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公开(公告)号：WO01066460A1
公开(公告)日：2001-09-13
申请号：PCT/JP2001/001803
申请日：2001-03-08
IPC: B25J7/00 , B81B3/00 , B81B7/00 , B82B3/00 , G01Q30/20 , G01Q70/00 , G01Q70/12 , G01Q70/14 , G01Q80/00 , B82B1/00
CPC classification number: B25J7/00 , B81B2201/032 , B81B2201/12 , B81B2203/0118 , B81C99/002 , B82B3/00 , G01Q80/00 , Y10S977/732 , Y10S977/734 , Y10S977/742 , Y10S977/778 , Y10S977/78 , Y10S977/837 , Y10S977/842 , Y10S977/858 , Y10S977/863 , Y10S977/875 , Y10S977/876 , Y10S977/89 , Y10S977/901 , Y10S977/962
Abstract: A pair of electrostatic nanotweezers (2) is characterized by comprising a plurality of nanotubes extending from their proximal ends at which they are fixed to a holder (6), coating films with which the surfaces of these nanotubes are insulation coated, and two lead wires (10, 10) connected to two (8, 9) of these nanotubes, wherein a voltage is applied across the lead wires to produce an electrostatic attractive force by which the front ends of the two nanotubes are made openable and closable, thereby gripping a nanosubstance therebetween. Further, if a piezoelectric film (32) is formed on the surface of each nanotube (9) and caused to stretch and contract so as to make the front ends of the nanotubes openable and closable, then any nanosubstance, whether dielectric, semiconductor or conductor, can be handled. Further, if three nanotubes are made openable and closable by the electrostatic system, nanosubstances of any desired shape, such as spherical or linear, can be handled. Further, gripping, moving and discharging of nanosubstances are facilitated by constituting a nanomanipulator in combination with a three-dimensional driving mechanism.
Abstract translation: 一对静电纳米管（2）的特征在于包括从其近端延伸的多个纳米管，它们固定在支架（6）上，涂覆有这些纳米管的表面的涂膜被绝缘涂覆，以及两根引线 （10,10），其连接到这些纳米管的两个（8,9），其中跨过引线施加电压以产生静电吸引力，通过该吸引力将两个纳米管的前端制成可打开和关闭，从而夹紧 纳米级之间。 此外，如果在每个纳米管（9）的表面上形成压电膜（32）并使其拉伸和收缩以使纳米管的前端能够打开和关闭，则任何纳米级（无论是电介质的，半导体的还是导体的） ，可以处理。 此外，如果使三个纳米管可由静电系统打开和关闭，则可以处理任何所需形状（例如球形或线性）的纳米级。 此外，通过与三维驱动机构结合构成纳米机械手，便于纳米级的夹持，移动和放电。
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公开(公告)号：WO00073839A1
公开(公告)日：2000-12-07
申请号：PCT/US2000/013759
申请日：2000-05-19
CPC classification number: B81C1/00666 , B81B2201/032 , B81B2203/0118 , B81C2201/0167 , G02B6/353 , G02B6/3566 , G02B6/357 , G02B6/3594 , H01H59/0009 , H01H2059/0081
Abstract: A MEMS (Micro Electro Mechanical System) electrostatic device operated with lower and more predictable operating voltages is provided. An electrostatic actuator, an electrostatic attenuator of electromagnetic radiation, and a method for attenuating electromagnetic radiation are provided. Improved operating voltage characteristics are achieved by defining a non increasing air gap between the substrate electrode and flexible composite electrode within the electrostatic device. A medial portion of a multilayer flexible composite overlying the electromechanical substrate is held in position regardless of the application of electrostatic force, thereby sustaining the defined air gap. The air gap is relatively constant in separation from the underlying microelectronic surface when the medial portion is cantilevered in one embodiment. A further embodiment provides an air gap that decreases to zero when the medial portion approaches and contacts the underlying microelectronic surface. A moveable distal portion of the flexible composite is biased to curl naturally due to differences in thermal coefficients of expansion between the component layers. In response to electrostatic forces, the distal portion moves and thereby alters the distance separating the flexible composite from the underlaying microelectronic surface. Structures and techniques for controlling bias in the medial portion and the resulting air gap are provided. The electrostatic device may be disposed to selectively clear or intercept the path of electromagnetic radiation. Materials used in the attenuator can be selected to pass, reflect, or absorb various types of electromagnetic radiation. A plurality of electromagnetic attenuators may be disposed in an array and selectively activated in subsets.
Abstract translation: 提供了具有更低和更可预测的工作电压的MEMS（微机电系统）静电装置。 提供静电致动器，电磁辐射的静电衰减器和用于衰减电磁辐射的方法。 通过在静电装置内限定衬底电极和柔性复合电极之间的不增加的空气间隙来实现改进的工作电压特性。 覆盖机电衬底的多层柔性复合体的中间部分保持在适当的位置，而不管施加静电力，从而维持限定的气隙。 在一个实施例中，当中间部分为悬臂时，气隙与下面的微电子表面分离时相对恒定。 另一实施例提供了当内侧部分靠近并接触下面的微电子表面时减小到零的气隙。 柔性复合材料的可移动远端部分被偏置以由于组件层之间的热膨胀系数的差异而自然地卷曲。 响应于静电力，远端部分移动，从而改变将柔性复合材料与垫层微电子表面分开的距离。 提供了用于控制中间部分中的偏压和产生的气隙的结构和技术。 静电装置可以设置成选择性地清除或拦截电磁辐射的路径。 衰减器中使用的材料可以选择通过，反射或吸收各种类型的电磁辐射。 多个电磁衰减器可以被布置成阵列并且选择性地在子集中激活。
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323.发明公开公开(公告)号：US20240158223A1
公开(公告)日：2024-05-16
申请号：US18421596
申请日：2024-01-24
Inventor： John PK Walton , LaVern A. Starman , David Torres Reyes
CPC classification number: B81B3/0043 , G02B26/0833 , G02B26/0841 , G02B26/0866 , B81B2201/032 , B81B2201/042 , B81B2203/053 , B81B2203/058
Abstract: An actuator element of a MEMS device on a substrate able to create large, out-of-plane deflection includes two separated metallic layers contacting the substrate. The second metallic layer has a first portion contacting the substrate and a second portion having cantilevered over the substrate and first metallic layer. A first insulating layer contacts the cantilevered metallic layer on a bottom contacting surface and a second insulating layer contacting the cantilevered metallic layer on a portion of a top contacting surface. The second, cantilevered portion of the metallic layer is prestressed causing the distal end to deform away from the substrate. Applying a voltage potential between the first and second metallic layers creates an electrostatic field drawing the distal end toward the substrate.
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公开(公告)号：US20230382722A1
公开(公告)日：2023-11-30
申请号：US18366201
申请日：2023-08-07
Inventor： Frank SENGER , Shanshan GU-STOPPEL , Erdem YARAR , Gunnar WILLE
CPC classification number: B81C1/00317 , B81B7/0041 , B81C2203/0118 , B81C2201/0123 , B81B2201/032 , B81B2201/042 , B81B2203/0163
Abstract: A method for encapsulating an MEMS structure in a stack structure includes providing a functional wafer structure including at least partly the MEMS structure. The method includes arranging the functional wafer structure and a glass wafer in the stack structure and along a stacking direction and is performed such that a cavity, in which at least part of the MEMS structure is arranged, is closed on one side along the stacking direction by the glass wafer and such that a spacing structure is arranged between the part of the MEMS structure and the glass wafer in the stack structure to provide a spacing between the part of the MEMS structure and the glass wafer along the stacking direction, such that the spacing structure encloses part of the cavity.
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公开(公告)号：US11696507B2
公开(公告)日：2023-07-04
申请号：US16706567
申请日：2019-12-06
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Domenico Giusti , Carlo Luigi Prelini
CPC classification number: H10N30/2042 , B81B3/0018 , B81B3/0072 , B81B2201/032
Abstract: A MEMS device having a body with a first and a second surface, a first portion and a second portion. The MEMS device further has a cavity extending in the body from the second surface; a deformable portion between the first surface and the cavity; and a piezoelectric actuator arranged on the first surface, on the deformable portion. The deformable portion has a first region with a first thickness and a second region with a second thickness greater than the first thickness. The second region is adjacent to the first region and to the first portion of the body.
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Patent Agency Ranking
326.发明申请公开(公告)号：US20190161338A1
公开(公告)日：2019-05-30
申请号：US16197810
申请日：2018-11-21
Applicant: STMicroelectronics S.r.l.
Inventor： Domenico GIUSTI , Carlo Luigi PRELINI
IPC: B81B3/00
CPC classification number: B81B3/0037 , B81B2201/0257 , B81B2201/032 , B81B2203/0127 , H01L41/0933 , H01L41/0953 , H04R17/00 , H04R2201/003 , H04R2217/00
Abstract: A micro-electro-mechanical actuator device includes a fixed structure and a mobile structure. The mobile structure includes a first deformable band, a second deformable band, and a third deformable band, both of which extend on opposite sides of the first deformable band, each of which carries a piezoelectric actuator. In a working condition, in which the second and third piezoelectrics are biased, the second and third deformable bands are subjected to a negative bending, while the first deformable band is subjected to a positive bending. There are thus generated two translations that add together, causing a displacement of the first deformable band greater than the one that may be obtained by a single membrane of an equal base area.
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327.发明申请公开(公告)号：US20180216178A1
公开(公告)日：2018-08-02
申请号：US15886511
申请日：2018-02-01
Applicant: SEAGATE TECHNOLOGY LLC
Inventor： Kim Yang LEE , Thomas Young CHANG , David S. KUO , ShuaiGang XIAO , Xiaomin YANG , Koichi WAGO
IPC: C12Q1/6869 , G01N27/327 , G01N27/447 , B81C1/00
CPC classification number: C12Q1/6869 , B01L3/502707 , B01L2300/0645 , B01L2300/0816 , B01L2300/0887 , B01L2300/0896 , B81B2201/032 , B81B2201/058 , B81B2203/0109 , B81C1/00071 , G01N27/3278 , G01N27/447 , G01N27/44791 , C12Q2565/607 , C12Q2565/629
Abstract: A DNA sequencing device and related methods, wherein the device includes a substrate, a nanochannel formed in the substrate, a first electrode positioned on a first side of the nanochannel, and a second electrode. The second electrode is positioned on a second side of the nanochannel opposite the first electrode, and is spaced apart from the first electrode to form an electrode gap that is exposed in the nanochannel. At least a portion of first electrode is movable relative to the second electrode to decrease a size of the electrode gap.
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328.发明申请公开(公告)号：US20180107854A1
公开(公告)日：2018-04-19
申请号：US15853396
申请日：2017-12-22
Applicant: INVENSENSE, INC.
Inventor： Julius Ming-Lin Tsai , Mike Daneman , Sanjiv Kapoor
CPC classification number: G06K9/0002 , B06B1/0666 , B06B1/067 , B06B2201/70 , B81B7/007 , B81B2201/0271 , B81B2201/032 , B81B2203/0127 , B81B2207/012 , B81B2207/015 , B81C1/00238 , B81C1/00246 , B81C1/00301 , B81C2201/0105 , B81C2201/0109 , B81C2203/035 , B81C2203/036 , B81C2203/0792 , G01H11/08
Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
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公开(公告)号：US20170327370A1
公开(公告)日：2017-11-16
申请号：US15367766
申请日：2016-12-02
Applicant: INVENSENSE, INC.
Inventor： Julius Ming-Lin Tsai , Michael J. Daneman
CPC classification number: B81B7/007 , B81B3/0029 , B81B2201/032 , B81B2207/012 , B81B2207/07 , B81C1/00182 , B81C1/00269 , B81C1/00301 , B81C2201/013 , B81C2201/019 , B81C2203/0109 , B81C2203/0792
Abstract: A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a third surface bonded to the insulating layer and a fourth surface; a piezoelectric layer deposited over the fourth surface of the device layer; a metal conductivity layer disposed over the piezoelectric layer; a bond layer disposed over a portion of the metal conductivity layer; and a stand-off formed on the first silicon substrate; wherein the first silicon substrate is bonded to a second silicon substrate, comprising: a metal electrode configured to form an electrical connection between the metal conductivity layer formed on the first silicon substrate and the second silicon substrate.
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公开(公告)号：US20170276929A1
公开(公告)日：2017-09-28
申请号：US15511040
申请日：2015-09-16
Applicant: President and Fellows of Harvard College
Inventor： Zhi Ern TEOH , Michael KARPELSON , Robert J. WOOD
CPC classification number: G02B26/085 , B81B3/0051 , B81B2201/032 , B81B2201/047 , B81C1/00007 , G02B26/0858 , H01L41/0933 , H02K15/00 , H02K26/00 , H02K33/16 , H02K99/20
Abstract: A pop-up laminate structure includes rigid layers, at least one flexible layer, at least one optical component, and an actuator. At least one of the rigid layers defines gaps extending there through to form a plurality of rigid segments separated by the gaps in the rigid layer. The flexible layer is bonded to the rigid segments to form joints for folding. The optical component is mounted to a rigid layer and configured to generate, capture or alter a light beam. The actuator is mounted to at least one of the rigid layers and configured to displace at least one rigid segment that, in turn, displaces the optical component. At least some of the layers are bonded to adjacent layers only at selected locations forming islands of inter-layer bonds to allow expansion of the laminate into an expanded three-dimensional structure.
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