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    Phased-array transceiver
    32.
    发明专利
    Phased-array transceiver 未知

    公开(公告)号：GB2509414A

    公开(公告)日：2014-07-02

    申请号：GB201403466

    申请日：2012-06-21

    Applicant: IBM

    Inventor： REYNOLDS SCOTT ,  LIU DUIXIAN ,  NATARAJAN ARUN ,  GARCIA ALBERTO VALDES ,  FRIEDMAN DANIEL JOSEPH

    IPC: H01Q21/06 ,  H01L23/58 ,  H01Q1/22 ,  H01Q23/00

    Abstract: Systems, methods, devices and apparatuses directed to transceiver devices are disclosed. In accordance with one method, a first set of antenna positions in a first section of a set of sections of a circuit layout for the circuit package is selected. The method further includes selecting another set of antenna positions in another section of the circuit layout such that an arrangement of selected antenna positions of the other set is different from an arrangement of selected antenna positions of a previously selected set of antenna positions. The selecting another set of positions in another section is iterated until selections have been made for a total number of antennas. The selecting the other set is performed such that consecutive unselected positions in the other section do not exceed a predetermined number of positions. In addition, antenna elements are formed at the selected positions to fabricate the circuit package.

    RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES
    33.
    发明专利
    RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES 未知

    公开(公告)号：CA2713353C

    公开(公告)日：2014-06-10

    申请号：CA2713353

    申请日：2008-12-30

    Applicant: IBM

    Inventor： AKKERMANS JOHANNES A G ,  FLOYD BRIAN A ,  LIU DUIXIAN

    IPC: H01Q21/06 ,  H01Q1/38

    Abstract: A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane. The ground plane is formed with at least N coupling aperture slots therein. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio-frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is formed with the chip located in a chip-receiving cavity. A second substrate layer is interposed be-tween the ground plane and a plane defined by the patch. The patch is formed in a first metal layer, the ground plane in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located.

    Integrated multiband antennas for computing devices
    35.
    发明专利
    Integrated multiband antennas for computing devices 未知

    公开(公告)号：GB2430081A

    公开(公告)日：2007-03-14

    申请号：GB0617193

    申请日：2005-02-23

    Applicant: IBM

    Inventor： GAUCHER BRIAN PAUL ,  LEE PETER ,  LIU DUIXIAN ,  WU CHANGYU

    IPC: H01Q5/00 ,  H01Q1/24 ,  H01Q5/10 ,  H01Q5/371 ,  H01Q5/378 ,  H01Q9/04 ,  H01Q9/06

    Abstract: Multiband antennas are provided that can be embedded in computing devices such as portable laptop computers and cellular phones, for example, to provide efficient wireless communication in multiple frequency bands. Exemplary embodiments include monopole multiband antennas, dipole multiband antennas, and inverted-F antennas, having one or more coupled and/or branch radiating elements, for providing multiband operation in two or more frequency bands. For example, an exemplary multiband antenna (100) includes a ground element (101), a monopole radiator (102) connected to the ground element (101) and having a feed tab (103) extending therefrom, a coupled radiator (104) connected to the ground element (101) and a branch radiator (105) that is connected to the monopole radiator (102). The antenna elements can be formed from thin sheet metal, such as copper or brass. The antenna (100) can be fed using a coaxial cable, for example, wherein a center conductor is electrically connected to feed element (103) via a solder connection and wherein in the outer conductor (ground) of the coaxial cable is electrically connected to the ground element (101) via a solder connection.

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