DISPERSION FOR APPLYING A METAL LAYER

    公开(公告)号:CA2727215A1

    公开(公告)日:2009-12-17

    申请号:CA2727215

    申请日:2009-06-08

    Applicant: BASF SE

    Abstract: The invention relates to a dispersion for applying a metal layer to an electrically non-conductive substrate, said dispersion containing an organic binder component, a metal component and a solvent component. The invention further relates to methods for producing said dispersion, to methods for producing an optionally structured metal layer using said dispersion and to the substrate surfaces obtained in said manner and the use thereof.

    METHOD FOR PRODUCING METAL-COATED BASE LAMINATES

    公开(公告)号:CA2685517A1

    公开(公告)日:2008-11-27

    申请号:CA2685517

    申请日:2008-05-20

    Applicant: BASF SE

    Abstract: The invention relates to a method for the production of metal-coated base laminates having a carrier (51) made of an electrically non-conductive mate rial (37) that is coated on at least one side with a metal coating (25, 53). In a first step, a base coating (11) is applied onto a substrate (3) having a dispersion (5) containing particles in a matrix material that can be coat ed in a current-free and/or galvanized manner. The matrix material is at lea st partially cured and/or dried. A metal coating is subsequently formed on t he base coating (11) by means of a current-free and/or galvanic coating. The carrier (51) made of the electrically non-conductive material (37) is lamin ated onto the metal coating (25). As a final step, the carrier (51) is remov ed from the substrate (3) along with the metal coating (25) laminated thereo n and at least part of the base coating (11).

    METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE SURFACES ON A CARRIER

    公开(公告)号:CA2654797A1

    公开(公告)日:2007-12-21

    申请号:CA2654797

    申请日:2007-06-11

    Applicant: BASF SE

    Abstract: Method for producing electrically conductive, structured or whole-area su rfaces on a carrier, in which a first step involves applying a structured or whole-area base layer to the carrier with a dispersion containing electrica lly conductive particles in a matrix material, a second step involves at lea st partly curing or drying the matrix material, a third step involves uncove ring the electrically conductive particles by at least partly breaking up th e matrix, and a fourth step involves forming a metal layer on the structured or whole-area base layer by means of electroless or electrolytic coating.

    ELECTROPLATING DEVICE AND METHOD
    34.
    发明专利

    公开(公告)号:CA2647969A1

    公开(公告)日:2007-10-25

    申请号:CA2647969

    申请日:2007-04-05

    Applicant: BASF SE

    Abstract: The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.

    Dispersion containing two different metals for applying a metal layer

    公开(公告)号:AU2006289126A1

    公开(公告)日:2007-03-15

    申请号:AU2006289126

    申请日:2006-08-31

    Applicant: BASF SE

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    37.
    发明专利
    未知

    公开(公告)号:BRPI0811243A2

    公开(公告)日:2014-11-04

    申请号:BRPI0811243

    申请日:2008-05-20

    Applicant: BASF SE

    Abstract: The invention relates to a method for producing metal-coated base laminates having a support (51) made of an electrically nonconductive material (37), which is coated on at least one side with a metal layer (25, 53). In a first step, a base layer (11) is applied onto a substrate (3) with a dispersion (5), which contains electrolessly and/or electrolytically coatable particles in a matrix material. The matrix material is at least partially cured and/or dried. A metal layer is subsequently formed on the base layer (11) by electroless and/or electrolytic coating. The support (51) made of the electrically nonconductive material (37) is laminated onto the metal layer (25). The support (51) laminated with the metal layer (25) and at least a part of the base layer (11) are subsequently removed from the substrate (3).

    38.
    发明专利
    未知

    公开(公告)号:BRPI0615863A2

    公开(公告)日:2012-12-18

    申请号:BRPI0615863

    申请日:2006-08-31

    Applicant: BASF SE

    Abstract: Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.

    40.
    发明专利
    未知

    公开(公告)号:BRPI0806629A2

    公开(公告)日:2011-09-13

    申请号:BRPI0806629

    申请日:2008-01-17

    Applicant: BASF SE

    Abstract: Method for producing structured electrically conductive surfaces on a substrate, which comprises the following steps: a) structuring a base layer containing electrolessly and/or electrolytically coatable particles on the substrate by ablating the base layer according to a predetermined structure with a laser, b) activating the surface of the electrolessly and/or electrolytically coatable particles and c) applying an electrically conductive coating onto the structured base layer.

Patent Agency Ranking