公开(公告)号：US20140027880A1

公开(公告)日：2014-01-30

申请号：US13976439

申请日：2011-12-29

Applicant: Andreas Duevel ,  Telesphor Kamgaing ,  Valluri R. Rao ,  Uwe Zillmann

Inventor： Andreas Duevel ,  Telesphor Kamgaing ,  Valluri R. Rao ,  Uwe Zillmann

IPC: H01L49/02

CPC classification number: H01L28/10 ,  H01F17/0006 ,  H01F2017/002 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5227 ,  H01L27/0688 ,  H01L27/08 ,  H01L2224/4813 ,  H01L2924/0002 ,  H01L2924/00012

Abstract: A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.

Abstract translation: 使用导电贯穿体通孔在集成电路管芯中形成三维电感器，该穿通体通孔穿过管芯的主体并与管芯前侧上的一个或多个金属互连层接触并终止在管芯的背面 死。 在另一个实施例中，通孔通孔可以穿过设置在管芯主体中的插塞中的电介质材料。 另一方面，变压器可以通过耦合使用通孔通孔形成的多个电感器来形成。 在另一方面，三维电感器可以包括由片上金属化层的堆叠形成的导体和设置在金属化层之间的绝缘层中的导电贯通层通孔。 描述其他实施例。

公开(公告)号：US20130058141A1

公开(公告)日：2013-03-07

申请号：US13664102

申请日：2012-10-30

Applicant: Bradley S. Oraw ,  Telesphor Kamgaing

Inventor： Bradley S. Oraw ,  Telesphor Kamgaing

IPC: H02M3/18 ,  G05F1/563

CPC classification number: H02M3/07 ,  H02J1/102 ,  H02J9/005 ,  H02M2001/008 ,  Y10T307/406

Abstract: Series switches for power delivery. A regulator operated as a current source is arranged in parallel with a switched capacitor divider. A switched capacitor divider is configured in series with a plurality of linear regulators with each regulating one of a plurality of voltage outputs from the switched capacitor divider. In another embodiment, a series switch bridge has a first pair of switches connected in series with a second pair of switches across a voltage input, each switch within a pair of switches is switched in-phase with the other while the first pair of switches is switched out of phase with the second pair of switches. A balancing capacitor is coupled across one switch in both the first and second pair to be in parallel when either of the pair of switches is closed to reduce a charge imbalance between the switches.

公开(公告)号：US20090322384A1

公开(公告)日：2009-12-31

申请号：US12217078

申请日：2008-06-30

Applicant: Bradley Oraw ,  Telesphor Kamgaing

Inventor： Bradley Oraw ,  Telesphor Kamgaing

IPC: G05F1/10

CPC classification number: G11C5/147 ,  H02M1/36 ,  H02M3/07 ,  H02M2003/072

Abstract: Drive and startup circuits are described particularly suitable for use with a switched capacitor divider. In one example, a drive circuit has a level shifter coupled to a gate of each switch of a switched capacitor drive circuit to couple alternating current into the respective gate, a positive phase low side driver coupled to each level shifter to drive the gates of the top switch path through the respective level shifters, and a negative phase low side driver coupled to each level shifter to drive gates of the bottom switch path through the respective level shifters. A startup circuit, such as a capacitive soft start circuit may be used to slow the application of the current to each switch.

Abstract translation: 驱动和启动电路被特别适用于开关电容分压器。 在一个示例中，驱动电路具有耦合到开关电容器驱动电路的每个开关的栅极的电平移位器，以将交流电耦合到相应的栅极中，耦合到每个电平移位器的正相低侧驱动器来驱动 通过相应电平移位器的顶部开关路径，以及耦合到每个电平移位器的负相位低侧驱动器，以驱动通过相应电平移位器的底部开关路径的栅极。 可以使用诸如电容软启动电路的启动电路来减慢对每个开关的电流的施加。

公开(公告)号：US07548138B2

公开(公告)日：2009-06-16

申请号：US11240305

申请日：2005-09-29

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H03H7/01

CPC classification number: H03H5/02 ,  H01F27/40 ,  H01F2017/0046 ,  H03H2001/0085

Abstract: A technique to provide a compact integration of inductor-capacitor resonator a capacitor having a top plate and a bottom plate embedding a dielectric layer. The top and bottom plates are substantially parallel to each other. An inductor having a first end is coupled to the capacitor at the bottom plate. The inductor has N turns surrounding the bottom plate in a spiral geometry. The inductor is co-planar to one of the top and bottom plates and ends at a second end.

Abstract translation: 一种提供电感器 - 电容谐振器紧凑集成的技术，其具有嵌入介电层的顶板和底板的电容器。 顶板和底板基本上彼此平行。 具有第一端的电感器在底板处耦合到电容器。 电感器以螺旋几何形式围绕底板N圈。 电感器与顶板和底板中的一个共面，并在第二端处终止。

公开(公告)号：US20080238568A1

公开(公告)日：2008-10-02

申请号：US11729558

申请日：2007-03-29

Applicant: Emile Davies-venn ,  Telesphor Kamgaing

Inventor： Emile Davies-venn ,  Telesphor Kamgaing

IPC: H03H7/42

CPC classification number: H03H7/42 ,  H03H2001/0085 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536

Abstract: Methods and apparatus relating to package embedded three dimensional baluns are described. In one embodiment, components of one or more baluns may be embedded in a single semiconductor substrate. Other embodiments are also described.

Abstract translation: 描述了与封装嵌入式三维巴伦相关的方法和装置。 在一个实施例中，一个或多个巴伦的组件可以嵌入在单个半导体衬底中。 还描述了其它实施例。

公开(公告)号：US20230208009A1

公开(公告)日：2023-06-29

申请号：US17561542

申请日：2021-12-23

Applicant: Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Veronica STRONG

Inventor： Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Aleksandar ALEKSOV ,  Brandon RAWLINGS ,  Veronica STRONG

IPC: H01Q1/22 ,  H01Q9/04 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01Q9/0407 ,  H01L23/49827 ,  H05K1/181

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a buildup layer is over the core. In an embodiment, a patch antenna with a first patch is under the core, and a second patch is over a surface of the core opposite from the first patch. In an embodiment, the electronic package further comprises a via through the core and coupled to the patch antenna.

公开(公告)号：US20190207290A1

公开(公告)日：2019-07-04

申请号：US16325351

申请日：2016-09-30

Applicant: Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

Inventor： Brandon M. Rawlings ,  Shawna M. Liff ,  Sasha N. Oster ,  Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Aleksandar Aleksov, I ,  Johanna M. Swan ,  Richard J. Dischier

IPC: H01P11/00 ,  H01P3/12 ,  H01P3/14 ,  H01P3/123

CPC classification number: H01P11/002 ,  H01P3/122 ,  H01P3/123 ,  H01P3/14

Abstract: A method of making a waveguide, comprises: extruding a first dielectric material as a waveguide core of the waveguide, wherein the waveguide core is elongate; and coextruding an outer layer with the waveguide core, wherein the outer layer is arranged around the waveguide core.

公开(公告)号：US20180331051A1

公开(公告)日：2018-11-15

申请号：US15776021

申请日：2015-12-22

Applicant: Georgios C. DOGLAMIS ,  Telesphor KAMGAING ,  Eric J. LI ,  Javier A. FALCON ,  INTEL CORPORATION

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Eric J. LI, Sr. ,  Javier A. FALCON ,  Yoshihiro TOMITA ,  Vijay K. NAIR ,  Shawna M. LIFF

IPC: H01L23/66 ,  H01L23/552 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

Abstract: Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US09406427B2

公开(公告)日：2016-08-02

申请号：US12946577

申请日：2010-11-15

Applicant: Telesphor Kamgaing

Inventor： Telesphor Kamgaing

IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F41/04 ,  H01F38/14

CPC classification number: H01F17/0006 ,  H01F41/04 ,  H01F2027/2819 ,  H01F2038/143 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit.

Abstract translation: 公开了具有小迹线间距和高互耦系数的平面变压器或平衡 - 不平衡变压器及其制造方法。 该方法可以包括分别在主基片和第二衬底上提供第一和第二电感器，至少部分地将第一电感器与第二电感器交错，耦合初级和次级衬底以形成整体结构，并提供电触点 将第一和第二电感器与另一个器件或电路耦合。

公开(公告)号：US09229466B2

公开(公告)日：2016-01-05

申请号：US13977460

申请日：2011-12-31

Applicant: Ruchir Saraswat ,  Andre Schaefer ,  Uwe Zillman ,  Andreas Duevel ,  Valluri Rao ,  Telesphor Kamgaing ,  Harish Krishnamurthy

Inventor： Ruchir Saraswat ,  Andre Schaefer ,  Uwe Zillman ,  Andreas Duevel ,  Valluri Rao ,  Telesphor Kamgaing ,  Harish Krishnamurthy

IPC: H01L27/06 ,  G05F1/618 ,  H02M3/156 ,  H01L25/065 ,  H01L27/02 ,  H01L49/02 ,  H01L23/48 ,  H01L23/64 ,  H01L25/18 ,  H01L23/522 ,  H02M7/00

CPC classification number: G05F1/618 ,  H01L23/481 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/642 ,  H01L23/645 ,  H01L25/0657 ,  H01L25/18 ,  H01L27/0207 ,  H01L28/10 ,  H01L28/40 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/0002 ,  H02M3/156 ,  H02M7/003 ,  H01L2924/00

Abstract: A voltage regulator for one or more dies in a multi-stack integrated circuit includes an inductor located on a die, a voltage controller that is electrically coupled to the inductor and is also located on the die, and a capacitor that is electrically coupled to the inductor and the voltage controller and is also located on the die. The inductor defines an interior space and the voltage controller and the capacitor are located within the interior space of the inductor. The inductor can be a lateral inductor or a through layer via inductor. The multi-stack integrated circuit may have multiple dies. A voltage controller may be electrically coupled to each of the dies, although it may be located on only one of the dies. Alternatively, separate voltage controllers may be electrically coupled to each of the multiple dies and may be located on each of the respective dies.

Abstract translation: 用于多堆叠集成电路中的一个或多个管芯的电压调节器包括位于管芯上的电感器，电耦合到电感器并且还位于管芯上的电压控制器，以及电耦合到 电感和电压控制器，也位于模具上。 电感器定义了内部空间，电压控制器和电容器位于电感器的内部空间内。 电感器可以是横向电感器或通过电感器的贯穿层。 多层集成电路可以具有多个管芯。 电压控制器可以电耦合到每个模具，尽管它可以仅位于一个模具上。 或者，单独的电压控制器可以电耦合到多个管芯中的每个，并且可以位于每个相应的管芯上。