公开(公告)号：US5466535A

公开(公告)日：1995-11-14

申请号：US76590

申请日：1993-06-15

Applicant: David E. Higgins ,  Martin Wright

Inventor： David E. Higgins ,  Martin Wright

IPC: B32B27/08 ,  B32B27/30 ,  B32B27/36 ,  C08J5/12 ,  C08J7/04 ,  H05K1/03 ,  C08K5/12

CPC classification number: C08J7/047 ,  C08J5/124 ,  H05K1/036 ,  C08J2367/02 ,  C08J2433/00 ,  H05K2201/0145 ,  Y10T428/24901 ,  Y10T428/31797 ,  Y10T428/31913 ,  Y10T428/3192

Abstract: A polymeric film has a polyester substrate layer and a cross-linked adherent layer of an acrylic resin and a phthalate ester. The adherent layer exhibits improved adhesion to the substrate and to a range of subsequently applied layers, such as inks, lacquers, and vinyl chloride polymers.

Abstract translation: 聚合物膜具有聚酯基材层和丙烯酸树脂和邻苯二甲酸酯的交联粘合层。 粘附层对基材和随后施加的一些层，例如油墨，漆和氯乙烯聚合物具有改进的粘合性。

公开(公告)号：US5387493A

公开(公告)日：1995-02-07

申请号：US599428

申请日：1990-10-18

Applicant: Shinichiro Imabayashi ,  Hitoshi Oka ,  Isamu Tanaka ,  Hiroshi Kikuchi ,  Makio Watanabe

Inventor： Shinichiro Imabayashi ,  Hitoshi Oka ,  Isamu Tanaka ,  Hiroshi Kikuchi ,  Makio Watanabe

IPC: G03F7/027 ,  G03F7/004 ,  G03F7/028 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  G03C1/492

CPC classification number: H05K3/185 ,  G03F7/004 ,  G03F7/028 ,  H05K3/4661 ,  H05K2201/0145 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K3/0023 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4602

Abstract: A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.

Abstract translation: 用于形成导体图案的树脂组合物，其包含光固化树脂，光聚合引发剂，热固性树脂，热固性树脂的试剂，光敏半导体颗粒，并且如果需要，多官能不饱和化合物适合于在构型中形成非常细的导体图案， up方法。

公开(公告)号：US5346747A

公开(公告)日：1994-09-13

申请号：US996651

申请日：1992-12-24

Applicant: Vincent M. Vancho ,  Hak H. Wu ,  Yutao Ma ,  Erik L. Jorgensen

Inventor： Vincent M. Vancho ,  Hak H. Wu ,  Yutao Ma ,  Erik L. Jorgensen

IPC: B32B15/08 ,  C08J5/04 ,  D01F6/62 ,  D04H3/00 ,  D21H13/24 ,  H05K1/03 ,  B32B9/00

CPC classification number: H05K1/0366 ,  C08J5/04 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917

Abstract: Composite printed circuit board substrates having fiber reinforcement in a polymer matrix are disclosed. The fibers may be thermotropic melt processable liquid crystal polymer fibers.

Abstract translation: 公开了在聚合物基体中具有纤维增强的复合印刷电路板基板。 纤维可以是热致熔融加工的液晶聚合物纤维。

公开(公告)号：US5062939A

公开(公告)日：1991-11-05

申请号：US500979

申请日：1990-03-29

Applicant: Charles M. Roland ,  Mark F. Sonnenschein

Inventor： Charles M. Roland ,  Mark F. Sonnenschein

IPC: C08J7/06 ,  C23C14/04 ,  C23C14/20 ,  C23C14/58 ,  H05K3/04

CPC classification number: C23C14/042 ,  C08J7/06 ,  C23C14/20 ,  C23C14/58 ,  C23C14/5813 ,  H05K3/046 ,  C08J2367/02 ,  H05K2201/0145 ,  H05K2201/0317 ,  H05K2203/0528 ,  H05K2203/107

Abstract: Carbonyl-containing polymer films, such as PET, are selectively metallizedy contacting the films with a layer or film of metal, such as aluminum, and then irradiating selected portions of the surface of the film with infrared radiation thereby heating those selected portions of the film. The metal on or opposite the irradiated portions of the surface adhere to the film. The remaining metal may be readily removed. The process provides surprisingly good spatial resolution. The present process is particularly useful in the production of microcontacts for circuit boards.

Abstract translation: 通过使膜与金属如铝的层或膜接触，然后用红外辐射照射膜的表面的选定部分，从而将含有羰基的聚合物膜例如PET选择性地金属化， 电影。 表面的照射部分上或与其相对的金属附着在膜上。 剩余的金属可以容易地去除。 该过程提供令人惊讶的良好的空间分辨率。 本方法在生产电路板微接触器中特别有用。

公开(公告)号：US4572859A

公开(公告)日：1986-02-25

申请号：US722762

申请日：1985-04-15

Applicant: Yasuo Fushiki ,  Masaharu Abe ,  Masayuki Oizumi

Inventor： Yasuo Fushiki ,  Masaharu Abe ,  Masayuki Oizumi

IPC: B32B27/04 ,  B32B27/10 ,  H01B3/48 ,  H05K1/03 ,  B32B7/00

CPC classification number: B32B27/04 ,  B32B27/10 ,  H01B3/48 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  Y10S428/901 ,  Y10T428/24967 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/31692 ,  Y10T428/3179 ,  Y10T428/3188 ,  Y10T428/31906 ,  Y10T428/31967

Abstract: An electrical laminate comprising a plurality of fibrous cellulosic substrate layers and alternately interposed layers of cured epoxy or unsaturated polyester resin between the adjacent substrate layers, wherein each of the substrate layers is embedded in a matrix of said cured resin which is substantially integral with said layers of cured resin, and consists essentially of cellulosic fibers having thereon a coating of methylol group-containing resin such as aminoplast resins. The laminate may be unclad or cladded with a metal foil.

Abstract translation: 一种电气层压板，包括多个纤维状纤维素基材层，并且在相邻的基材层之间交替插入固化的环氧树脂或不饱和聚酯树脂层，其中每个基材层嵌入所述固化树脂的基质中，所述基质与所述层基本上成一体 的固化树脂，并且基本上由其上具有含羟甲基基团的树脂如氨基塑料树脂的涂层的纤维素纤维组成。 层压体可以用金属箔未包覆或包覆。

公开(公告)号：US4569885A

公开(公告)日：1986-02-11

申请号：US651122

申请日：1984-11-19

Applicant: Katsuhiko Yamaguchi ,  Seiki Kobayashi ,  Yasufumi Miyake ,  Akio Tsumura

Inventor： Katsuhiko Yamaguchi ,  Seiki Kobayashi ,  Yasufumi Miyake ,  Akio Tsumura

IPC: H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  B32B27/06

CPC classification number: H05K3/281 ,  H05K1/0326 ,  H05K2201/0145 ,  H05K3/386 ,  Y10S428/91 ,  Y10T428/24678 ,  Y10T428/269 ,  Y10T428/31797

Abstract: A polyester film for printed circuits to be used as a base in a printed circuit base plate or as a base and/or cover layer in a printed circuit board, which undergoes a degree of dimensional stability of not more than 1% in both the longitudinal and transverse directions when kept at 150.degree. C. for 30 minutes, and which is obtained by heat treating an extrusion molded and stretched polyester film at 150.degree. C. to 240.degree. C. without applying tension.

Abstract translation: 印刷电路用聚酯膜用作印刷电路基板中的基底或作为印刷电路板中的基底和/或覆盖层，其在纵向上均经历尺寸稳定度不超过1％ 在150℃下保持30分钟，通过将挤出成型拉伸的聚酯膜在150〜240℃下热处理而不施加张力而得到。

公开(公告)号：US4393111A

公开(公告)日：1983-07-12

申请号：US288689

申请日：1981-07-31

Applicant: Theodore H. Klein

Inventor： Theodore H. Klein

IPC: H05K1/03 ,  H05K3/02 ,  B32B3/10 ,  H05K1/00

CPC classification number: H05K3/022 ,  H05K1/0373 ,  H05K1/0326 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/09118 ,  Y10S428/901 ,  Y10T428/21 ,  Y10T428/24802 ,  Y10T428/2907 ,  Y10T428/3162 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31794

Abstract: Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.

公开(公告)号：US4372800A

公开(公告)日：1983-02-08

申请号：US223402

申请日：1981-01-08

Applicant: Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

Inventor： Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

IPC: B32B37/00 ,  B29C57/00 ,  B29C63/00 ,  B29C67/00 ,  B29C70/00 ,  B29C70/50 ,  B32B15/08 ,  B32B27/04 ,  B32B38/08 ,  D21H25/06 ,  H05K1/03 ,  H05K3/02 ,  C09J5/02

CPC classification number: B32B38/08 ,  B29C70/50 ,  B32B27/04 ,  D21H25/06 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K3/022 ,  Y10S428/901 ,  Y10T156/1085 ,  Y10T29/49124 ,  Y10T442/3431 ,  Y10T442/3528 ,  Y10T442/656 ,  Y10T442/67

Abstract: A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.

公开(公告)号：US4103102A

公开(公告)日：1978-07-25

申请号：US701591

申请日：1976-07-01

Applicant: Theodore Harold Klein

Inventor： Theodore Harold Klein

IPC: B32B15/04 ,  B32B15/08 ,  H05K1/03 ,  H05K1/00

CPC classification number: H05K1/0353 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2203/127

Abstract: An improved reinforced flexible printed wiring board is disclosed. The reinforcement in this printed wiring board is composed of a fabric woven from a yarn of plied continuous filaments of polyester and glass. The fabric is impregnated with an appropriate resin which is subsequently cured. This printed wiring board is found to have improved mechanical and thermal characteristics with little degradation in electrical properties.

公开(公告)号：US4005238A

公开(公告)日：1977-01-25

申请号：US556770

申请日：1975-03-10

Applicant: Joachim Gaehde ,  Adolf Gesierich ,  Ingrid Loeschcke

Inventor： Joachim Gaehde ,  Adolf Gesierich ,  Ingrid Loeschcke

IPC: C08J9/36 ,  C23C14/20 ,  H05K3/38 ,  B32B5/18

CPC classification number: C08J9/365 ,  C23C14/20 ,  H05K3/387 ,  H05K2201/0116 ,  H05K2201/0145 ,  H05K2203/0759 ,  Y10T428/249984 ,  Y10T428/24999 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/249993 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31554 ,  Y10T428/31562 ,  Y10T428/31565 ,  Y10T428/31587 ,  Y10T428/31605 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31692 ,  Y10T428/31736 ,  Y10T428/3175 ,  Y10T428/31786 ,  Y10T428/31859 ,  Y10T428/31935 ,  Y10T428/31942

Abstract: A metallized polymeric article in which the metal coating is more firmly adhered is provided by disposing between the polymeric substrate and the metal top coat a poromeric adhesive coating. The poromeric adhesive coating is produced by coating onto the substrate a solution or dispersion of a polymer which when coagulated by exposure to an atmosphere of a suitably high relative humidity coagulates to form a poromeric adhesive coating.

Abstract translation: 通过在聚合物基体和金属顶涂层之间设置一个多孔体粘合剂涂层来提供金属化聚合物制品，其中金属涂层更牢固地粘附。 通过在基底上涂布聚合物的溶液或分散体，通过暴露于合适高的相对湿度的气氛中凝结形成孔体系粘合剂涂层而将聚合物胶粘剂涂层涂覆到基底上。