公开(公告)号：EP1949276A4

公开(公告)日：2009-11-11

申请号：EP06826540

申请日：2006-10-24

Applicant: MOTOROLA INC

Inventor： BRAZIS PAUL W ,  GAMOTA DANIEL R ,  KALYANASUNDARAM KRISHNA ,  ZHANG JIE

IPC: H01L29/417

CPC classification number: H01L29/41733 ,  H01L27/1292 ,  H01L51/0022 ,  H01L51/055 ,  H01L51/102 ,  H01L2924/19043 ,  H01L2924/30105

公开(公告)号：DE112007002913T5

公开(公告)日：2009-09-17

申请号：DE112007002913

申请日：2007-10-23

Applicant: MOTOROLA INC

Inventor： WIELGUS JERZY ,  GAMOTA DANIEL R ,  SZCZECH JOHN B ,  ZHANG JIE

IPC: B05D3/00 ,  G03C1/00

Abstract: A protective photochromic barrier film for a light-sensitive printed electronic substrate. Light-sensitive semiconductor devices on a dielectric substrate are electrically connected by conductors. A barrier layer containing photochromic dyes covers some or all of the light-sensitive semiconductor devices. Upon exposure to visible, infrared, or ultraviolet light, the photochromic dyes change chemical structure and decrease the amount of visible or non-visible light that can impinge upon the light-sensitive electronic devices. Upon removal of the visible or non-visible light, the photochromic dyes either revert to their original structure or maintain their altered state.

公开(公告)号：EP1540734A4

公开(公告)日：2010-10-27

申请号：EP03763068

申请日：2003-06-03

Applicant: MOTOROLA INC

Inventor： ZHANG JIE ,  BRAZIS PAUL ,  GAMOTA DANIEL ,  KALANASUNDARAM KRISHNA ,  SCHEIFERS STEVEN ,  WIELGUS JERZY ,  CHOWDHURI ABHIJIT ROY

IPC: H01L29/417 ,  H01L21/336 ,  H01L21/338 ,  H01L29/786 ,  H01L29/812 ,  H01L35/24 ,  H01L51/00 ,  H01L51/05 ,  H01L51/30 ,  H01L51/40 ,  H01L29/06

CPC classification number: H01L51/0516 ,  B82Y10/00 ,  H01L27/283 ,  H01L51/0024 ,  H01L51/0036 ,  H01L51/0038 ,  H01L51/0046 ,  H01L51/0052 ,  H01L51/0053 ,  H01L51/0078 ,  H01L51/0097 ,  H01L51/0512 ,  H01L51/0541 ,  H01L51/0545

公开(公告)号：EP1779412A4

公开(公告)日：2009-08-05

申请号：EP05760423

申请日：2005-06-09

Applicant: MOTOROLA INC

Inventor： ADEWOLE HAKEEM B ,  BRAZIS PAUL W ,  GAMOTA DANIEL R ,  WIELGUS JERZY ,  ZHANG JIE

IPC: H01L21/00 ,  B41J2/175

CPC classification number: H01L51/0097 ,  H01L27/283 ,  H01L51/0004 ,  Y02E10/549

Abstract: Two or more semiconductor devices (21 and 22) are formed on a substrate (20) and are each comprised of a plurality of printed components (23 and 24). At least one such printed component (25) is shared by both such semiconductor devices.

公开(公告)号：DE112007002911T5

公开(公告)日：2010-01-07

申请号：DE112007002911

申请日：2007-10-16

Applicant: MOTOROLA INC

Inventor： WIELGUS JERZY ,  GAMOTA DANIEL R ,  SZCZECH JOHN B ,  ZHANG JIE

IPC: H05K3/46 ,  H05K1/16

Abstract: A printed electronic device and methods for determining the electrical value of the device. A dielectric material is contact printed on a substrate using a preset force. The substrate has a pressure sensitive material that is optically responsive in direct proportion to the amount of force imparted by the contact printing. The force of the contact printing causes the pressure sensitive material to form a pattern that is quantifiable to the amount of force. The pattern is then optically inspected and compared to sets of standards in order to quantify the amount of force that was used in printing. The thickness of the printed dielectric material is then calculated based on the quantified force by comparing to another set of standards. The electrical value of the printed material is calculated based on the calculated thickness of the printed dielectric material, the surface area of the printed dielectric material, and the dielectric constant of the dielectric material.

公开(公告)号：AU2002348252A1

公开(公告)日：2003-07-24

申请号：AU2002348252

申请日：2002-11-25

Applicant: MOTOROLA INC

Inventor： KALYANSUNDARAM KRISHNA ,  BRAZIS PAUL W JR ,  ZHANG JIE ,  GAMOTA DANIEL R

IPC: H01L35/24 ,  H01L51/00 ,  H01L51/40

公开(公告)号：AU2002346547A1

公开(公告)日：2003-07-24

申请号：AU2002346547

申请日：2002-11-25

Applicant: MOTOROLA INC

Inventor： LACH LAWRENCE E ,  SCHEIFERS STEVEN M ,  ZHANG JIE ,  GAMOTA DANIEL R ,  BRAZIS JR PAUL W

IPC: H01L21/28 ,  H01L21/338 ,  H01L29/417 ,  H01L29/812 ,  H01L51/00 ,  H01L51/05 ,  H01L51/40 ,  H01L27/00

公开(公告)号：EP2050090A4

公开(公告)日：2010-08-11

申请号：EP07812141

申请日：2007-06-14

Applicant: MOTOROLA INC

Inventor： JONNALAGADDA KRISHNA D ,  CHASON MARC K ,  GAMOTA DANIEL R ,  ZHANG JIE

IPC: G09G3/30 ,  G09G3/06 ,  G09G3/12

CPC classification number: H05B33/06

公开(公告)号：EP1472744A4

公开(公告)日：2010-03-10

申请号：EP02794299

申请日：2002-12-18

Applicant: MOTOROLA INC

Inventor： SCHEIFERS STEVEN M ,  GAMOTA DANIEL R ,  BRAZIS PAUL W JR ,  ZHANG JIE ,  LACH LAWRENCE E

IPC: H01L21/316 ,  H01L29/76 ,  H01L35/24 ,  H01L51/00 ,  H01L51/30 ,  H01L51/40

CPC classification number: H01L51/0512 ,  H01L21/31683 ,  H01L51/0021 ,  H01L51/0545

Abstract: A semiconductor device having a flexible or rigid substrate (11) having a gate electrode (21), a source electrode (61 and 101), and a drain electrode (62 and 102) formed thereon and organic semiconductor material (51, 81, and 91) disposed at least partially thereover. The gate electrode (21) has a thin dielectric layer 41 formed thereabout through oxidation. In many of the embodiments, any of the above elements can be formed through contact or non-contact printing. Sizing of the resultant device can be readily scaled to suit various needs.

公开(公告)号：EP1461832A4

公开(公告)日：2008-04-30

申请号：EP02784615

申请日：2002-11-25

Applicant: MOTOROLA INC

Inventor： LACH LAWRENCE E ,  SCHEIFERS STEVEN M ,  ZHANG JIE ,  GAMOTA DANIEL R ,  BRAZIS PAUL W JR

IPC: H01L21/28 ,  H01L21/338 ,  H01L29/417 ,  H01L29/812 ,  H01L51/00 ,  H01L51/05 ,  H01L51/40 ,  H01L27/00

CPC classification number: H01L51/0508 ,  H01L51/0004 ,  H01L51/0005 ,  H01L51/0021

Abstract: A semiconductor device comprising a flexible or rigid substrate (10) having a gate electrode (11), a source electrode (12), and a drain electrode (13) formed thereon and organic semiconductor material (14) disposed at least partially thereover. With appropriate selection of material, the gate electrode (11) will form a Schottky junction and an ohmic contact will form between the organic semiconductor material (14) and each of the source electrode (12) and drain electrode (13). In many of the embodiments, any of the above elements can be formed through contact or non-contact printing. Sizing of the resultant device can be readily scaled to suit various needs.