ,  C08F8/40 ,  C08G12/00 ,  C08G59/063 ,  C08G61/00 ,  C08G63/914 ,  C08G65/485 ,  C08G69/48 ,  C08K5/0066 ,  C08L23/26 ,  C08L63/00 ,  C08L67/02 ,  B23K2201/42 ,  H05K2201/10734 ,  H05K2203/081 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/176 ,  H05K3/3436 ,  H05K3/3494

Abstract: There are herein disclosed a method for preparing a modified resin which comprises thermal/reaction by the use of a norbornenyl group-containing compound typified by norbornenecarboguanamine or its derivative, a method for preparing an epoxy-modified resin which comprises the step of reacting the above-mentioned modified resin and an epoxide, a flame-retarding method, a thermal stabilization method, a compatibilizing method and a surface modification method which comprise utilizing the modified resin, as well as a coating resin composition and an adhesive resin composition containing the modified resin. According to the, preparation methods of the present invention, the deterioration of a material scarcely occurs, and a functional group which is excellent in flame retardancy, thermal stability, compatibility and the like can be introduced to the resins. By the utilization of these techniques, there can be obtained a flame-retardant material having a good char formability, a thermally stable material whose molded articles can inhibit heat deterioration, a material excellent in miscibility between different kinds of resins, a surface-modified material which is excellent in adhesion and coating properties and the like.

Abstract translation: 本文公开了一种制备改性树脂的方法，该改性树脂包括通过使用以降冰片烯基组合物为代表的降冰片烯基组合物或其衍生物的热/反应，一种环氧改性树脂的制备方法，该方法包括使上述 所述改性树脂和环氧化物，阻燃方法，热稳定化方法，相容化方法和表面改性方法，包括使用改性树脂，以及涂料树脂组合物和含有改性树脂的粘合剂树脂组合物 。 根据本发明的制备方法，几乎​​不发生材料的劣化，并且可以向树脂中引入阻燃性，热稳定性，相容性等优异的官能团。 通过利用这些技术，可以获得具有良好的成型性的阻燃材料，其成型制品可以抑制热劣化的热稳定材料，不同种类的树脂之间的混溶性优异的材料，表面改性材料 其粘合性和涂布性等优异。

公开(公告)号：US5657924A

公开(公告)日：1997-08-19

申请号：US438555

申请日：1995-05-10

Applicant: Ernst Wandke ,  Hans Isler

Inventor： Ernst Wandke ,  Hans Isler

IPC: B23K1/08 ,  H05K3/34 ,  B23K35/38

CPC classification number: B23K1/085 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/095

Abstract: A method is available for wave-soldering component groups, especially printed circuit boards with shielding from the environment, in which lead-free or at least low-lead solders, especially tin solders, with a melting point of more than 210.degree. C., are used. Since in wave soldering the solder bath temperature must usually be set considerably higher than the melting point of the solder, problems with overheating the components are encountered with higher-melting lead-free or low-lead solders. This problem is solved in accordance with the invention by setting a solder bath temperature which is only a few degrees Celsius above the melting point of the solder material, and performing the wave-soldering by the action of a plasma of a process gas atmosphere at low pressure.

Abstract translation: 一种方法可用于波峰焊组件组，特别是具有屏蔽环境的印刷电路板，其中熔点高于210℃的无铅或至少低铅焊料，特别是锡焊料， 被使用。 由于在波峰焊中，焊料槽温度通常必须设置得远高于焊料的熔点，所以与高熔点无铅或低铅焊料相比，会遇到过热部件的问题。 根据本发明，通过设定比焊料材料的熔点高出几摄氏度的焊料浴温度，并且通过处理气体气氛的等离子体的作用进行波峰焊，从而解决了该问题 压力。

公开(公告)号：US5639011A

公开(公告)日：1997-06-17

申请号：US390755

申请日：1995-02-17

Applicant: David C. Jacks ,  Randall R. Walston

Inventor： David C. Jacks ,  Randall R. Walston

IPC: B23K1/012 ,  B23K1/018 ,  B23K3/02 ,  B23K3/04 ,  H01L21/58

CPC classification number: B23K1/012 ,  B23K1/018 ,  B23K3/025 ,  B23K2201/36 ,  B23K2201/42 ,  H01L2224/16225

Abstract: In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

Abstract translation: 一方面，提供了一种用于将部件附接到电路板的装置，包括保持在保持器中的电路板和接触加热器，所述接触加热器通过接触加热电路板上的部件并且通过部件传导热量。 在另一方面，接触加热器是手动移动到部件上的魔杖。 在另一方面，本发明提供了一种用于将部件附接到电路板的方法，包括以下步骤：用接触加热器夹紧部件; 将组件放置在电路板上; 并且通过接触加热电路板上的部件，其中通过部件传导的热量熔化部件下的焊料并将部件附接到电路板。

公开(公告)号：US5628926A

公开(公告)日：1997-05-13

申请号：US364451

申请日：1994-12-27

Applicant: Haba Belgacem ,  Yukio Morishige

Inventor： Haba Belgacem ,  Yukio Morishige

IPC: B23K26/16 ,  B23K26/38 ,  B23K26/40 ,  H01L21/48 ,  H05K3/00 ,  H05K3/38 ,  B23K26/00

CPC classification number: H05K3/0032 ,  B23K26/16 ,  B23K26/382 ,  B23K26/40 ,  B23K26/402 ,  H01L21/486 ,  B23K2201/40 ,  B23K2201/42 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/14 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/26 ,  B23K2203/42 ,  B23K2203/50 ,  H05K2201/0112 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/0285 ,  H05K2203/1388 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/388

Abstract: A method of forming via holes in an organic insulation film or cutting the film includes the steps of exposing predetermined parts of the film to a laser beam to raise a temperature of the exposed parts of the film until the exposed parts are transformed or decomposed and subjecting the film to an ultra sonic wave so that the transformed or decomposed parts are dispersed.

Abstract translation: 在有机绝缘膜中形成通孔或切割膜的方法包括以下步骤：将膜的预定部分暴露于激光束，以提高膜的暴露部分的温度，直到暴露部分变形或分解并且经受 将该胶片变成超声波，使得转化或分解的部分分散。

公开(公告)号：US5622752A

公开(公告)日：1997-04-22

申请号：US427145

申请日：1995-04-24

Applicant: Stuart Erickson ,  Drew Erickson

Inventor： Stuart Erickson ,  Drew Erickson

IPC: B05B13/04 ,  B05B17/06 ,  B05D1/02 ,  B23K1/20 ,  C23C4/12 ,  H05K3/34 ,  B05D7/00

CPC classification number: H05K3/3489 ,  B05B13/041 ,  B05D1/02 ,  B23K1/203 ,  C23C4/123 ,  B05B17/06 ,  B23K2201/42

Abstract: A printed circuit board ("PCB") is moved on a conveyor towards an ultrasonic spray head ("head") that is mounted below the PCB on a guide rail. The guide rail and the direction of motion of the PCB define an acute angle. When the PCB reaches a predetermined position, the head begins a motion across the PCB, spraying a rectangular swatch of soldering flux. The velocity of the head is controlled such that the swatch of flux is substantially perpendicular to the direction of motion of the PCB. After spraying, the head deactivates and reciprocates back across the PCB such that no flux is sprayed. The cycle repeats after a predetermined delay whereby adjacent swatches of flux do not substantially overlap.

Abstract translation: 印刷电路板（“PCB”）在输送机上移动到在导轨上安装在PCB下方的超声波喷头（“头”）。 导轨和PCB的运动方向定义为锐角。 当PCB达到预定位置时，头部开始横跨PCB的运动，喷涂矩形的焊剂焊剂。 控制头的速度使得通量的样片基本上垂直于PCB的运动方向。 在喷涂之后，头部通过PCB去激活和往复运动，使得不喷射焊剂。 循环在预定的延迟之后重复，由此相邻的焊剂块基本上不重叠。

公开(公告)号：US5593040A

公开(公告)日：1997-01-14

申请号：US566750

申请日：1995-12-04

Applicant: Gary R. Shelton ,  Kyle R. Street

Inventor： Gary R. Shelton ,  Kyle R. Street

IPC: B23K3/08 ,  H05K3/34 ,  B65D73/02 ,  H01B17/56

CPC classification number: B23K3/087 ,  B23K2201/42 ,  H05K3/34 ,  Y10S269/902 ,  Y10T24/3984 ,  Y10T24/3993

Abstract: A pallet holds one or more circuit boards for processing. A pallet opening for receiving the circuit board has grooves at one side to retain an edge of the circuit board and rotary clips at the other side to receive and hold the opposite edge of the board. Each clip is a disk which is mounted for rotation about a central axis and is constrained to two angular positions by a detent. A notch in the disk receives the circuit board when in one position and clamps the board against a seat when in the other position. The notch is deep enough to allow the board to be shifted laterally for alignment with test apparatus.

Abstract translation: 托盘包含一个或多个电路板进行处理。 用于接收电路板的托盘开口在一侧具有槽，用于将电路板的边缘和旋转夹在另一侧保持以接收和保持板的相对边缘。 每个夹子是安装成围绕中心轴线旋转并由制动器限制在两个角度位置的盘。 当处于一个位置时，盘中的凹口接收电路板，并且当处于另一位置时将板夹在座上。 切口足够深以允许板被横向移动以与测试装置对准。