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    ELECTROLESS COPPER DEPOSITION SOLUTION USING A HYPOPHOSPHITE REDUCING AGENT
    32.
    发明专利
    ELECTROLESS COPPER DEPOSITION SOLUTION USING A HYPOPHOSPHITE REDUCING AGENT 未知

    公开(公告)号：CA1130952A

    公开(公告)日：1982-09-07

    申请号：CA325487

    申请日：1979-04-12

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

    IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

    Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a suitably catalysed and generally non-conductive workpiece surface using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with solution. The reducing agent is a soluble source of hypophosphite ions and the complexing agent is selected to be effective at pH level between 5 and 13 for complexing cupric ions and the solution pH is coordinated within the pH range for the complexer selected to give a deposited conductive copper film.

    COMPOSITION AND METHOD FOR CONTINUOUS ELECTROLESS COPPER DEPOSITION USING A HYPOPHOSPHITE REDUCING AGENT IN THE PRESENCE OF COBALT OR NICKEL IONS
    33.
    发明专利
    COMPOSITION AND METHOD FOR CONTINUOUS ELECTROLESS COPPER DEPOSITION USING A HYPOPHOSPHITE REDUCING AGENT IN THE PRESENCE OF COBALT OR NICKEL IONS 未知

    公开(公告)号：CA1117704A

    公开(公告)日：1982-02-09

    申请号：CA338071

    申请日：1979-10-19

    Applicant: MACDERMID INC

    Inventor： BASKER RACHEL NEE GOLDSTEIN ,  KUKANSKIS PETER E ,  GRUNWALD JOHN J

    IPC: C23C18/40 ,  C23C18/48 ,  C23C3/02

    Abstract: Electroless copper deposition solutions, and method of continuously electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, a non-formaldehyde copper reducing agent, such as hypophosphite, effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution, and a soluble source of non-copper metallic ions, such as nickel or cobalt ions, which act as an autocatalysis promoter to enable continuous plating using the solutions. The solutions are maintained in an alkaline condition and preferably in a pH range of 11-14 through the addition of pH adjusters. The properties of plating baths using the solutions, such as bath stability as well as plating process parameters such as plating rate, and the quality of deposit may be advantageously controlled through the appropriate selection of the noncopper metallic ion added and the complexing agent used. Optional additives, such as polymers, wetting agents, and various soluble unsaturated organic compounds, may also be utilized to influence these variables.

    ELECTROLESS COPPER DEPOSITION SOLUTION
    38.
    发明专利
    ELECTROLESS COPPER DEPOSITION SOLUTION 未知

    公开(公告)号：AU536632B2

    公开(公告)日：1984-05-17

    申请号：AU4641779

    申请日：1979-04-24

    Applicant: MACDERMID INC

    Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

    IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

    Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with non-formaldehyde-type agents, specifically hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.

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