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公开(公告)号：KR100552131B1
公开(公告)日：2006-02-14
申请号：KR1020020074092
申请日：2002-11-26
Applicant: 한국화학연구원 , 대림에이치앤엘(주)
IPC: C08G73/10
Abstract: 본 발명은 일단계 직접 중합에 의한 방향족 폴리이미드 복합 분말 소재 및 이의 제조방법에 관한 것으로서, 보다 상세하게는 무기입자 분말이 분산된 페놀계 유기 극성 용매에 테트라카르복시산 이무수물의 단량체와 방향족 디아민의 단량체를 혼합한 다음 특정한 조건으로 승온하는 일단계 가열 중합 공정에 의해 무기입자 분말이 균일하게 분산된 폴리이미드계 복합 분말 소재를 제조함으로써, 기존의 저온 공정에서 2 단계 공정을 통해 제조되는 기존의 방향족 폴리이미드 수지 분말의 제조공정을 개선하고, 내열성, 내마모특성 및 내열팽창성 등이 우수한 성형품을 제공할 수 있는 일단계 직접중합에 의한 방향족 폴리이미드 복합 분말 소재 및 이의 제조방법에 관한 것이다.
단일 단계, 무기입자 분말, 폴리이미드-
公开(公告)号：KR100534012B1
公开(公告)日：2005-12-07
申请号：KR1020030033468
申请日：2003-05-26
Applicant: 한국화학연구원
Abstract: 본 발명은 기체차단성이 개선된 폴리술폰계 나노복합재에 관한 것으로서, 더욱 상세하게는 폴리술폰 또는 폴리에테르술폰의 술폰계 고분자와 층상 실리케이트를 복합화하는데 있어 층상 실리케이트를 보다 효과적으로 박리시키기 위하여 말단에 수산기 또는 긴 알킬사슬기가 치환되어 있는 저분자량의 폴리술폰 또는 폴리에테르술폰을 유기 상용화제로 혼합 사용하여 나노복합화하여 제조된 것으로, 기체차단성 및 기계적 물성이 크게 향상되어 가스베리어성 포장재 및 유기 디스플레이 기판 제조용 소재로 유용한 폴리술폰계 나노복합재에 관한 것이다.
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33.发明授权
公开(公告)号：KR100435512B1
公开(公告)日：2004-06-10
申请号：KR1020010046592
申请日：2001-08-01
Applicant: 한국화학연구원
IPC: C01B33/26
Abstract: PURPOSE: Organic aluminosilicate based lamellar inorganic materials which are usefully used as a core material of various ultramodern industries such as electric, electronic, space and aviation industries by having superior heat resistance and organic affinity and low hygroscopic, and a method for preparing the same are provided. CONSTITUTION: In organic lamellar inorganic materials in which organic polymers are introduced between layers of aluminosilicate based lamellar inorganic materials, the organic aluminosilicate based lamellar inorganic materials are characterized in that the organic polymers introduced between layers of the aluminosilicate based lamellar inorganic materials are low polarity siloxane amine oligomer selected from siloxane amine oligomers represented as in chemical formulae 1a and 1b and siloxane amine oligomer in which alkyl group produced by reaction of alkyl carbonyl chloride is substituted represented as in chemical formula 2, where R1 and R2 are -(CH2)pX1(CH2)q- or formula 3 respectively, wherein X1 is -CH2- or -O-; R is -(CH2)nX2(CH2)k-, wherein X2 is -CH2- or -CH=CH-; l and m are an integral number between 1 to 300 respectively, and p, q, n and k are an integral number between 1 to 30 respectively.
Abstract translation: 目的：有机铝硅酸盐基片状无机材料由于具有优异的耐热性和有机亲和性以及低吸湿性而被有效地用作各种超现代工业如电力，电子，航天和航空工业的核心材料，以及其制备方法是 提供。 组成：在有机层状无机材料中，有机聚合物被引入到硅铝酸盐基层状无机材料层之间，有机硅酸铝基层状无机材料的特征在于，引入硅铝酸盐基层状无机材料层之间的有机聚合物是低极性硅氧烷 选自如化学式1a和1b所示的硅氧烷胺低聚物的胺低聚物和其中由烷基碳酰氯的反应产生的烷基被取代的硅氧烷胺低聚物，如化学式2所示，其中R1和R2是 - （CH2）pX1（ CH2）q-或式3，其中X1是-CH2-或-O-; R是 - （CH2）nX2（CH2）k-，其中X2是-CH2-或-CH = CH-; l和m分别是1到300之间的整数，p，q，n和k分别是1到30之间的整数。
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公开(公告)号：KR1020040046229A
公开(公告)日：2004-06-05
申请号：KR1020020074070
申请日：2002-11-26
Applicant: 한국화학연구원
IPC: C08G73/10
Abstract: PURPOSE: Photosensitive transparent polyamic acid derivative and polyimide-based resin are provided, to improve light transmittance in visible light range, transparency and solubility and to reduce a dielectric constant. CONSTITUTION: The polyamic acid derivative is represented by the formula 1, wherein l is an integer of 1-500 and 0
Abstract translation: 目的：提供光敏透明聚酰胺酸衍生物和聚酰亚胺基树脂，以提高可见光范围内的透光率，透明度和溶解性并降低介电常数。 构成：聚酰胺酸衍生物由式1表示，其中l是1-500的整数，0 <= m /（1 + m）<1; n为1-20的整数; R1，R2，R3和R4是C1-C30的烷基或芳基; Z为酯，酰胺，酰亚胺或醚基。 优选聚酰胺酸衍生物的特性粘度为0.05-2.0g / dl。 聚酰亚胺系树脂通过固化聚酰胺酸衍生物而制备，其酰亚胺化度为70％以上。 优选地，聚酰亚胺基树脂通过首先在150-250℃的温度下固化聚酰胺酸衍生物，然后在250-300℃的温度下二次固化而获得。
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公开(公告)号：KR100366147B1
公开(公告)日：2003-01-14
申请号：KR1020000004917
申请日：2000-02-01
Applicant: 한국화학연구원
Abstract: PURPOSE: Provided are a polyimide nano complex material with high crystallinity and its preparation method. The material is heat resistant, has low thermal expansion and good mechanical property and is used in industrial machines, electronic parts and in automobiles as heat resistant material. CONSTITUTION: The material is prepared by adding polyimide (PI) of formula 1 or its precursor polyamic acid solution into 1-30 wt.% of organo-aluminosilicate of layered structure dispersed in solution such as dimethylacetamide or N-methyl-2-pyrrolidone, stirring at room temp. for 1-24 hours and heat treating at 80-200deg.C. The PI or polyamic resins have average Mw. of 20,000-300,000g/mol, 0.3-1.5dL/g viscosity and 200-400deg.C glass transition temperature. The aminosilicate layer has 10-50 angstrom of thickness and 1,000-5,000 angstrom of length. Ammonium salts of aliphatic or aromatic hydrocarbon are introduced between the aminosilicate layers in order to increase the affinity with PI polymers.
Abstract translation: 目的：提供一种结晶度高的聚酰亚胺纳米复合材料及其制备方法。 该材料耐热，热膨胀小，机械性能好，用于工业机械，电子部件和汽车中作为耐热材料。 构成：通过将式1的聚酰亚胺（PI）或其前体聚酰胺酸溶液加入1-30重量％的分散在溶液中的层状结构的有机铝硅酸盐如二甲基乙酰胺或N-甲基-2-吡咯烷酮中来制备材料， 在室温下搅拌。 持续1-24小时并在80-200℃进行热处理。 PI或聚酰胺树脂具有平均Mw。 为20,000-300,000g / mol，粘度为0.3-1.5dL / g，玻璃化转变温度为200-400℃。 氨基硅酸盐层具有10-50埃的厚度和1,000-5,000埃的长度。 在氨基硅酸盐层之间引入脂肪族或芳香族烃的铵盐以增加与PI聚合物的亲和力。
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Patent Agency Ranking
公开(公告)号：KR1020020079005A
公开(公告)日：2002-10-19
申请号：KR1020010019537
申请日：2001-04-12
Applicant: 한국화학연구원
CPC classification number: C08K5/521 , C08K5/17 , C08L23/02 , C08L2201/02
Abstract: PURPOSE: Provided is a polyolefin resin composition which uses the polyolefin resin as a matrix by nano compositing the delaminated organophilic layered silicate, polyolefin compatibilizer and the conventional fire retardant. The composite has excellent properties of mechanical strength, heat resistance, impact resistance, fabricability and fire resistance compared with conventional material. CONSTITUTION: The composite comprises: 10- 35wt.%(based on 100wt.% of the polyolefin resin) of organohalogen-based fire retardant; 0.5-10wt.% of the organophilic layered silicate in which the silicate is emulsified with organophosphorus acid salt and organo ammonium salt which are substituted with C12-36 alkyl groups or aromatic groups; 1-30wt.% polyolefin compatibilizer grafted with maleic acid, having average mol wt. of 5,000-90,000 and graft rate of 0.2-10 and more than one additive selected from a photo-stabilizer, a UV absorber, an anti-static agent, wax, pigments, an ignition delaying agent and a filler.
Abstract translation: 目的：提供通过使分层的亲有机层状硅酸盐，聚烯烃增容剂和常规阻燃剂纳米复合而使用聚烯烃树脂作为基质的聚烯烃树脂组合物。 与常规材料相比，该复合材料具有优异的机械强度，耐热性，耐冲击性，可加工性和耐火性。 构成：复合材料包括：10-35wt。％（基于100wt％的聚烯烃树脂）有机卤素类阻燃剂; 其中硅酸盐被有机磷酸盐和被C 12-16烷基或芳族基团取代的有机铵盐乳化的有机层状硅酸盐0.5-10重量％ 1-30重量％的用马来酸接枝的聚烯烃增容剂，平均重量 5000-90,000，接枝率为0.2-10，多于一种选自光稳定剂，紫外线吸收剂，抗静电剂，蜡，颜料，点火延迟剂和填料的添加剂。
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公开(公告)号：KR100351627B1
公开(公告)日：2002-09-11
申请号：KR1020000000145
申请日：2000-01-04
Applicant: 한국화학연구원
Abstract: 본 발명은 무색 투명의 고접착성 지방족 폴리이미드 수지와 이를 이용한 폴리이미드/무기물 복합 소재에 관한 것으로서, 더욱 상세하게로는 지방족 고리 구조와 접착성 향상 기능기를 함유하는 가용성의 신규한 무색 투명의 고접착성 지방족 폴리이미드 수지와, 상기한 신규 지방족 폴리이미드 수지가 유리(glass), 전도성 유리, 알루미늄, 구리, 티타늄 또는 이들의 산화물 등의 무기소재에 코팅되어 있어 액정표시 소자의 칼라필터의 버퍼코팅판(buffer coating layer), 유리기판과 TFT 사이의 절연층 재료, 터치패널(touch panel)용 액정표시 소자의 고분자 격벽 재료 등으로의 응용에 적합한 폴리이미드/무기물 복합 소재에 관한 것이다.
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公开(公告)号：KR1020020065777A
公开(公告)日：2002-08-14
申请号：KR1020010005958
申请日：2001-02-07
Applicant: 한국화학연구원
IPC: B32B27/36
CPC classification number: B32B27/08 , B32B7/12 , B32B27/281 , B32B27/36 , B32B38/164 , B32B2037/243 , B32B2250/24 , B32B2307/306 , B32B2309/02 , B32B2309/04
Abstract: PURPOSE: A high adhesive polyimide/poly(ethylene terephthalate) compound film and a manufacturing method thereof are provided to enable the compound film to be used as a high quality adhesive film suitable for a flexible printed circuit board by virtue of improved heat-resistance, transparency, and mechanical properties thereof. CONSTITUTION: The high adhesive polyimide/poly(ethylene terephthalate) compound film comprises a thin soluble polyimide resin solution layer(1) coated on the one surface or the both surfaces of a poly(ethylene terephthalate) film(3), and a high adhesive polyester layer(2) between the film and the resin layer so as to increase an interfacial adhesive property therebetween.
Abstract translation: 目的：提供高粘合性聚酰亚胺/聚（对苯二甲酸乙二醇酯）复合膜及其制造方法，以使化合物膜能够通过改善耐热性而用作适合于柔性印刷电路板的高品质粘合剂膜， 透明性和机械性能。 构成：高粘合性聚酰亚胺/聚（对苯二甲酸乙二醇酯）复合膜包括涂覆在聚对苯二甲酸乙二醇酯膜（3）的一个表面或两个表面上的薄溶性聚酰亚胺树脂溶液层（1）和高粘合剂 聚酯层（2）在膜和树脂层之间，以增加它们之间的界面粘合性。
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公开(公告)号：KR1020020065776A
公开(公告)日：2002-08-14
申请号：KR1020010005957
申请日：2001-02-07
Applicant: 한국화학연구원
IPC: C08K3/36
Abstract: PURPOSE: Provided are an organized, inorganic material having improved heat resistance and organizing property, which can be used as a key composite material of high-tech industry such as various electric, electronic, (aero)space industry, aero industries. CONSTITUTION: The organized, layered inorganic material consists of a layered inorganic material based on aluminosilicate, and an organic polymer positioned between layers of the inorganic material. The organic polymer is a low-polar siloxane amine oligomer selected from polysiloxane amine represented by formula 1a, 1b and 1c. In the formulae, each of R1 and R2 is -(CH2)nX(CH2)k-; X is -CH2- or -O-; each of l, m, k is an integer of 1-300. The siloxane amine oligomer has weight average molecular weight(Mw) of 1,000-50,000 g/mol, and equivalent weight of functionality of 500-25,000 g/eq.
Abstract translation: 目的：提供具有改善的耐热性和组织性的有组织的无机材料，可用作各种电气，电子，（航空）航天工业，航空工业等高科技行业的关键复合材料。 构成：有组织的层状无机材料由基于硅铝酸盐的层状无机材料和位于无机材料层之间的有机聚合物组成。 有机聚合物是选自由式1a，1b和1c表示的聚硅氧烷胺的低极性硅氧烷胺低聚物。 在该式中，R 1和R 2各自为 - （CH 2）n X（CH 2）k - ; X是-CH 2 - 或-O-; l，m，k中的每一个为1-300的整数。 硅氧烷胺低聚物的重均分子量（Mw）为1,000-50,000g / mol，官能度当量为500-25,000g / eq。
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公开(公告)号：KR1020020013980A
公开(公告)日：2002-02-25
申请号：KR1020000046257
申请日：2000-08-10
Applicant: 한국화학연구원
CPC classification number: C08J7/042 , C08J5/18 , C08L67/00 , C09D133/24
Abstract: PURPOSE: A polyester/polyamide hybrid film is provided in which heat resistance, transparency and interfacial adhesive property are greatly improved by coating a mixture of a polyamide resin solution and a polyamic acid solution on an aromatic polyester film to a thin film, and a method for manufacturing the same is provided. CONSTITUTION: The polyester/polyamide hybrid film having superior adhesive property is characterized in that a mixed resin of soluble polyamide of the following Chemical Formula(II) and polyamic acid of the following Chemical Formula(III) is coated on one or both surfaces of an aromatic polyester film represented as in the following Chemical Formula(I) to a thin film. In the chemical formulae, m and n are integers greater than 1, X is -CH2- or -O-.
Abstract translation: 目的：提供一种聚酯/聚酰胺混合膜，其通过将芳族聚酯膜上的聚酰胺树脂溶液和聚酰胺酸溶液的混合物涂布在薄膜上而大大提高耐热性，透明性和界面粘合性， 提供制造相同的。 构成：具有优异粘合性的聚酯/聚酰胺混合薄膜的特征在于，将以下化学式（II）的可溶性聚酰胺和下述化学式（III）的聚酰胺酸的混合树脂涂覆在 芳族聚酯膜如下述化学式（I）所示。 在化学式中，m和n是大于1的整数，X是-CH 2 - 或-O-。
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