Abstract:
A programmable logic device is adapted to predict carry values in long-chain-carry logic configurations. In the most preferred embodiment, which functions in any long-carry-chain logic configuration, each logic region calculates a result for both values of the carry-in signal to that region, and when a carry signal for the group to which the region belongs reaches the region, the correct result in each region, and thece the correct carry-out for that group, are calculated and propagated. The carry-out terminal of one group is arranged to be adjacent to the carry-in terminal of the next group, to enhance carry propagation speed. In another embodiment, each region looks back two regions to predict the carry-in. In two additional embodiments, logic is provided to mathematically calculate the carry values.
Abstract:
A reconfigurable computer system based on programmable logic is provided. A system design language may be used to write applications. The applications may be automatically partitioned into software components and programmable logic resource components. A virtual computer operating system may be provided to schedule and allocate system resources. The virtual computer operating system may include a virtual logic manager that may increase the capabilities of programmable logic resources in the system.
Abstract:
Systems and methods for using memory commands are described. The systems include a memory controller. The memory controller receives a plurality of user transactions. The memory controller converts each user transaction into one or more read or write memory commands. The memory controller reorders the memory commands associated with the plurality of user transactions before sending the memory commands to a memory device.
Abstract:
Hardened programmable logic devices are provided with programmable circuitry. The programmable circuitry may be hardwired to implement a custom logic circuit. Generic fabrication masks may be used to form the programmable circuitry and may be used in manufacturing a product family of hardened programmable logic devices, each of which may implement a different custom logic circuit. Custom fabrication masks may be used to hardwire the programmable circuitry to implement a specific custom logic circuit. The programmable circuitry may be hardwired in such a way that signal timing characteristics of a hardened programmable logic device that implements a custom logic circuit may match the signal timing characteristics of a programmable logic device that implements the same custom logic circuit using configuration data.
Abstract:
Methods and apparatus for reducing simultaneous switching noise (SSN) in an integrated circuit (IC) designed with a computer aided design (CAD) tool are presented. In one method, value assignments for parameters of the IC are received by the CAD tool. The value assignments are entered as a range of value assignments or as a list of possible value assignments. Further, the method includes an operation for determining the minimum and the maximum path delays for each Input/Output (I/O) pin in an I/O block such that the received value assignments are satisfied. The actual switching times of the I/O pins are spread out in time to decrease SSN in the I/O pins. The switching times are spread out so that the switching times fall between the minimum and the maximum path delay for the corresponding I/O pin. Additionally, other method operations are included for routing paths to the I/O pins to meet the actual switching times and for creating a design for the IC that meets the actual switching times.
Abstract:
A first periodic signal generation circuit generates first periodic output signals. A second periodic signal generation circuit generates second periodic output signals. A first multiplexer circuit receives the first and the second periodic output signals. An interface circuit coupled to external pins generates a third periodic output signal based on a periodic signal selected by the first multiplexer circuit. A second multiplexer circuit receives the third periodic output signal at an input. A first periodic feedback signal provided to the first periodic signal generation circuit is based on a signal selected by the second multiplexer circuit. A third multiplexer circuit receives the third periodic output signal at an input. A second periodic feedback signal provided to the second periodic signal generation circuit is based on a signal selected by the third multiplexer circuit.
Abstract:
A lookup table structure having multiple lookup tables is configured to include a quaternary adder. In particular examples, an adaptive logic module (ALM) including a fracturable lookup table (LUT) is configured to include a quaternary (4-1) adder. In some examples, only an XOR gate, an AND gate, two single bit 2-1 multiplexers, and minor connectivity changes to a LUT structure supporting a ternary (3-1) adder are needed to support 4-1 adders. Binary (2-1) and ternary adders are still supported using the original signal flows, as the ternary adder feature can be easily multiplexed out.
Abstract:
Integrated circuits that support dual-edge clocking are provided. Integrated circuits may include phase-locked loops that generate square-wave clock signals. The clock signals may be provided from off-chip equipment through input-output pins. The clock signals may be routed through a clock distribution network to provide local clock signals to pulse generators that generate clock pulses on rising and falling clock edges. The pulse generators may generate clock pulses that are triggered by the rising and falling clock edges with a common pulse width for optimum performance. Duty cycle distortion introduced by the clock network may be minimized for optimum performance. Adaptive duty cycle distortion circuitry may be used to control the pull- up/pull-down drive strengths of the clock buffer so that the high clock phase of the local clock signals is approximately a half clock cycle.
Abstract:
An integrated circuit (IC) that includes a plurality of bond pads disposed on a surface of the IC and a plurality of probe pads disposed on the surface of the IC is provided. Each of the plurality of probe pads is in electrical communication with corresponding bond pads. The plurality of probe pads are linearly configured across the surface. In one embodiment, the probe pads are disposed along a diagonal of the surface of the die defined between opposing vertices of the die surface. In another embodiment, multiple rows of linearly disposed probe pads are provided on the surface. In addition a packaging architecture for an integrated circuit is provided. The architecture includes a printed circuit board and a package substrate disposed on the printed circuit board. A first integrated circuit is disposed on a first surface of the package substrate. The package substrate is capable of supporting a second integrated circuit. The second integrated circuit is in electrical communication with a plurality of pads disposed on the first surface of the package substrate. Each of the plurality of pads is in electrical communication with the printed circuit board without communicating with the first integrated circuit.
Abstract:
A metastability-hardened storage circuit includes at least one inverting circuit. The inverting circuit has a logical input. The logical input of the inverting circuit is split into a pair of physical inputs.