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    A PRINTED CIRCUIT BOARD
    291.
    发明申请
    A PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板

    公开(公告)号：WO0042679A3

    公开(公告)日：2000-11-30

    申请号：PCT/GB0000051

    申请日：2000-01-12

    Applicant: AUSTIN TAYLOR COMM LTD ,  LEWIS IAIN THOMAS

    Inventor： LEWIS IAIN THOMAS

    IPC: H01R4/24 ,  H01R12/51 ,  H01R12/72 ,  H05K1/11 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  H01R12/16 ,  H01R12/04 ,  H01R12/18

    CPC classification number: H05K1/119 ,  H01R4/2416 ,  H01R12/515 ,  H01R12/721 ,  H05K1/117 ,  H05K3/306 ,  H05K3/326 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10287 ,  H05K2201/1059 ,  H05K2201/10863

    Abstract: A printed circuit board comprises a substrate (1) of an electrically insulating material, a plurality of electrical current carrying paths (2) of electrically conductive material on the substrate and a plurality of integrally formed insulation displacement connectors (4) connected to the paths. The connectors may be edge connectors, or connectors within the periphery of the board or a combination of both. An edge connector is formed with a slot (5) which may be at an angle to the plane of the board. A connector within the periphery of the board comprises a larger diameter portion leading to a slot and means for pushing an insulated conductor inserted in the larger diameter portion into the slot. This arrangement results in fewer components to assemble, higher frequency performance, reduced cross-talk, space savings and lower costs.

    Abstract translation: 印刷电路板包括电绝缘材料的衬底（1），在衬底上的多个导电材料的电流承载路径（2）以及连接到路径的多个一体形成的绝缘位移连接器（4）。 连接器可以是边缘连接器，或者板的外围内的连接器或两者的组合。 边缘连接器形成有槽（5），该槽可以与板的平面成一定角度。 电路板周边内的连接器包括通向槽的较大直径部分和用于将插入较大直径部分的绝缘导体推入槽中的装置。 这种安排导致组装更少的组件，更高的频率性能，减少的串扰，节省空间和更低的成本。

    HYBRID CIRCUIT WITH CONTACT SURFACES (SOLDER PADS)
    292.
    发明申请
    HYBRID CIRCUIT WITH CONTACT SURFACES (SOLDER PADS) 审中-公开
    WITH焊盘混合电路（焊盘）

    公开(公告)号：WO99051070A1

    公开(公告)日：1999-10-07

    申请号：PCT/DE1999/000736

    申请日：1999-03-16

    IPC: H05K1/03 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

    CPC classification number: H05K3/3442 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10984 ,  Y02P70/613

    Abstract: The invention relates to a plate-shaped ceramic circuit substrate (4) which can be vertically mounted on a mother board. A row of contact surfaces (solder pads) (1) is provided close to a lower edge (6) enabling the circuit to be connected to contacts belonging to the mother board. In order to ensure greater solderability even when the contact surfaces (1) are small, the solder pads extend as far as the lower edge (6) and a recess (2) cuts through the circuit substrate (4) and runs from the lower front face (5) of the circuit substrate (4) up to the respective contact surface (1). Said recess forms a solder deposit (3).

    Abstract translation: 在垂直安装的母板板状陶瓷电路载体（4）上的一系列端子区（焊料焊盘）（1）的用于将电路与母板的接触端子在靠近底部边缘（6）提供。 对于即使使用小垫更好的可焊性（1）此延伸到下边缘（6）向下并且其分别穿过一个通电路载体（4），从下端面（5）延伸的电路载体（4）的向上到相应的 垫（1）延伸的凹部（2）被提供，其形成焊料沉积物（3）。

    MOULDED SOCKETS FOR ELECTRONIC COMPONENT ATTACHMENT
    293.
    发明申请
    MOULDED SOCKETS FOR ELECTRONIC COMPONENT ATTACHMENT 审中-公开
    电子元件附件的模制插座

    公开(公告)号：WO1998044769A1

    公开(公告)日：1998-10-08

    申请号：PCT/GB1997003558

    申请日：1997-12-31

    Applicant: FORD MOTOR COMPANY ,  FORD MOTOR COMPANY LIMITED

    Inventor： FORD MOTOR COMPANY ,  FORD MOTOR COMPANY LIMITED ,  GLOVATSKY, Andrew, Zachary ,  TODD, Michael, George ,  PHAM, Cuong, Van

    IPC: H05K01/18

    CPC classification number: H05K3/326 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/183 ,  H05K1/184 ,  H05K3/284 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  Y02P70/611

    Abstract: There is disclosed herein an electrical circuit assembly which requires no solder processing, comprising an electronic component (10) having terminations (14) arranged on at least one of its surfaces, and a moulded curviplanar substrate (20) having circuit traces (30) thereon and a cavity (24) formed therein, wherein the cavity (24) substantially conforms in shape with the electronic component (10). Proximate the cavity (24) is a plurality of electrical contacts (40), arranged in matched relation with the respective terminations (14) of the electronic component (10), with at least one of the electrical contacts (40) being connected to at least one of the circuit traces (30) on the substrate (20). The cavity (24) and electrical contacts (40) are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component (10) is held within the cavity (24) when the component (10) is placed therein. The component (10) is disposed in the cavity (24) such that its terminations (14) are in physical and electrical connection with their respective electrical contacts (40).

    Abstract translation: 这里公开了不需要焊料处理的电路组件，其包括具有布置在其表面中的至少一个上的端子（14）的电子部件（10），以及在其上具有电路迹线（30）的模制的半平面基板（20） 和形成在其中的空腔（24），其中所述空腔（24）基本上与电子部件（10）形成一致。 近似空腔（24）是与电子部件（10）的相应端子（14）配合关系的多个电触头（40），其中至少一个电触点（40）连接到 在衬底（20）上的至少一个电路迹线（30）。 空腔（24）和电触点（40）的尺寸被设计成使得在部件的端子和电触点之间提供过盈配合，使得当部件（10）被安装在腔体（24）内时， 放在其中 组件（10）设置在空腔（24）中，使得其端子（14）与它们各自的电触点（40）物理和电连接。

    ELECTRICAL DEVICES
    294.
    发明申请
    ELECTRICAL DEVICES 审中-公开
    电气设备

    公开(公告)号：WO1994001876A1

    公开(公告)日：1994-01-20

    申请号：PCT/US1993006480

    申请日：1993-07-08

    Applicant: RAYCHEM CORPORATION

    Inventor： RAYCHEM CORPORATION ,  GRAVES, Gregory, A. ,  ZHANG, Michael ,  CHANDLER, Daniel ,  CHANG, Chi-Ming ,  FANG, Shou-Mean

    IPC: H01C01/14

    CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

    Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

    Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，该装置包括：（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分和 电阻元件的主要部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 与电阻元件的主要部分。 这样的装置可以以各种方式固定到电路板，并且可弹性变形的端子。

    WIRING SUBSTRATE, MULTI-PATTERN WIRING SUBSTRATE, AND MANUFACTURING METHOD THEREFOR
    296.
    发明公开
    WIRING SUBSTRATE, MULTI-PATTERN WIRING SUBSTRATE, AND MANUFACTURING METHOD THEREFOR 审中-公开
    布线基板多个结构化布线基板及其制造方法

    公开(公告)号：EP2712281A4

    公开(公告)日：2015-06-24

    申请号：EP12785591

    申请日：2012-02-01

    Applicant: NGK SPARK PLUG CO

    Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

    IPC: H05K1/02 ,  H05K3/00

    CPC classification number: H05K1/0306 ,  H05K1/113 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T428/24479 ,  Y10T428/24612

    Abstract: Provided are a wiring substrate having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate 1a includes a substrate main body kp which is formed of a plurality of stacked ceramic layers S, which has a rectangular shape in plan view, which has a pair of opposite first and second main surfaces 3 and 2, and which has side surfaces 4 each being located between the paired main surfaces 3 and 2, and having a groove surface 6 located on a side toward the first main surface (back surface) 3 and a fracture surface 5 located between the groove surface 6 and the second main surface 2; and a notch 11 which has a concave shape in plan view, and which is provided on a side surface 4 only on a side toward the first main surface 3 so as to extend in a thickness direction of the side surface 4, wherein, in the side surface 4 having the notch 11, the boundary 7 between the groove surface 6 and the fracture surface 5 has first curved portions R1 on opposite sides of the notch 11, the first curved portions R1 being convex toward the first main surface 3 of the substrate main body kp in side view; and also has a second curved portion R2 on a second-main-surface side of the notch 11, the second curved portion R2 being convex toward the second main surface (front surface) 2 of the substrate main body kp in side view.

    CERAMIC WIRING BOARD, MULTI-PATTERN CERAMIC WIRING BOARD, AND METHOD FOR PRODUCING SAME
    297.
    发明公开
    CERAMIC WIRING BOARD, MULTI-PATTERN CERAMIC WIRING BOARD, AND METHOD FOR PRODUCING SAME 审中-公开
    陶瓷板，多个结构化陶瓷电路板的及其制造方法

    公开(公告)号：EP2701469A4

    公开(公告)日：2015-03-18

    申请号：EP12773834

    申请日：2012-02-01

    Applicant: NGK SPARK PLUG CO

    Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

    IPC: H05K1/02 ,  H05K3/00

    CPC classification number: H05K1/0298 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/46 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2203/0346 ,  Y10T29/49155

    Abstract: Provided are a ceramic wiring substrate having few burrs in the vicinity of a notch provided on a side surface of a substrate main body, in which a conductor layer provided on the inner wall of the notch exhibits excellent solderability; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate 1a includes a substrate main body 2a which has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 8a located on a side toward the front surface 3 and a fracture surface 7 located on a side toward the back surface 4; and a notch 6 which has a concave shape in plan view, and which is provided on at least one of the side surfaces 5 so as to extend between the front surface 3 and the back surface 4, wherein, in the side surface 5 having the notch 6, the boundary 11 between the groove surface 8a and the fracture surface 7 has curved portions 11r on opposite sides of the notch 6, the curved portions 11r being convex toward the front surface 3 of the substrate main body 2a in side view.

    SURFACE MOUNT CIRCUIT BOARD INDICATOR
    298.
    发明公开
    SURFACE MOUNT CIRCUIT BOARD INDICATOR 有权
    INDIKATORFÜROBERFLÄCHENMONTIERTELEITERPLATTE

    公开(公告)号：EP2286468A4

    公开(公告)日：2013-11-06

    申请号：EP09743402

    申请日：2009-05-04

    Applicant: DIALIGHT CORP

    Inventor： OESTERHELD KLAUS ,  JENKINS KENNETH

    IPC: H05K1/14 ,  H05K3/36

    CPC classification number: F21K9/20 ,  F21K9/30 ,  F21W2111/00 ,  H05K1/141 ,  H05K1/181 ,  H05K3/366 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10106

    Abstract: The present invention is directed to a surface mount circuit board indicator. In one embodiment the surface mount circuit board indicator includes a printed circuit board (PCB) having at least one light emitting diode (LED) die, one or more traces and at least one lens, a housing comprising at least one opening on a side along a perimeter of the housing, wherein the PCB is coupled to the housing such that a light output surface of the at least one LED die faces a same direction as the at least one opening and at least one alignment pin coupled to the housing.

    Abstract translation: 本发明涉及一种表面贴装电路板指示器。 在一个实施例中，表面贴装电路板指示器包括具有至少一个发光二极管（LED）裸片，一个或多个迹线和至少一个透镜的印刷电路板（PCB），壳体包括沿着一侧的至少一个开口 壳体的周边，其中PCB耦合到壳体，使得至少一个LED管芯的光输出表面面向与至少一个开口相同的方向，以及耦合到壳体的至少一个对准销。

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