公开(公告)号：US09401239B2

公开(公告)日：2016-07-26

申请号：US14687040

申请日：2015-04-15

Applicant: Electroninks Writeables, Inc.

Inventor： Michael A. Bell ,  Analisa Russo

IPC: H01F7/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01F7/0252 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/181 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/08 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2203/104

Abstract: An electrical component for attachment to paper and other substrates comprises, according to one embodiment, a functional electronic part including one or more support pillars on an underside thereof. Each of the support pillars comprises: a channel extending therethrough from a top opening to a bottom opening, where the top opening of the channel is adjacent to the functional electronic part; and a magnet moveably positioned in the channel in electrical contact with the functional electronic part, where the bottom opening of the channel has a width smaller than a maximum lateral dimension of the magnet.

Abstract translation: 根据一个实施例，用于附接到纸和其它基底的电气部件包括在其下侧上包括一个或多个支撑柱的功能电子部件。 每个支撑柱包括：从顶部开口延伸到底部开口的通道，其中通道的顶部开口与功能电子部件相邻; 以及可移动地定位在所述通道中的与所述功能电子部件电接触的磁体，其中所述通道的底部开口具有小于所述磁体的最大横向尺寸的宽度。

公开(公告)号：US20240337827A1

公开(公告)日：2024-10-10

申请号：US18631273

申请日：2024-04-10

Applicant: CANON KABUSHIKI KAISHA

Inventor： KOICHI ODAGAKI

IPC: G02B26/10 ,  H05K1/02 ,  H05K1/18

CPC classification number: G02B26/101 ,  H05K1/0271 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/08 ,  H05K2201/10121

Abstract: An image display device includes: a flexible board, a vibrational structure including a light reflecting film for reflecting light, and a molded circuit component including a mounting portion which is electrically connected to the vibrational structure and on which the vibrational structure is mounted and a connecting portion which is electrically and mechanically connected to the flexible board and which has a lower dynamic rigidity than the mounting portion. The flexible board and the vibrational structure are electrically connected via the molded circuit component.

公开(公告)号：US11950359B2

公开(公告)日：2024-04-02

申请号：US17841853

申请日：2022-06-16

Applicant: NIDEC SANKYO CORPORATION

Inventor： Ryo Uchiyama ,  Masaya Fujimoto

IPC: G06K7/08 ,  H05K1/02

CPC classification number: H05K1/0268 ,  G06K7/082 ,  H05K1/028 ,  H05K2201/08

Abstract: A card reader for use with a card may include a card insertion part provided with an insertion port into which the card is inserted, a protruded part which is provided on a front face of the card insertion part and is protruded to a front side with respect to the card insertion part, a breakage detection wiring which is provided in an inside of the protruded part, and a detection part which detects at least one of disconnection and a short circuit of the breakage detection wiring.

公开(公告)号：US20230413453A1

公开(公告)日：2023-12-21

申请号：US18459624

申请日：2023-09-01

Applicant: STEMCO CO., LTD.

Inventor： Sung Jin LEE ,  Kang Dong KIM ,  Chang Hoon HAN ,  Chul Ho YOON ,  Ho Byung KIM ,  Hyun Woo KIM ,  Gun Woo SHIN

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/4644 ,  H05K3/103 ,  H05K3/3405 ,  H05K1/181 ,  H05K2203/0502 ,  H05K2201/08

Abstract: A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.

公开(公告)号：US11744005B2

公开(公告)日：2023-08-29

申请号：US17237594

申请日：2021-04-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hideki Shinkai

IPC: H05K1/02 ,  H01L21/56 ,  H01L23/552 ,  H05K3/28 ,  H05K1/18 ,  H05K9/00

CPC classification number: H05K1/0218 ,  H01L21/56 ,  H01L23/552 ,  H05K3/284 ,  H05K1/181 ,  H05K9/0088 ,  H05K2201/0715 ,  H05K2201/08 ,  H05K2201/10098 ,  H05K2203/1322

Abstract: An electronic component module includes a board, an electronic component, a sealing portion, a metal layer, and a magnetic layer. The board has a first main surface. The electronic component is provided on a first main surface of the board. The sealing portion seals the electronic component. The metal layer covers the sealing portion. The magnetic layer is provided between the sealing portion and the metal layer. The magnetic layer has a magnetic main body and a first cover sheet. The first cover sheet is provided between the magnetic main body and the metal layer. The first cover sheet has a first main surface and a second main surface. The first main surface faces the magnetic main body. The second main surface faces the metal layer. The second outer peripheral end of the second main surface is located inside the first outer peripheral end of the first main surface.

公开(公告)号：US11657944B2

公开(公告)日：2023-05-23

申请号：US17627887

申请日：2021-03-24

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Yukie Tsuda ,  Yuichi Nakamura ,  Masanao Yamashita ,  Koji Nitta ,  Kou Noguchi

IPC: H01F7/20 ,  H05K1/02 ,  H01F27/06 ,  H01F7/02 ,  G02B27/64

CPC classification number: H01F7/20 ,  H01F7/02 ,  H01F27/06 ,  H05K1/028 ,  G02B27/646 ,  H01F2027/065 ,  H05K2201/08

Abstract: A flexible printed circuit board according to the present disclosures includes a base film having an insulating property, and a planar coil disposed on a surface of the base film, wherein a number of turns on an inside of a center point of a coil width of the planar coil in a plan view is greater than a number of turns on an outside of the center point.

公开(公告)号：US20160073491A1

公开(公告)日：2016-03-10

申请号：US14945073

申请日：2015-11-18

Applicant: CYNTEC CO., LTD.

Inventor： Chih-Tse Chen ,  Joseph D. S. Deng ,  Shih-Hsien Tseng

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. Any two adjacent Ethernet transformers are separately arranged with a gap having a second specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 任何两个相邻的以太网变压器分别布置有具有第二特定长度的间隙。

公开(公告)号：US20140016289A1

公开(公告)日：2014-01-16

申请号：US13935713

申请日：2013-07-05

Applicant: CYNTEC CO., LTD

Inventor： Chih-Tse Chen ,  Joseph D.S. Deng ,  Shih-Hsien Tseng

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H05K1/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K5/00 ,  H05K5/0026 ,  H05K7/00 ,  H05K9/0022 ,  H05K2201/08 ,  H05K2201/1003

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.

Abstract translation: 公开了一种网络通信设备。 网络通信设备包括电路板，网络连接器，网络芯片和多个网络磁性组件。 网络连接器，网络芯片和网络磁性组件设置在电路板上。 网络磁性组件分别与网络连接器和网络芯片电连接。 每个网络磁性组件包括以太网变压器和至少一个电感器。 以太网变压器通过电路板的导电迹线与电感器串联电连接。 以太网变压器和至少一个网络磁性组件的电感器之间的导电迹线的间隔距离或路径长度小于第一特定长度。

公开(公告)号：US12088208B1

公开(公告)日：2024-09-10

申请号：US18206890

申请日：2023-06-07

Applicant: Vicor Corporation

Inventor： Patrizio Vinciarelli

IPC: H02M3/335 ,  H01F1/44 ,  H01F3/10 ,  H01F27/28 ,  H01F41/04 ,  H02M1/44 ,  H02M3/337 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K3/00 ,  H05K3/02 ,  H02M1/00

CPC classification number: H02M3/33523 ,  H01F1/44 ,  H01F3/10 ,  H01F27/2804 ,  H01F41/041 ,  H02M1/44 ,  H02M3/33561 ,  H02M3/33592 ,  H02M3/3376 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/181 ,  H05K3/0011 ,  H05K3/02 ,  H01F1/447 ,  H01F2003/106 ,  H01F2027/2809 ,  H01F2027/2819 ,  H02M1/0058 ,  H02M1/008 ,  H05K1/0204 ,  H05K1/0265 ,  H05K2201/08 ,  H05K2201/086

Abstract: A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

公开(公告)号：US20230309240A1

公开(公告)日：2023-09-28

申请号：US17955855

申请日：2022-09-29

Applicant: Zhuhai ACCESS Semiconductor Co., Ltd

Inventor： Xianming CHEN ,  Xiaowei XU ,  Gao HUANG ,  Benxia HUANG

IPC: H05K3/06 ,  H05K3/00 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/064 ,  H05K3/0044 ,  H05K3/4647 ,  H05K1/0298 ,  H05K2203/025 ,  H05K2203/061 ,  H05K2203/143 ,  H05K2203/1446 ,  H05K2201/0376 ,  H05K2201/08

Abstract: A manufacturing method for a conductive substrate with a filtering function includes preparing a core layer and forming first and second conductive holes in the core layer, forming a sacrificial copper layer on the first conductive hole and on the core layer, forming a metal layer on the second conductive hole, forming a metal post in the first conductive hole, forming a lower insulating layer on the core layer, forming a lower insulative post in the second conductive hole, forming a magnet wrapping around the metal post to obtain a first conductive post, forming an upper insulating layer on the core layer, forming an upper insulative post in the second conductive hole to obtain a second conductive post, removing the upper insulating layer, the lower insulating layer, and the remaining sacrificial copper post layer, followed by flattening.