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    IMPRINTING OF SUPPORTED AND FREE-STANDING 3-D MICRO-OR NANO-STRUCTURES
    354.
    发明申请
    IMPRINTING OF SUPPORTED AND FREE-STANDING 3-D MICRO-OR NANO-STRUCTURES 审中-公开
    支持和自由置换三维微结构或纳米结构

    公开(公告)号：WO2005113422A1

    公开(公告)日：2005-12-01

    申请号：PCT/SG2005/000159

    申请日：2005-05-24

    Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  THE REGENTS OF THE UNIVERSITY OF MICHIGAN ,  KONG, Yen Peng ,  LOW, Hong Yee ,  PANG, Stella, W. ,  YEE, Albert, F.

    Inventor： KONG, Yen Peng ,  LOW, Hong Yee ,  PANG, Stella, W. ,  YEE, Albert, F.

    IPC: B81C1/00

    CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

    Abstract: The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a "latch-on" assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.

    Abstract translation: 本发明涉及微尺度和纳米级压印方法，并且使用这种方法来制造聚合物，陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构 。 在一些实施例中，在制造这些结构中采用双模方法。 在这种方法中，使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部件。 这种表面处理允许通过压印形成三维（3-D）结构并将这种结构转移到基底上。 在一些或其它实施方案中，所使用的聚合物的这种表面处理和玻璃化转变温度的变化可以促进3-D结构与模具的分离，以分别形成独立的和/或纳米结构， 电影。 在一些或其它实施方案中，使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构，其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热 组装热塑性聚合物。

    PACKAGING OF MICROELECTRONIC, OPTOELECTRONIC AND OTHER DEVICES
    355.
    发明申请
    PACKAGING OF MICROELECTRONIC, OPTOELECTRONIC AND OTHER DEVICES 审中-公开
    微电子，光电和其他设备的包装

    公开(公告)号：WO2005091352A1

    公开(公告)日：2005-09-29

    申请号：PCT/GB2005/000654

    申请日：2005-02-22

    Applicant: ADVANCED MICROPACKAGING TECHNOLOGY LIMITED ,  KAY, Peter

    Inventor： KAY, Peter

    IPC: H01L21/56

    CPC classification number: B81C1/00333 ,  B81C2201/034 ,  G02B6/4245 ,  G02B6/4251 ,  H01L21/565 ,  H01L25/50 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A chip or the like is packaged by being sealed between first and second package elements. The package elements are created by impressing dispensing a liquid polymer into a mould cavity and impressing the chip, or another object of equivalent shape, into a polymer body by hot or cold embossing. The polymer body may comprise a liquid polymer dispensed into a mould cavity, the liquid polymer being cured by heat or radiation such as UV. Multiple chips may be enclosed in a single package.

    Abstract translation: 通过密封在第一和第二封装元件之间来封装芯片等。 封装元件通过将液体聚合物分配到模具腔中并通过热或冷压花将芯片或等效形状的另一物体压入聚合物主体而产生。 聚合物主体可以包括分配到模腔中的液体聚合物，液体聚合物通过热或辐射如UV固化。 多个芯片可以封装在单个封装中。

    MICRO-MECHANICAL THERMO STRUCTURE AND METHOD FOR MANUFACTURING SUCH MICRO-MECHANICAL STRUCTURE
    358.
    发明申请
    MICRO-MECHANICAL THERMO STRUCTURE AND METHOD FOR MANUFACTURING SUCH MICRO-MECHANICAL STRUCTURE 审中-公开
    微机械热结构及制造这种微机械结构的方法

    公开(公告)号：WO2004056547A2

    公开(公告)日：2004-07-08

    申请号：PCT/IB2003/005460

    申请日：2003-11-20

    Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  BROER, Dirk, J. ,  MOL, Grietje, N. ,  DE WITZ, Christiane, M., R.

    Inventor： BROER, Dirk, J. ,  MOL, Grietje, N. ,  DE WITZ, Christiane, M., R.

    IPC: B29C39/00

    CPC classification number: B29C37/0053 ,  B29C33/42 ,  B29C43/021 ,  B29C2035/0827 ,  B29L2011/0016 ,  B29L2031/756 ,  B81B3/0035 ,  B81B2201/047 ,  B81C2201/034

    Abstract: The invention relates to a micro-mechanical thermal structure for modulating a light beam and a method for manufacturing such a structure. The micro-mechanical structure comprises two layers of material with different thermal expansion coefficients in a first direction and a second direction respectively, in which the first direction is transverse to the second direction and the two layers comprise an oriented polymer and the director of the molecules of the oriented polymer of the first layer is transverse to the director of the molecules of the oriented polymer of the second layer. An array of such micro-mechanical structures may form a thermo-optical modulator for modulating light. The method comprises a step of providing a mold with an orientation-inducing layer to obtain a molecular orientation in a mono-meric state of liquid crystalline monomers and a step of fixing the molecular orientation by photo-polymerization.

    Abstract translation: 本发明涉及一种用于调制光束的微机械热结构及其制造方法。 微机械结构包括在第一方向和第二方向上分别具有不同热膨胀系数的两层材料，其中第一方向横向于第二方向，并且两层包括取向聚合物和分子的导向体 的第一层的取向聚合物横向于第二层的取向聚合物的分子的导向体。 这种微机械结构的阵列可以形成用于调制光的热光调制器。 该方法包括提供具有取向诱导层以获得液晶单体的单体状态的分子取向的模具和通过光聚合固定分子取向的步骤的步骤。

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