公开(公告)号：DE102004020547A1

公开(公告)日：2005-11-17

申请号：DE102004020547

申请日：2004-04-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L23/50

Abstract: Composite consisting of a semiconductor device (10) and a carrier substrate (14), elastically deformable wave-like protruberances (12) in a first predetermined section on the semiconductor, a conductive pad (13) at least on protruberances (12) with a first chip contact pad (11) on the semiconductor device, and a first substrate contact device (15) on the carrier substrate (14). An independent claim is included for a method of preparing the composite.

公开(公告)号：DE102004015597A1

公开(公告)日：2005-11-03

申请号：DE102004015597

申请日：2004-03-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MEYER THORSTEN ,  HEDLER HARRY ,  IRSIGLER ROLAND ,  WOLTER ANDREAS

IPC: H01L23/24 ,  H01L23/29 ,  H01L23/48 ,  H01L23/498

Abstract: Semiconductor system comprises a substrate (10) with a contact pad (11) which is connected by conductors (12) to connectors, e.g. solder beads (13). The system is encapsulated (14) on at least five sides and a mechanical decoupling system (15) is mounted between the encapsulation and the semiconductor. An independent claim is included for a method for making the semiconductor system.

公开(公告)号：DE10345395A1

公开(公告)日：2005-05-04

申请号：DE10345395

申请日：2003-09-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  IRSIGLER ROLAND

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H01L27/108

公开(公告)号：DE10319538A1

公开(公告)日：2004-11-25

申请号：DE10319538

申请日：2003-04-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  MEYER THORSTEN

IPC: H01L23/48 ,  H01L25/065 ,  H01L23/50 ,  H01L21/60

Abstract: A semiconductor device has a semiconductor substrate, at least a first and second rewiring device on a first surface of the semiconductor substrate for the provision of an electrical contact-connection of the semiconductor substrate, and a tapering, continuous opening from a first surface to a second, opposite surface of the semiconductor substrate. At least a third and fourth rewiring device is disposed on the second surface of the semiconductor substrate and a patterned metallization on the side areas of the opening for the separate contact-connection of the first and at least the second rewiring device.

公开(公告)号：DE10255848A1

公开(公告)日：2004-06-17

申请号：DE10255848

申请日：2002-11-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MUFF SIMON ,  HEDLER HARRY

IPC: H01L25/065 ,  H01L23/50

Abstract: Semiconductor component, especially a memory module has a circuit board with a number of semiconductor chips which are attached to the circuit board with their longitudinal axis perpendicular to it. An Independent claim is made for a method of manufacture of semiconductor memory modules in which the memory chips are manufactured with contacts on both sides of one of their foot or small cross section ends. The chip is then attached to a support circuit board with the longitudinal axis perpendicular to the circuit board.

公开(公告)号：DE10239080A1

公开(公告)日：2004-03-11

申请号：DE10239080

申请日：2002-08-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  VASQUEZ BARBARA

IPC: H01L23/485 ,  H01L23/48 ,  H01L23/04 ,  H01L23/50

Abstract: Integrated circuit (10) comprises an elastically deformable protrusion (11), a contact unit (13) formed on the protrusion to provide an electrical bond, and a rewiring unit (12) for electrically connecting an active semiconductor section of the circuit to the contact unit. The rewiring structure runs in a spiral manner on the protrusion and elastically deforms to contact an electrical unit. An Independent claim is also included for an alternative integrated circuit.

公开(公告)号：DE10233641A1

公开(公告)日：2004-02-12

申请号：DE10233641

申请日：2002-07-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY

IPC: H01L21/60 ,  H01L23/04 ,  H01L23/485

Abstract: A process for connecting an integrated circuit (1), especially a chip, wafer or hybrid, with a substrate (30) provides corresponding electrical contacts on the IC (3,4) and substrate (33), at least one of which is elastically elevated and bringing the IC to a frame (22) and joining the electrical contacts together by compressing the elastic elevation. An Independent claim is also included for the device formed as above.

公开(公告)号：DE10156386A1

公开(公告)日：2003-06-05

申请号：DE10156386

申请日：2001-11-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  VASQUEZ BARBARA

IPC: H01L23/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/485

Abstract: A process for producing a semiconductor chip having contact elements protruding on one chip side within the context of wafer level packaging, the chip side provided with the contact elements being coated with a covering compound forming a protective layer, from which the protruding contact element project.

公开(公告)号：DE10134011A1

公开(公告)日：2003-01-30

申请号：DE10134011

申请日：2001-07-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  VASQUEZ BARBARA

IPC: H01L23/498 ,  H05K1/02 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01L23/50

Abstract: An elastic layer is located between the contacts and the first principal side (I) of the substrate layer (1)

公开(公告)号：DE10126568A1

公开(公告)日：2002-12-19

申请号：DE10126568

申请日：2001-05-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  VASQUEZ BARBARA

IPC: H01L23/13 ,  H01L23/498 ,  H05K3/32