Abstract:
PURPOSE: A method of controlling automatically the pressure of a plasma etching apparatus is provided to etch uniformly a thin film of a substrate by obtaining the same pressure values from a plurality of pumps of a chamber. CONSTITUTION: A plasma etching apparatus includes a plurality of gas flow rate controllers. Pressure values are obtained from the ambient of each gas flow rate controller of the plasma etching apparatus(S110). The obtained pressure values are transmitted to a pressure controller and the mean value of the pressure values is set as a reference pressure value(S120). The plurality of gas flow rate controllers are controlled to have the reference pressure value(S130).
Abstract:
PURPOSE: A dry etching apparatus is provided to distribute uniformly reaction gas to a surface of a wafer by adjusting the sizes or intervals of through holes in an upper electrode corresponding to exhaust ports of a lower electrode. CONSTITUTION: A chamber(10) includes a gas injection port(50) and exhaust ports(20). A lower electrode(30) is installed in the chamber. An upper electrode(40) with a plurality of through holes(45) is spaced apart from the lower electrode. At this time, the sizes and intervals of the through holes are controlled according to the distance between the through holes and the exhaust ports. A power supply(60) is connected with the upper and lower electrode.
Abstract:
A refrigerator with a multipurpose storage chamber (30) and a control method thereof are provided. In the refrigerator, the flow of cool air to the multipurpose storage chamber (30) is selectively controlled in accordance with a variety of operational modes. In order to accomplish such a cool air flow control, a refrigerating compartment fan (6) and a damper (9) are provided at positions above a refrigerating compartment evaporator (5). In addition, a flap (33) having a controllable opening angle, is provided at the inlet of an air guide path (34) guiding the cool air to the multipurpose storage chamber (30). The multipurpose storage chamber (30) of this refrigerator can thus effectively be used to store a variety of foods in accordance with storage characteristics of the foods. In addition, a thawing mode operation of the refrigerator is performed under the condition that it is not necessary to perform a refrigerating compartment cooling operation. It is thus possible to prevent an excessive increase in the temperature of the refrigerating compartment (10) caused by an operation of the defrosting heater (12) during such a thawing mode.
Abstract:
PURPOSE: A forming method of molybdenum thin film patterns is provided to etch a formed molybdenum thin film to make molybdenum thin film patterns, and to cleanly fabricate the molybdenun thin film patterns without residuals, stains or step differences, thereby improving the quality of a substrate. CONSTITUTION: Gate lines consisting of the first gate line layers(221,241) and the second gate line layers(222,242) are formed on an insulating substrate(10). The gate lines include gate lines(22), gate line ends(24), and gate electrodes. Maintenance electrode lines(28) are formed on the insulating substrate(10) in parallel with the gate lines(22). The maintenance electrode lines(28) consist of the first gate line layer(281) and the second gate line layer(282). Data line layers(62,64,68) made of molybdenum-tungsten alloy films are formed on resistive contact layer patterns(55).
Abstract:
PURPOSE: A sample and a method for testing detergency are provided to reduce the time for developing a detergent and to accurately check the properties of a detergent by varying the elements contained in the detergent during a test. CONSTITUTION: A detergency testing sample(100) comprises a substrate(10), a gate electrode(20) formed on the substrate and made of a mono silicon doped with metal or ion, a gate insulating film(30) formed on the gate electrode and made of SiO2, a channel layer(40) formed on the upper face of the gate electrode and made of amorphous silicon or poly silicon, a source electrode(50) placed on the upper face of the channel layer and made of mercury, and a drain electrode(60) placed on the upper face of the channel layer and made of mercury.
Abstract:
PURPOSE: An etchant composition for a liquid crystal display device and a liquid crystal display device prepared by using the composition are provided, to prevent the photoresist attack in etching by controlling the content of nitric acid and acetic acid for obtaining a desired pattern and to allow a Mo/Al-alloy dual layer, a pure Mo single layer and a Mo/Al-alloy/Mo triple layer to be etched at a time. CONSTITUTION: The etchant composition comprises 50-70 wt% of phosphoric acid; 6-7 wt% of nitric acid; 10-16 wt% of acetic acid; and the balance of deionized water. The liquid crystal display device contains the pattern which is etched by using the etchant composition. Optionally the composition comprises further a surfactant.
Abstract:
PURPOSE: A thin film transistor and its fabrication method are provided to form an interconnection line having low resistance. CONSTITUTION: The thin film transistor comprises an insulation substrate, and a gate line(121) which is formed on the insulation substrate to transfer a scanning signal. And a data line is formed to cross with the gate line and transfers an image signal. At least one of the gate line or the data line is formed with a tri-layer where the first molybdenum layer and an aluminum neodymium layer and the second molybdenum layer are stacked in sequence.
Abstract:
PURPOSE: An etching solution for wire, a preparation method of wire using the solution, a TFT (thin film transistor) substrate containing the wire and its preparation method are provided, to use a conductive layer having a low resistance and a high reflectivity as a reflective layer by allowing a reflective layer to be patterned easily. CONSTITUTION: The etching solution comprises 1-5 wt% of ferric nitrate; 1-5 wt% of nitric acid; 5-20 wt% of acetic acid; 0.05-1 wt% of hexaethylene glycol tetramine; and the balance of ultrapure water. The preparation method of wire comprises the steps of layering a conductive layer comprising silver or silver alloy; and patterning the conductive layer by using the etching solution. The TFT array substrate is prepared by forming a gate wire comprising a gate line and a gate electrode connected with the gate line on an insulating substrate(100); layering a gate laminating layer; forming a semiconductor layer; forming a data wire comprising a data line crossed with the gate line, a source electrode connected with the data line and adjacent to the gate electrode, and a drain electrode placed at the opposite side of the source electrode to the gate electrode; layering a conductive layer comprising silver or silver alloy; and patterning the conductive layer by using the etching solution to form a reflective layer(800) connected with the drain electrode electrically.
Abstract:
PURPOSE: A method for forming a molybdenum-tungsten thin film pattern and a method for manufacturing a TFT(Thin Film Transistor) substrate of an LCD(Liquid Crystal Display) using the same are provided to be capable of supplying optimum condition capable of forming an easily etched molybdenum-tungsten thin film. CONSTITUTION: A sputtering process is carried out for forming a molybdenum-tungsten thin film from the room temperature to 80 °C. At this time, the sputtering process is carried out with a speed of 0.010-0.015 angstrom/Ws. Then, an etching process is carried out at the molybdenum-tungsten thin film for selectively patterning the molybdenum-tungsten thin film. Preferably, the target size of the sputtering process is in the range of 144 ±10 x 660 ±10(mm x mm).
Abstract:
PURPOSE: A method for forming a molybdenum-tungsten thin film and a method for manufacturing thin film transistors of a liquid crystal display using the same are provided to realize a molybdenum-tungsten thin film having high density, large grain size, and low resistance. CONSTITUTION: A first gate wiring layer is formed on a substrate, and MoW is sputtered in a range of 100 to 150 deg. to form a second gate wiring layer. The first gate wiring layer and the second gate wiring layer are etched to form gate patterns including gate lines, gate pads, and gate electrodes. A gate insulating film is deposited on the gate patterns. Semiconductor and resistant contact patterns are formed. MoW is sputtered in a range of 100 to 150 deg. and is patterned to form data wiring. A passivation film is formed and patterned with the gate insulating film for forming contact holes exposing the gate pads, data pads, and drain electrodes. A transparent conductive film is accumulated and etched to form auxiliary gate pads, auxiliary data pads, and pixel electrodes.