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    Process for manufacturing a micromechanical structure having a buried area provided with a filter
    24.
    发明授权
    Process for manufacturing a micromechanical structure having a buried area provided with a filter 有权
    具有设置有过滤器的掩埋区域的微机械结构的制造方法

    公开(公告)号：US09061248B1

    公开(公告)日：2015-06-23

    申请号：US14133290

    申请日：2013-12-18

    Applicant: STMicroelectronics S.r.l.

    Inventor： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    IPC: H01L21/00 ,  B01D67/00 ,  B01D71/02 ,  B01L3/00 ,  F04B19/00

    CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

    Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

    Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面的部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。

    Process for manufacturing a micromechanical structure having a buried area provided with a filter
    25.
    发明授权
    Process for manufacturing a micromechanical structure having a buried area provided with a filter 有权
    具有设置有过滤器的掩埋区域的微机械结构的制造方法

    公开(公告)号：US08633553B2

    公开(公告)日：2014-01-21

    申请号：US13190254

    申请日：2011-07-25

    Applicant: Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    Inventor： Marco Ferrera ,  Matteo Perletti ,  Igor Varisco ,  Luca Zanotti

    IPC: H01L29/84 ,  H01L21/00

    CPC classification number: B81C1/00119 ,  B01D67/0062 ,  B01D71/02 ,  B01D2325/021 ,  B01D2325/028 ,  B01L3/502707 ,  B01L3/502753 ,  B01L2300/0681 ,  B81B2201/10 ,  B81C1/00071 ,  B81C1/00087 ,  B81C2201/0133 ,  B81C2201/0157 ,  F04B19/006

    Abstract: A process for manufacturing a micromechanical structure envisages: forming a buried cavity within a body of semiconductor material, separated from a top surface of the body by a first surface layer; and forming an access duct for fluid communication between the buried cavity and an external environment. The method envisages: forming an etching mask on the top surface at a first access area; forming a second surface layer on the top surface and on the etching mask; carrying out an etch such as to remove, in a position corresponding to the first access area, a portion of the second surface layer, and an underlying portion of the first surface layer not covered by the etching mask until the buried cavity is reached, thus forming both the first access duct and a filter element, set between the first access duct and the same buried cavity.

    Abstract translation: 微机械结构的制造方法设想：在半导体材料体内形成通过第一表面层从主体顶表面分离的掩埋腔; 以及形成用于在所述掩埋腔和外部环境之间流体连通的进入管。 该方法设想：在第一进入区域的顶表面上形成蚀刻掩模; 在顶表面和蚀刻掩模上形成第二表面层; 进行蚀刻，以在对应于第一进入区域的位置中移除第二表面层的一部分，以及未被蚀刻掩模覆盖的第一表面层的下面部分，直到达到掩埋空腔，因此 形成第一进入管道和过滤元件，设置在第一进入管道和相同的掩埋空腔之间。

    Method of fabricating a suspended micro-structure with a sloped support and a suspended microstructure fabricated by the method
    29.
    发明申请
    Method of fabricating a suspended micro-structure with a sloped support and a suspended microstructure fabricated by the method 有权
    通过该方法制造具有倾斜载体和悬浮微结构的悬浮微结构的方法

    公开(公告)号：US20020018964A1

    公开(公告)日：2002-02-14

    申请号：US09888989

    申请日：2001-06-25

    Inventor： Hubert Jerominek

    IPC: G03F007/00 ,  B44C001/22

    CPC classification number: B81C1/0019 ,  B81B2203/0118 ,  B81B2203/019 ,  B81B2203/0384 ,  B81C1/00396 ,  B81C2201/0157 ,  G03F7/2008

    Abstract: The method of fabricating a suspended microstructure with a sloped support, comprises the steps of (a) providing a member having three stacked up layers including a first substrate layer, a second temporary layer and a third photoresist layer; (b) photolithographically transferring a sloped pattern to the third photoresist layer by means of a grey scale mask; (c) etching the second layer through the third layer resulting from step (b) to obtain a surface with at least one continuous slope with a predetermined angle with respect to the first surface layer; (d) depositing a fourth layer on the previous layers; (e) etching the fourth layer to obtain the sloped support; and (f) removing the second layer to obtain the microstructure with the sloped support. The invention is also concerned with a suspended microstructure fabricated by the method.

    Abstract translation: 制造具有倾斜载体的悬浮微结构的方法包括以下步骤：（a）提供具有三层叠层的构件，其包括第一衬底层，第二临时层和第三光致抗蚀剂层; （b）通过灰度掩模将倾斜图案光刻地转印到第三光致抗蚀剂层; （c）通过由步骤（b）得到的第三层蚀刻第二层以获得具有相对于第一表面层具有预定角度的至少一个连续斜面的表面; （d）在先前的层上沉积第四层; （e）蚀刻第四层以获得倾斜的支撑; 和（f）除去第二层以获得具有倾斜载体的微结构。 本发明还涉及通过该方法制造的悬浮微结构。

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