Patent search ap:("LUXVUE TECHNOLOGY CORP") AND inv:"BIBL ANDREAS" Page 4

31.

发明公开
COMPLIANT MICRO DEVICE TRANSFER HEAD 有权
Title translation: NACHGIEBIGER TRANSFERKOPFFÜREINE MIKROVORRICHTUNG

公开(公告)号：EP2847789A4

公开(公告)日：2016-01-20

申请号：EP13788027

申请日：2013-05-01

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS , HIGGINSON JOHN A , HU HSIN-HUA

IPC: H01L21/677 , B65G49/07 , H01L21/50 , H01L21/60 , H01L21/67 , H01L21/683 , H01L23/00 , H01L25/075

CPC classification number: B41J2/385 , B25J15/0052 , B25J15/0085 , B41J2/39 , B81B2201/038 , B81C99/002 , H01L21/67144 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L24/97 , H01L25/0753 , H01L33/0079 , H01L2221/68322 , H01L2221/68354 , H01L2221/68363 , H01L2221/68381 , H01L2224/29036 , H01L2224/29101 , H01L2224/2919 , H01L2224/7565 , H01L2224/7598 , H01L2224/83815 , H01L2224/83855 , H01L2224/97 , H01L2924/12041 , H01L2924/00 , H01L2224/83 , H01L2924/00014

Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.

Abstract translation: 公开了一种兼容的微器件传送头和头阵列。在一个实施例中，微器件转移头包括可偏转到基底基板和弹簧部分之间的空间中的弹簧部分。

32.

发明公开
METHOD OF FORMING A MICRO LED STRUCTURE AND ARRAY OF MICRO LED STRUCTURES WITH AN ELECTRICALLY INSULATING LAYER 审中-公开
Title translation: LED结构中形成微LED结构和布置的微方法有电绝缘层

公开(公告)号：EP2780954A4

公开(公告)日：2015-07-22

申请号：EP12849508

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： HU HSIN-HUA , BIBL ANDREAS , HIGGINSON JOHN A , LAW HUNG-FAI STEPHEN

IPC: H01L33/46 , H01L33/00 , H01L33/20 , H01L33/36 , H01L33/48

CPC classification number: H01L33/20 , H01L24/75 , H01L24/83 , H01L24/95 , H01L27/156 , H01L33/0079 , H01L33/0095 , H01L33/405 , H01L2224/7598 , H01L2224/83191 , H01L2924/12041 , H01L2924/12042 , H01L2924/00

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

33.

发明公开
MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE 有权
Title translation: 麻醉药品 - ÜBERTRAGUNGSKOPFMIT EINER SILICIUMELEKTRODE

公开(公告)号：EP2834840A4

公开(公告)日：2016-01-06

申请号：EP13794179

申请日：2013-05-16

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： GOLDA DARIUSZ , BIBL ANDREAS

IPC: H01L21/677 , B65G49/07 , B81C1/00

CPC classification number: B81C99/0025 , B81C2201/0194 , H01L21/67144 , H01L24/75 , H01L2224/7598

34.

发明公开
MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE 审中-公开
Title translation: AUFTRAGSKOPFHEIZSYSTEMFÜREINE MIKROVORRICHTUNG UND VERFAHREN ZUMÜBERTRAGENEINER MIKROVORRICHTUNG

公开(公告)号：EP2780936A4

公开(公告)日：2015-07-29

申请号：EP12849914

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORP

Inventor： BIBL ANDREAS , HIGGINSON JOHN A , LAW HUNG-FAI STEPHEN , HU HSIN-HUA

IPC: H01L21/677 , B32B38/18 , B65G47/91 , B65G49/07 , H01L21/67 , H01L23/00 , H05K13/02 , H05K13/04

CPC classification number: H01L29/167 , B32B38/18 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2933/0066 , Y10T156/1153 , Y10T156/17 , Y10T156/1705 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , Y10T156/1911 , H01L2224/83 , H01L2924/00

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