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公开(公告)号：KR101050542B1
公开(公告)日：2011-07-19
申请号：KR1020080115953
申请日：2008-11-20
Applicant: 도레이첨단소재 주식회사
Abstract: 본 발명은 무기재 양면점착테이프의 라미네이션 방법에 관한 것으로서, 보다 상세하게는 무기재 양면점착테이프의 제조 및 응용에서 피착체에 점착제를 라미네이션하기 위해서 경박리시트를 박리할 때 발생되는 점착제의 응집파괴나 이별의 눈물, 나끼와까레를 방지할 수 있으며, 무기재 양면점착테이프의 사용으로 인한 불량률을 줄일 수 있고, 무기재 양면 점착테이프에 사용되는 박리시트의 박리력 차이가 크지 않아도 깨끗하게 경박리시트를 박리시킬 수 있으며, 무기재 양면점착테이프의 제조에 있어서 경박리시트와 중박리시트의 선정에서 선택의 폭을 넓게 할 수 있는 무기재 양면점착테이프 및 이의 라미네이션 방법에 관한 것이다. 이를 위해 본 발명에 따른 무기재 양면점착테이프는 경박리시트, 점착제층 및 중박리시트로 구성되고, 상기 경박리시트의 박리력은 2~30g/25㎜, 상기 중박리시트의 박리력은 4~100g/25㎜, 상기 경박리시트의 박리력과 상기 중박리시트의 박리력 차이는 2g/25㎜이상인 것을 특징으로 하고, 또한 본 발명에 따른 무기재 양면점착테이프의 라미네이션 방법은 무기재 양면점착테이프에서 경박리시트를 박리시킬 때 점착제층과 경박리시트가 이루는 각이 90도 내지 180도이며, 점착제층의 이송 방향과 경박리시트의 이송 방향은 서로 반대방향이 되도록 하여 상기 경박리시트를 박리하면서 피착체에 점착제층이 부착되는 것을 특징으로 한다.
무기재 양면점착테이프, 박리시트, 점착제층, 박리력, 응집파괴, 박리각도-
公开(公告)号：KR1020110080418A
公开(公告)日：2011-07-13
申请号：KR1020100000625
申请日：2010-01-05
Applicant: 도레이첨단소재 주식회사
CPC classification number: C08G59/50 , C08G59/4215 , C08G59/62
Abstract: PURPOSE: A non-flow resin composition for underfill is provided to ensure viscosity of 500cps or more suitable for film coating and to accurately control the coating thickness and coating area of the underfill. CONSTITUTION: A non-flow resin composition for underfill comprises a thermoplastic epoxy prepolymer, a high temperature hardener, a thermoplastic resin for reforming and a melting material. A method for preparing a non-flow underfill film comprises the steps of: reacting an epoxy resin with a low temperature hardener at 80°C to obtain a themoplastic epoxy prepolymer; mixing the obtained themoplastic epoxy prepolymer, high temperature hardener, thermoplastic resin for reforming and melting material to blend a non-flow resin composition for underfill; and applying the non-flow resin composition for underfill to a base film.
Abstract translation: 目的：提供用于底部填充的非流动性树脂组合物，以确保适用于薄膜涂层的粘度为500cps或更高，并准确控制底层填料的涂层厚度和涂层面积。 构成：用于底部填充剂的非流动性树脂组合物包括热塑性环氧预聚物，高温硬化剂，用于重整的热塑性树脂和熔融材料。 制备非流动底部填充膜的方法包括以下步骤：使环氧树脂与低温硬化剂在80℃下反应，得到异型环氧预聚物; 混合所得到的聚酰亚胺环氧预聚物，高温硬化剂，用于重整熔融材料的热塑性树脂，以混合未填充的非流动树脂组合物; 并将未填充的非流动性树脂组合物施加到基膜上。
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公开(公告)号：KR1020110080417A
公开(公告)日：2011-07-13
申请号：KR1020100000624
申请日：2010-01-05
Applicant: 도레이첨단소재 주식회사
IPC: C08L63/00 , C08K5/03 , C08K5/3462 , H01L21/60
CPC classification number: C08L63/00 , C08G59/686 , C08K5/03 , C08K5/3462 , H01L23/295
Abstract: PURPOSE: A non-flow resin composition for underfill is provided to ensure short hardening time and to improve heat resistance and mechanical strength of a flip chip package assembly as well as high storage property at room temperature. CONSTITUTION: A non-flow resin composition for underfill comprises an epoxy resin, a cationic catalyst, a thermoplastic resin for reforming and a melting agent. The cationic catalyst is at least one salt selected from the group consisting of aromatic iodine salts, N-benzylpyrazidium salts, aromatic sulfonium salts, and aliphatic sulfonium salts. The iodine salts is a compound of a structure represented by chemical formula 1. In chemical formula 1, X^- is one or more negative ions selected from the group consisting of SbF6^-, AsF6^-, PF6^- and BF4^-.
Abstract translation: 目的：提供用于底部填充的非流动性树脂组合物，以确保较短的硬化时间，并提高倒装芯片封装组件的耐热性和机械强度以及室温下的高存储性能。 构成：用于底部填充剂的非流动性树脂组合物包含环氧树脂，阳离子催化剂，用于重整的热塑性树脂和熔融剂。 阳离子催化剂是选自芳族碘盐，N-苄基吡啶鎓盐，芳族锍盐和脂族锍盐中的至少一种盐。 碘盐是由化学式1表示的结构的化合物。在化学式1中，X 1 - 是选自SbF 6 - ，AsF 6 - ，PF 6 - 和BF 4 - 的一种或多种负离子， 。
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公开(公告)号：KR1020110071541A
公开(公告)日：2011-06-29
申请号：KR1020090128142
申请日：2009-12-21
Applicant: 도레이첨단소재 주식회사
CPC classification number: C08L67/00 , C09J7/255 , C09J11/06 , C09J133/00
Abstract: PURPOSE: A protective film for a semiconductor substrate is provided to enable smooth flip chip manufacturing process and to protect the surface of the substrate. CONSTITUTION: A protective film for a semiconductor substrate comprises a polyester substrate film(101), and an adhesive layer(102) coated with an acryl adhesive composition containing acryl polymer resin and aliphatic isocyanate hardener. The acryla polymer resin contains 0.01-0.9 weight parts of polymerization initiator based on 100 weight parts of acyl monomers. The acryl monomer is butylacrylate, 2-hydroxyethyl acrylate, methyl acrylate, or hydroxy butylacrylate.
Abstract translation: 目的：提供用于半导体衬底的保护膜，以实现平滑的倒装芯片制造工艺并保护衬底的表面。 构成：用于半导体衬底的保护膜包括聚酯基底膜（101）和涂覆有含有丙烯酸聚合物树脂和脂族异氰酸酯硬化剂的丙烯酸粘合剂组合物的粘合剂层（102）。 丙烯酸聚合物树脂含有0.01-0.9重量份的基于100重量份酰基单体的聚合引发剂。 丙烯酸单体是丙烯酸丁酯，丙烯酸2-羟乙酯，丙烯酸甲酯或丙烯酸羟丙酯。
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公开(公告)号：KR1020110052022A
公开(公告)日：2011-05-18
申请号：KR1020090108889
申请日：2009-11-12
Applicant: 도레이첨단소재 주식회사
IPC: C09J7/02
Abstract: PURPOSE: A non-carrier film type adhesive film is provided to ensure excellent durability and shear strength using an adhesive in which a soft monomer and a hard monomer are appropriately mixed. CONSTITUTION: A non-carrier film type adhesive film comprises: 50-90 weight% of a soft acrylic monomer with a glass transition temperature of 0 °C or less; 1-48 weight% of a hard monomer in which a glass transition temperature is 0°C or greater; and 1-10 weight% of crosslinkable monomer. The soft acrylic monomer is one or more selected from the group consisting of butyl(meth)acrylate, hexyl acrylate, hexyl methacrylate, n-propyl(meth)acrylate, n-tetradecyl(meth)acrylate, and 2-ethylhexylacrylate.
Abstract translation: 目的：提供非载体膜型粘合膜，以使用适当混合软单体和硬单体的粘合剂来确保优异的耐久性和剪切强度。 构成：非载体膜型粘合膜包括：50-90重量％的玻璃化转变温度为0℃以下的软质丙烯酸类单体; 1-48重量％的玻璃化转变温度为0℃以上的硬质单体; 和1-10重量％的可交联单体。 软质丙烯酸类单体是选自（甲基）丙烯酸丁酯，丙烯酸己酯，甲基丙烯酸己酯，（甲基）丙烯酸正丙酯，（甲基）丙烯酸正十四烷基酯，丙烯酸2-乙基己酯等中的一种以上。
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Patent Agency Ranking
公开(公告)号：KR101022794B1
公开(公告)日：2011-03-17
申请号：KR1020090096776
申请日：2009-10-12
Applicant: 도레이첨단소재 주식회사
CPC classification number: G02B5/30 , C08J5/18 , C08L33/08 , C09J133/06 , C09J133/14 , C09J143/02 , G02B5/08
Abstract: PURPOSE: An optical surface protective film is provided to obtain superior durability even though an optical surface protective film is stored for a long time. CONSTITUTION: An adhesive layer made of adhesive compositions. The adhesive compositions include an acrylic copolymer in which compositions of 2~8 weight% are copolymerized from a vinyl monomer or an acrylic monomer with a functional group. Bubble marks are removed from a surface of an adhered object due to adhesive compositions even under very hot and humid conditions.
Abstract translation: 目的：提供光学表面保护膜以获得优异的耐久性，即使光学表面保护膜长时间储存。 构成：由粘合剂组合物制成的粘合剂层。 粘合剂组合物包括丙烯酸共聚物，其中2-8重量％的组合物由乙烯基单体或丙烯酸单体与官能团共聚。 甚至在非常炎热和潮湿的条件下，由于粘合剂组合物，气泡痕迹从粘合物体的表面除去。
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公开(公告)号：KR1020110025258A
公开(公告)日：2011-03-10
申请号：KR1020090083241
申请日：2009-09-04
Applicant: 도레이첨단소재 주식회사
IPC: C09J7/02
CPC classification number: C09J7/385 , C09J4/00 , C09J2203/31 , C25D5/02
Abstract: PURPOSE: An adhesive sheet for plating is provided to obtain high dimensional stability, excellent reliability and processability and to prevent the residue from being attached to the surface. CONSTITUTION: An adhesive sheet for plating includes a substrate(1), and an adhesive layer(2) which includes a thermosetting adhesive resin and a thermosetting agent as an adhesive layer formed on at least one side of the substrate. The adhesive sheet further includes an energy-curable acrylic oligomer and an energy beam initiator. The substrate is at least one metal foil selected from foil, alloy foil, and plating foil, wherein the foil is made of aluminum, magnesium, titanium, chrome, manganese, iron, nickel, zinc or tin.
Abstract translation: 目的：提供用于电镀的粘合片以获得高尺寸稳定性，优异的可靠性和加工性，并防止残留物附着在表面上。 构成：用于电镀的粘合片包括基材（1）和粘合剂层（2），该粘合剂层包括热固性粘合剂树脂和热固性剂作为形成在基材的至少一面上的粘合剂层。 粘合片还包括能量可固化的丙烯酸类低聚物和能量束引发剂。 基板是选自箔，合金箔和电镀箔中的至少一种金属箔，其中箔由铝，镁，钛，铬，锰，铁，镍，锌或锡制成。
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38.发明公开관능기 함유 비닐계 단량체를 이용하여 개질된 아크릴계 공중합체를 포함하는 ＰＤＰ용 점착제 조성물 및 이를 이용한 무기재 점착시트 无效包含具有功能组的乙烯基单体和使用其的非载体膜修饰的丙烯酸酯共聚物的粘合剂组合物
公开(公告)号：KR1020100094062A
公开(公告)日：2010-08-26
申请号：KR1020090013300
申请日：2009-02-18
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/08 , C09J7/02
CPC classification number: C09J157/00 , C09J7/381 , C09J2203/318
Abstract: PURPOSE: An adhesive composition for a PDP, and an inorganic material adhesive sheet using thereof are provided to prevent a substrate film from being separated by copolymerizing a functional group-containing vinyl monomer to an acryl resin. CONSTITUTION: An adhesive composition for a PDP includes an acrylic acid ester monomer, and more than one functional group-containing vinyl monomer. The functional group-containing vinyl monomer is selected from the group consisting of a carboxyl group-containing vinyl monomer, anhydride of the carboxyl group-containing vinyl monomer, sulfonic acid group-containing vinyl monomer, and a phosphoric acid group-containing vinyl monomer.
Abstract translation: 目的：提供一种用于PDP的粘合剂组合物和使用它的无机材料粘合片，以通过将含官能团的乙烯基单体与丙烯酸树脂共聚来防止基底膜分离。 构成：PDP用粘合剂组合物包括丙烯酸酯单体和多于一个含官能团的乙烯基单体。 含官能团的乙烯基单体选自含羧基的乙烯基单体，含羧基的乙烯基单体的酸酐，含磺酸基的乙烯基单体和含磷酸基的乙烯基单体。
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公开(公告)号：KR1020100092608A
公开(公告)日：2010-08-23
申请号：KR1020090011807
申请日：2009-02-13
Applicant: 도레이첨단소재 주식회사
IPC: C09J125/02 , C09J7/02
CPC classification number: C09J125/02 , C09J7/22 , C09J7/35 , C09J163/00 , C09J2203/326
Abstract: PURPOSE: An adhesive composition for a halogen-free coverlay film, and the coverlay film including thereof are provided to offer the flowage of the coverlay film by miniaturizing a wiring pattern by the densification of an electronic material. CONSTITUTION: An adhesive composition for a halogen-free coverlay film contains the following: nitrile butadiene rubber with 20~40wt% of acrylonitrile and 3~15wt% of carboxyl group; a non-halogen poly functional solid-phase epoxy resin and a liquid epoxy resin; a hardener; a curing accelerator; a non-halogen phosphorous-based flame retardant; and an inorganic particle of aluminum hydroxide, magnesium hydroxide, zinc oxide, magnesium oxide, antimony trioxide, or silica.
Abstract translation: 目的：提供一种用于无卤覆盖膜的粘合剂组合物及其包括的覆盖膜，以通过电子材料的致密化使布线图案小型化来提供覆盖膜的流动。 构成：无卤覆膜的粘合剂组合物含有：丙烯腈20〜40重量％，羧基3〜15重量％的丁腈橡胶; 非卤素多官能固相环氧树脂和液体环氧树脂; 硬化剂 固化促进剂; 无卤磷系阻燃剂; 和氢氧化铝，氢氧化镁，氧化锌，氧化镁，三氧化锑或二氧化硅的无机粒子。
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公开(公告)号：KR1020100092569A
公开(公告)日：2010-08-23
申请号：KR1020090011739
申请日：2009-02-13
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J133/06 , C09J7/02
CPC classification number: C09J163/00 , C09J7/22 , C09J7/35 , C09J133/06 , C09J2203/326
Abstract: PURPOSE: An adhesive composition and a highly thermostable adhesive sheet using thereof are provided to secure the environmental stability, and to improve the peel strength of the composition when being applied to the adhesive sheet. CONSTITUTION: An adhesive composition contains the following: 100 parts of non-halogen epoxy resin by weight; 50~80 parts of poly(meth)acrylic acid ester by weight; 1~50 parts of hardener by weight for an epoxy resin; 20~100 parts of phosphorous-based flame retardant by weight; and 2~4 parts of more than one curing accelerator selected from the group consisting of an ethyl isocyanate compound, an imidazole compound, and triphenylphosphine.
Abstract translation: 目的：提供使用它的粘合剂组合物和高度耐热的粘合片以确保环境稳定性，并且在施加到粘合片上时提高组合物的剥离强度。 构成：粘合剂组合物含有以下物质：100重量份的非卤素环氧树脂; 50〜80份聚（甲基）丙烯酸酯重量份; 1〜50份环氧树脂重量的硬化剂; 20〜100份磷基阻燃剂; 和2〜4份多于一种选自异氰酸酯化合物，咪唑化合物和三苯基膦的固化促进剂。
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