Abstract:
PURPOSE: An apparatus for supplying chemicals for fabricating a semiconductor is provided to precisely detect the quantity of the residual chemicals even if the dielectric constant of the chemicals change. CONSTITUTION: A store tank(201) stores the chemicals(211). A buoyancy pendulum(213) is disposed inside the store tank. The average density of the buoyancy pendulum is the same as or smaller than that of the chemicals. A load cell(217) outputs an electrical signal according to the weight of the buoyancy pendulum. The upper portion of the buoyancy pendulum is suspended from the load cell by a connection string(215). A signal processing apparatus(221) processes the output signal of the load cell and calculates the flow rate of the chemicals.
Abstract:
본 발명은 벨트형 화학 기상 증착 장비의 시스템 제어 프로그램을 기록한 기록매체에 관한 것이다. 화학 기상 증착 장비의 공정 조건 및 시스템 작동을 제어하기 위한 시스템 제어 프로그램을 기록한 기록매체에 있어서, 시스템 제어 프로그램은 모니터 상에 표시되는 초기 화면으로 설정된 스크린 메뉴에 공정 기체의 공급 상태를 조절하는 항목, 공정 챔버의 압력을 표시하는 항목, 벨트의 속도를 조절하는 항목 및 증착 회수를 조절하는 항목을 동시에 나타낸다. 따라서, 작업자가 증착 회수를 용이하게 확인하고 변경할 수 있게 된다.
Abstract:
본 발명은 이동통신 단말기의 호 착신 알람 방식을 자동으로 변경하는 장치 및 방법을 제공한다. 이를 위해 본 발명은 각 동작 상태마다 설정된 착신 모드들이 저장되는 착신 모드 저장부와, 이동통신 단말기의 동작 상태에 따른 착신 모드의 호 착신 알람 방식으로 호 착신 알람 방식을 자동으로 변경하는 제어부를 구비한다. 그러므로 본 발명에서는 호 착신이 감지되면, 사용자에게 이를 알리는 호 착신 알람을, 현재의 이동통신 단말기의 동작 상태에 대응되는 호 착신 알람 방식으로 자동 변경한다. 이에 따라 사용자는 이동통신 단말기의 동작 상태에 따라 사용자가 호 착신 알람을 인지하지 못하게 되는 경우를 방지할 수 있으며, 현재 이동통신 단말기에서 수행되는 동작을 호 착신 알람으로 인해 방해받는 경우를 방지할 수 있다.
Abstract:
PECVD(plasma enhanced chemical vapor deposition) equipment is provided to form an amorphous carbon layer having refractivity of 1.1 and absorptivity of 0.4 by including a reaction gas supply part for supplying isoprene gas and nitrogen gas and by having a plasma electrode for mixing the isoprene gas and the nitrogen gas in a predetermined mixture ratio. A space sealed from the outside is prepared by a reaction chamber(110). A vacuum pump(120) pumps the air in the reaction chamber to a predetermined vacuum pressure. A heater block(130) heats a wafer to a predetermined temperature, supporting the wafer in the lower portion of the reaction chamber. A shower head(140) is installed in the upper portion of the reaction chamber corresponding to the heater block. A reaction gas supply part(150) mixes and supplies isoprene gas and nitrogen gas of a predetermined flow rate to the inside of the reaction chamber through the shower head. A plasma electrode(160) excites the isoprene gas and the nitrogen gas supplied from the reaction gas supply part to a plasma state, installed on the shower head in a manner that high frequency power and low frequency power are simultaneously applied to mix the isoprene gas and the nitrogen gas in a predetermined mixture ratio or higher. The plasma electrode includes a first plasma electrode to which the high frequency power is applied and a second plasma electrode to which the low frequency power relatively lower in frequency than the high frequency power is applied.
Abstract:
An apparatus and a method for correcting the output of a speaker in a mobile communication terminal are provided to allow a user to listen to a sound with a predetermined level by correcting a speaker output when the mobile terminal performs a function based on the movement thereof. An apparatus for correcting a speaker in a mobile communication terminal includes a sensor(230), a speaker(214), and a controller(200). The sensor(230) detects an acceleration value according to the movement of the mobile terminal. The speaker(214) outputs a sound. The controller(200) converts an acceleration value detected from the sensor(230) into a speed value and adjusts the output level of the speaker(214). The sensor detects an acceleration value for three-axes of X, Y, and Z axes.
Abstract:
커패시터와 메탈라인 사이에 BPSG 재질의 절연막 증착시, 다이버트 시간을 MFC가 안정될 때까지 충분히 늘리고, 플레이트 전극과 상기 절연막 사이에 B,P 소스의 아웃-디퓨전을 방지할 수 있는 장벽층을 더 추가하므로써, 플레이트 전극의 RS 증가를 막을 수 있도록 한 반도체 소자의 절연막 형성방법이 개시된다. 이를 위하여 본 발명에서는, "스토리지 전극-유전막-플레이트 전극" 구조의 커패시터가 갖는 절연기판을 준비하는 단계; 상기 결과물 상에 유동성을 갖지 않는 절연 재질의 장벽층을 형성하는 단계; 및 B-소스 가스와 P-소스 가스를 10 ~ 15초 동안 다이버트하여 개스 플로우를 안정화시킨 후, SACVD 프로세스를 적용하여 상기 장벽층 상에 BPSG 재질의 절연막을 형성하는 단계를 포함하는 반도체 소자의 절연막 형성방법이 제공된다.
Abstract:
A navigation device is provided. The device includes a driving state tracker for tracking a mobile driving state using a current mobile position and RGI (Route Guidance Information) data including driving information on multi-routes from the current mobile position to a destination, and outputting deviation information and the current mobile position when a mobile object is deviated from a route; and a re-routing unit for searching partial routes from a mobile deviation position to each of the multi-routes using the deviation information, the current mobile position and the driving information on the multi-routes, and re-routing a route to the destination using each of the partial routes.
Abstract:
A semiconductor device and a method for manufacturing the same, wherein a gate electrode structure is formed on a surface of a semiconductor substrate. Next, a gate poly oxide (GPOX) layer is deposited on a surface of the gate electrode structure and on the semiconductor substrate. Then, the surface of the semiconductor substrate is cleaned to remove any residue and the GPOX layer remaining on the semiconductor substrate. Next, an etch stopper is formed on the surface of the gate electrode structure and on the semiconductor substrate. Last, a high-density plasma (HDP) oxide layer is deposited on the etch stopper. The semiconductor device and method for manufacturing the same are capable of preventing bubble defects.
Abstract:
PURPOSE: A method for manufacturing a semiconductor device is provided to be capable of improving gap-filling between gates and reliability by using a sputter etching when forming an interlayer dielectric. CONSTITUTION: After forming an isolation layer(101) on a semiconductor substrate(100), a plurality of gates(120) are formed. The first interlayer dielectric is partially filled into gaps between the gates. The first interlayer dielectric is firstly etched by using sputtering and secondly etched by using isotropic etching. Then, the second interlayer dielectric(130) is entirely filled into the gaps. A silicon oxide layer having good step coverage and deposition speed is used as the first interlayer dielectric and deposited using HDP(High Density Plasma) CVD.
Abstract:
PURPOSE: A method for fabricating a semiconductor device including an oxygen plasma pretreatment is provided to form a pattern having a correct critical value by forming a photoresist pattern of a desired vertical profile. CONSTITUTION: A semiconductor substrate(300) including a patterning target layer(310) is loaded into a semiconductor fabrication apparatus using high density plasma. An oxygen gas as a reaction gas is implanted into the semiconductor fabrication apparatus. Oxygen plasma is formed by applying only source power instead of bias power. An oxygen plasma process for the patterning target layer(310) of the semiconductor substrate(300) is performed. A photoresist pattern is formed on the semiconductor substrate(300). The patterning target layer(310) is patterned by using the photoresist pattern. The photoresist pattern is removed.