公开(公告)号：KR100962936B1

公开(公告)日：2010-06-09

申请号：KR1020070134390

申请日：2007-12-20

Applicant: 제일모직주식회사

Inventor： 홍용우 ,  김완중 ,  임수미 ,  편아람 ,  정철 ,  김상진 ,  정창범

IPC: C09J163/00 ,  C09J7/02 ,  C09J7/00

CPC classification number: H01L21/6836 ,  C08K5/50 ,  C08K5/5419 ,  C09D163/00 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2421/00 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/28 ,  H01L24/45 ,  H01L2221/68327 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T428/2848 ,  Y10T428/31515 ,  Y10T428/31522 ,  C08L2666/28 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/48

Abstract: An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.

公开(公告)号：KR1020090103434A

公开(公告)日：2009-10-01

申请号：KR1020080029048

申请日：2008-03-28

Applicant: 제일모직주식회사

Inventor： 정철 ,  김완중 ,  정기성 ,  홍용우 ,  정창범 ,  편아람 ,  임수미 ,  김상진

IPC: C09J7/00

CPC classification number: C09J201/06 ,  C08L63/00 ,  C09J9/00 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J161/06 ,  C09J201/08 ,  C09J2203/326

Abstract: PURPOSE: An adhesive film composition for a semiconductor assembly is provided to suppress the generation of burr in dicing by controlling storage modulus before hardening and to prevent damage of products caused by chip crack generated by chipping. CONSTITUTION: An adhesive film composition for a semiconductor assembly includes an elastomeric resin, a film-forming resin, an epoxy-based resin, a phenol hardener, a curing catalyst, a silane coupling agent and inorganic filler. The elastomeric resin contains a hydroxyl group or carboxy group, and an epoxy group. The adhesive film is formed by the composition. A Dicing Die Bonding Film is such that a tackifier layer(2) and an adhesive layer(3) on a base film.

Abstract translation: 目的：提供一种用于半导体组件的粘合膜组合物，用于通过控制硬化前的储能模量来抑制切割中的毛刺产生，并且防止由于碎裂而产生的切屑产生的产品损坏。 构成：用于半导体组件的粘合膜组合物包括弹性体树脂，成膜树脂，环氧基树脂，酚固化剂，固化催化剂，硅烷偶联剂和无机填料。 弹性体树脂含有羟基或羧基，和环氧基。 粘合膜由该组合物形成。 切割片接合膜是使基底膜上的增粘剂层（2）和粘合剂层（3）。

公开(公告)号：KR1020090065669A

公开(公告)日：2009-06-23

申请号：KR1020070133086

申请日：2007-12-18

Applicant: 제일모직주식회사

Inventor： 임수미 ,  홍용우 ,  김완중 ,  정철 ,  편아람 ,  김상진 ,  정창범

IPC: C09J163/00 ,  C09J183/04 ,  C09J7/02 ,  C09J7/00

CPC classification number: C09J7/00 ,  C09J7/38 ,  C09J163/00 ,  C09J183/04 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2421/00 ,  C09J2463/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/28

Abstract: An adhesive film composition for the assembly of a semiconductor is provided to increase the releasing of an adhesive film for preventing the fixation between films and to lower peel strength. An adhesive film composition for the assembly of a semiconductor comprises the modified silicone oil represented by the formula 1, an elastomeric resin containing a hydroxyl group or a carboxy group, a thermoplastic resin, an epoxy-based resin, a phenol curing agent, a curing catalyst, a silane coupling agent and a filler.

Abstract translation: 提供了用于组装半导体的粘合膜组合物以增加用于防止膜之间的固定的粘合剂膜的释放并降低剥离强度。 用于组装半导体的粘合膜组合物包含由式1表示的改性硅油，含有羟基或羧基的弹性体树脂，热塑性树脂，环氧基树脂，酚固化剂，固化 催化剂，硅烷偶联剂和填料。

公开(公告)号：KR100800214B1

公开(公告)日：2008-02-01

申请号：KR1020060127293

申请日：2006-12-13

Applicant: 제일모직주식회사

Inventor： 정기성 ,  김완중 ,  홍용우 ,  정창범 ,  정철 ,  편아람 ,  임수미 ,  하경진

IPC: C09J123/00 ,  C09J163/00 ,  C09J7/02

CPC classification number: H01L21/6836 ,  C08K3/013 ,  C08K5/34922 ,  C08K5/50 ,  C08K5/5435 ,  C08K5/548 ,  C08K5/55 ,  C08L61/04 ,  C08L63/00 ,  C09D167/02 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/1461 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31786 ,  C08L2666/14 ,  H01L2924/00 ,  H01L2924/01083 ,  C09J167/02 ,  C09J7/00 ,  C09J163/00 ,  C09J2203/326

Abstract: An adhesive film composition for the assembly of semiconductor, an adhesive film formed form the composition, and an adhesive containing the film are provided to improve adhesive strength to a wafer and to minimize the generation of bubble during attaching process. An adhesive film composition comprises a polyester-based adhesion improving resin; an elastomer resin containing a hydroxyl group, a carboxyl group or an epoxy group; an epoxy group; a phenolic epoxy resin curing agent; at least one material selected from the group consisting of a latent catalytic curing agent and a curing catalyst; a silane coupling agent; and a filler. Preferably the polyester-based adhesion improving resin has a softening point of 0-200 deg.C and a weight average molecular weight of 200-1,000,000; and the elastomer has a weight average molecular weight of 500-5,000,000.

Abstract translation: 提供用于组装半导体的粘合剂膜组合物，由组合物形成的粘合剂膜和包含该膜的粘合剂，以提高对晶片的粘合强度并且在附着过程中最小化气泡的产生。 粘合膜组合物包含聚酯类粘合改善树脂; 含有羟基，羧基或环氧基的弹性体树脂; 环氧基; 酚醛环氧树脂固化剂; 选自由潜催化固化剂和固化催化剂组成的组中的至少一种材料; 硅烷偶联剂; 和填料。 优选地，聚酯类粘合改进树脂的软化点为0-200℃，重均分子量为200-1,000,000; 弹性体的重均分子量为500〜500,000。