公开(公告)号：US10036546B2

公开(公告)日：2018-07-31

申请号：US15334439

申请日：2016-10-26

Applicant: Koito Manufacturing Co., Ltd.

Inventor： Noriaki Ito

IPC: B60Q1/06 ,  F21V29/00 ,  F21V29/80 ,  H01L33/62 ,  F21V23/06 ,  H01L33/52 ,  F21Y115/10 ,  F21Y115/30

CPC classification number: F21V29/80 ,  F21V23/06 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/0278 ,  H05K3/0014 ,  H05K3/202 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2203/1327

Abstract: According to the present disclosure, a first optical system includes a first light source and emits a first illumination light. A second optical system includes a second light source and emits a second illumination light. A controller controls turning-on/off of the first light source and the second light source. The first optical system and the second optical system are configured such that a first illumination standard is satisfied by the first illumination light and the second illumination light. The first optical system is configured such that a second illumination standard is satisfied by the first illumination light. The controller allows the turning-on of the first light source when the turning-on of the second light source is disabled, and prohibits the turning-on of the second light source when the turning-on of the first light source is disabled.

公开(公告)号：US09849297B2

公开(公告)日：2017-12-26

申请号：US15356466

申请日：2016-11-18

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC.

Inventor： Robert J Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  David Zhou

IPC: A61N1/36 ,  A61N1/375 ,  A61N1/05 ,  H05K1/11 ,  H01L23/498 ,  H05K1/18 ,  H01L23/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/18

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US20170290145A1

公开(公告)日：2017-10-05

申请号：US15507431

申请日：2015-08-31

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Hiroshi TAJIMA ,  Masahiro WATANABE

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K1/09

CPC classification number: H05K1/0281 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/09 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0715 ,  H05K2201/09136 ,  H05K2201/1028 ,  H05K2201/2009

Abstract: A reinforcing member for a flexible printed wiring board allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential. The reinforcing member includes a metal base and a nickel layer formed on a surface of the metal base. The nickel layer includes phosphorus in a range from 5.0 percent by mass to 20.0 percent by mass, the rest of the nickel layer is nickel and inevitable impurities, and the nickel layer is 0.2 μm to 0.9 μm thick.

公开(公告)号：US20170095671A1

公开(公告)日：2017-04-06

申请号：US15356466

申请日：2016-11-18

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC.

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  David Zhou

IPC: A61N1/375 ,  A61N1/36 ,  H05K1/11 ,  H05K3/18 ,  H05K1/18 ,  H01L23/00 ,  H05K3/32 ,  H05K3/34 ,  A61N1/05 ,  H01L23/498

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US20160255722A1

公开(公告)日：2016-09-01

申请号：US15150234

申请日：2016-05-09

Applicant: International Business Machines Corporation

Inventor： Michael A. Christo ,  Julio A. Maldonado ,  Roger D. Weekly ,  Tingdong Zhou

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/112 ,  H05K1/0263 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/1028 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.

Abstract translation: 可以根据各种技术向电子模块供电。 在一般的实施方案中，例如，用于向电子模块供电的系统可以包括印刷电路板，电子模块和导电箔。 板可以包括在第一侧上的多个接触位置，其中至少一个接触位置电耦合到通孔到板的第二侧。 电子模块可以电耦合到板的第一侧上的接触位置，并且通过电耦合到通孔的至少一个接触位置接收电力。 箔可以适于传送用于电子模块的电力并且电耦合到电路板的第二侧上至少通过电气耦合到接收用于电子模块的电力的接触位置的通孔。

公开(公告)号：US09408305B2

公开(公告)日：2016-08-02

申请号：US14947558

申请日：2015-11-20

Applicant: MC10, Inc.

Inventor： Yung-Yu Hsu

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/16 ,  H01R9/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：US20160133596A1

公开(公告)日：2016-05-12

申请号：US14997919

申请日：2016-01-18

Applicant: Intel Corporation

Inventor： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Andryushchenko ,  Guanghai Xu

IPC: H01L23/00 ,  H01L21/033

CPC classification number: H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract translation: 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。

公开(公告)号：US20150237738A1

公开(公告)日：2015-08-20

申请号：US14429070

申请日：2013-08-30

Applicant: JUMATECH GMBH

Inventor： Markus Wölfel

IPC: H05K3/10 ,  H05K1/09

CPC classification number: H05K3/10 ,  H05K1/09 ,  H05K3/103 ,  H05K3/385 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/1028 ,  H05K2201/10287 ,  Y10T29/302

Abstract: A method for producing a circuit board element, and a corresponding circuit board element, with which it is possible to suppress the risk of delamination in the region of a component (e.g. a wire or a plate-like shaped part) that is embedded in the circuit board element. To this end, the present invention suggests that the surface of the component should be roughened, at least partially, in order to ensure a better adhesive bond with the surrounding cover layer (e.g. a prepreg made of an insulating material compound). The component surface can be roughened by chemical methods such as etching or by purely mechanical methods such as sand blasting.

Abstract translation: 一种用于制造电路板元件的方法和相应的电路板元件，通过该方法可以抑制嵌入在该电路板元件中的部件（例如线或板状成形部）的区域中的分层的风险 电路板元件。 为此，本发明提出，至少部分地，组件的表面应该被粗糙化，以确保与周围的覆盖层（例如，由绝缘材料化合物制成的预浸料）的更好的粘合剂粘结。 组分表面可以通过诸如蚀刻的化学方法或通过纯机械方法如喷砂来粗糙化。

公开(公告)号：US20150022980A1

公开(公告)日：2015-01-22

申请号：US14370516

申请日：2013-01-04

Applicant: Access Business Group International LLC

Inventor： Joseph C. Van Den Brink ,  Sean T. Eurich ,  Neil W. Kuyvenhoven ,  Kaitlyn J. Turner ,  Benjamin C. Moes ,  Hai D. Nguyen

IPC: H05K7/02 ,  H05K13/00 ,  H05K1/16 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K7/02 ,  H01F27/2804 ,  H01F38/14 ,  H05K1/028 ,  H05K1/092 ,  H05K1/111 ,  H05K1/165 ,  H05K3/361 ,  H05K13/00 ,  H05K2201/032 ,  H05K2201/0329 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/1028 ,  H05K2201/10386 ,  H05K2201/10401 ,  Y10T29/49117

Abstract: An item of print media (30) including an inductive secondary (50) for providing power to a load (32). The inductive secondary is responsive to an electromagnetic flux to generate a time-varying current or voltage therein. The current or voltage induced in the inductive secondary directly or indirectly powers the load to thereby enhance the functionality and/or the appeal of the item of print media without significantly adding to its cost. The load can provide a visual and/or auditory output, and can include an electroluminescent display, an e-ink display, a piezo speaker coil, an electrostatic speaker, an OLED, an LED or an LCD display. Embodiments of the invention can be utilized in connection with a wide variety of print media, including for example books, booklets, pamphlets, labels, magazines, manuals, brochures, maps, charts, posters, journals, newspapers or loose leaf pages.

Abstract translation: 一种包括用于向负载（32）提供电力的感应次级（50）的打印介质（30）的项目。 电感次级电流响应于电磁通量以在其中产生时变电流或电压。 感应次级中引起的电流或电压直接或间接地为负载供电，从而增强打印介质的功能和/或吸引力，而不会显着增加其成本。 负载可以提供视觉和/或听觉输出，并且可以包括电致发光显示器，电子墨水显示器，压电扬声器线圈，静电扬声器，OLED，LED或LCD显示器。 本发明的实施例可以用于各种各样的打印介质，包括例如书籍，小册子，小册子，标签，杂志，手册​​，小册子，地图，图表，海报，期刊，报纸或散页页。

公开(公告)号：US08931166B2

公开(公告)日：2015-01-13

申请号：US13881987

申请日：2012-05-21

Applicant: Tom Marttila

Inventor： Tom Marttila

IPC: H05K3/00 ,  H05K3/46 ,  G06K19/077 ,  H01L23/498

CPC classification number: H05K3/46 ,  G06K19/07749 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/1028 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A manufacturing method of electrical bridges, wherein a conductive pattern (2) from electroconductive material, such as metal foil, is applied over a substrate (1) made of electrically insulating material and the electroconductive material has at least one strip tongue (3) unattached to the substrate, one side of the tongue is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).

Abstract translation: 电桥的制造方法，其中将导电材料（例如金属箔）的导电图案（2）施加在由电绝缘材料制成的基板（1）上，并且导电材料具有至少一个带状舌（3）未连接 在所述基板上，所述舌片的一侧与所述导电图案（2）连接，并且所述带状舌片（3）折叠在与所述导电图案（2）电绝缘的区域上，并且所述带状舌片（3）为 电连接到导电图案（2）的预定的另一部分（5）。