公开(公告)号：EP3726113A1

公开(公告)日：2020-10-21

申请号：EP20169706.7

申请日：2020-04-15

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  BALDO, Lorenzo

IPC: F16K99/00

Abstract: A microfluidic valve (50) formed in a body (51) having a first (51A) and a second (51B) surface; an inlet channel (54) extending in the body (51) from the second surface (51B); a first transverse channel (56) extending in the body (51) in a transverse direction with respect to the inlet channel (54); and an outlet channel (60) extending in the body (51) from the first surface (51A). The inlet channel (54), the first transverse channel (56) and the outlet channel (60) form a fluidic path (92). The microfluidic valve (50) further has an occluding portion (62), formed by the body (51) and extending over the transverse channel (56); and a piezoelectric actuator (72) coupled to the occluding portion (62) and configured to move the occluding portion (62) from an opening position of the valve (50), where the occluding portion (62) does not interfere with the fluidic path (92), and a closing position of the valve (50), where the occluding portion (62) interferes with and interrupts the fluidic path (92).

公开(公告)号：EP3205997B1

公开(公告)日：2019-06-19

申请号：EP17156382.8

申请日：2017-02-15

Applicant: STMicroelectronics S.r.l.

Inventor： DUQI, Enri ,  MURARI, Bruno ,  CONTI, Sebastiano

IPC: B81B7/00 ,  G01L19/06 ,  G01L9/00 ,  G01L15/00

公开(公告)号：EP3225586B1

公开(公告)日：2019-05-08

申请号：EP16194692.6

申请日：2016-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： BALDO, Lorenzo ,  ZERBINI, Sarah ,  DUQI, Enri

IPC: B81C1/00 ,  G01L9/00

公开(公告)号：EP3225586A1

公开(公告)日：2017-10-04

申请号：EP16194692.6

申请日：2016-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： BALDO, Lorenzo ,  ZERBINI, Sarah ,  DUQI, Enri

IPC: B81C1/00

CPC classification number: G01L9/0052 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C1/00182 ,  B81C2201/0116

Abstract: A process for manufacturing a MEMS pressure sensor (42) having a micromechanical structure (35) envisages: providing a wafer (1) having a substrate of semiconductor material and a top surface (2a); forming a buried cavity (10) entirely contained within the substrate (2) and separated from the top surface (2a) by a membrane (12) suspended above the buried cavity (10); forming a fluidic-communication access (22; 37) for fluidic communication of the membrane (12) with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane (12), a plate region (30) made of conductive material, separated from the membrane (12) by an empty space (24); and forming electrical-contact elements (30a, 30b) for electrical connection of the membrane (12) and of the plate region (30), which are designed to form the plates of a sensing capacitor (C), the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor (42) having the micromechanical structure (35) is moreover described.

Abstract translation: 一种用于制造具有微机械结构（35）的MEMS压力传感器（42）的方法设想：提供具有半导体材料衬底和顶表面（2a）的晶片（1）; 形成完全包含在所述衬底（2）内并且通过悬挂在所述掩埋腔（10）上方的膜（12）与所述顶表面（2a）分离的掩埋腔（10）; 形成用于所述膜（12）与外部环境的流体连通的流体连通入口（22; 37），所述外部环境设定为必须确定其值的压力; 形成悬置在所述膜（12）上方的由导电材料制成的板区域（30），所述板区域通过空的空间（24）与所述膜（12）分开; 和形成用于电连接膜（12）和板区域（30）的电接触元件（30a，30b），所述电接触元件被设计为形成感测电容器（C）的板，其电容值 表示要检测的压力的值。 此外还描述了具有微机械结构（35）的相应的MEMS压力传感器（42）。