公开(公告)号：JPH10292117A

公开(公告)日：1998-11-04

申请号：JP19666697

申请日：1997-07-23

Applicant: TORAY INDUSTRIES

Inventor： KOBAYASHI SADAYUKI ,  ISHIO ATSUSHI ,  KOBAYASHI KAZUHIKO

IPC: C08K5/3445 ,  C08L79/08 ,  C08L81/02

Abstract: PROBLEM TO BE SOLVED: To obtain a polyphenylene sulfide resin composition causing suppressed burr generation, having excellent flowability and especially useful for small-sized precision parts, etc., by adding a specified amount of a specific aromatic imide compound. SOLUTION: The objective composition is produced including (A) 99.9-80 wt.% of a polyphenylene sulfide resin and (B) 0.1-20 wt.% of an aromatic imide compound containing one or more aromatic groups and one or more imide groups in one molecule and having an average molecular weight of =240 deg.C measured by a differential scanning calorimeter (scanning speed: 20 deg.C/min) under decreasing temperature, e.g. an aromatic imide oligomer expressed by the formula (Ar1 is an aromatic tetracarboxylic acid residue; Ar2 is an aromatic diamine residue; Ar3 is an acid anhydride residue; (n) is 0-5).

公开(公告)号：JPH08333513A

公开(公告)日：1996-12-17

申请号：JP8373796

申请日：1996-04-05

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  KOBAYASHI KAZUHIKO

IPC: C08J5/00 ,  B29C45/00 ,  C08K5/20 ,  C08K5/54 ,  C08K5/541 ,  C08L81/02

Abstract: PURPOSE: To obtain a polyphenylene sulfide resin composition excellent in forming cyclic peoperty during injection molding and useful for a connecter, a coil, sealing part, etc., by compounding a polyamide oligomer and a bisamide compound in a specific ratio. CONSTITUTION: This composition is obtained by compounding (A) 100 pts.wt. of a polyphenylene sulfide resin with (B) 0.05-5 pts.wt. of the mixture of (i) a polyamide oligomer of the formula, R CO(NHR NHCOR CO)n NHR NHCOR [R and R are each a 10-40C monovalent organic group; R to R are each a 2-20C divalent organic group; (n)=1-30] and (ii) a bisamide of the formula, R CONHR NHCOR (R and R are each a 10-40C monovalent organic group; R is a 2-20C divalent organic group) in a ratio, component i/component ii, of 90/10 to 30/70 in terms of weight ratio.

公开(公告)号：JPH07228778A

公开(公告)日：1995-08-29

申请号：JP30650494

申请日：1994-12-09

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  KOBAYASHI KAZUHIKO

IPC: C08J5/00 ,  C08K3/00 ,  C08K5/00 ,  C08K5/20 ,  C08K7/02 ,  C08L77/00 ,  C08L81/02

Abstract: PURPOSE:To provide a rein composition improved in adhesion to epoxy resin without detriment to heat stability, melt flow and mechanical properties by mixing a polyphenylene pulfide resin with a specified polyamide oligomer and a (non)fibrous filler. CONSTITUTION:This composition is prepared by mixing 100 pts.wt. polyphenylene sulfide resin having a melt viscosity (as measured at 320 deg.C and a shear rate of 10 sec ) of 50-20000 P and a melt flow rate after a 15-min residence as defined in ASTM-D1238-86 (under a load of 5000g at 315.5 deg.C) which corresponds to at least 50% of the melt flow rate after a 5-min residence with 0.05-5 pts.wt. polyamide oligomer terminated with a 5-30 C hydrocarbon group and having a number-average molecular weight of 5000 or below, and 0-400 pts.wt. (non)fibrous filler.

公开(公告)号：JPH07224210A

公开(公告)日：1995-08-22

申请号：JP31387294

申请日：1994-12-16

Applicant: TORAY INDUSTRIES

Inventor： GOTO NORIAKI ,  AKIYAMA FUMIO ,  ISHIO ATSUSHI

IPC: C08L67/00 ,  C08L81/02

Abstract: PURPOSE:To obtain a polyphenylene sulfide resin molding reduced in the burr formation and improved in weld strength by using a composition prepared by mixing a specified polyphenylene sulfide resin with a specified liquid crystal polymer, a specified epoxy compound and a filler. CONSTITUTION:100 pts.wt., in total, 95-5wt.% polyphenylene sulfide(PPS) having a number-average molecular weight of 7000-15000 (gel permeation chromatography using a 1-chloronaphthalene solvent) and having no cross-linkage and 5-95wt.% liquid crystal polymer capable of forming an anisotropic melt phase when melted is mixed with 0.1-5 pts.wt. at least either of the epoxy compounds of formulas I and II (wherein G is a group of formula III) and 0-400 pts.wt. filler, and the resulting mixture is injection-molded under conditions including a cylinder temperature equal to the lowest possible molding temperature +10$0C, a mold temperature of 130 deg.C and a 1mm-thick ASTM No.4 dumbbell to obtain a molding composed of a nonweld part and a central weld part, having a weld strength retention (w) (as defined by formula IV) of 10% or above, and satisfying the relationships of formulas V and VI [wherein b is the rate (%) of the above PPS resin, and g is the rate (%) of the filler based on the total composition].

公开(公告)号：JPH07157660A

公开(公告)日：1995-06-20

申请号：JP30433693

申请日：1993-12-03

Applicant: TORAY INDUSTRIES

Inventor： SAKAMOTO KOSUKE ,  ISHIO ATSUSHI ,  KOBAYASHI KAZUHIKO

IPC: C08L81/02

Abstract: PURPOSE:To obtain the subject compsn. which contains very low amt. of water- sol. components such as a water-sol. org. substance or a metal-ionic substance. CONSTITUTION:This resin compsn. comprises 97-70wt.% polyphenylene sulfide resin, 3-30wt.% copolymer produced mainly from ethylene and glycidyl acrylate or methacrylate, and 0-27wt.% at least one polyolefin elastomer selected from the group consisting of an ethylene/propylene copolymer, an ethylene/butene copolymer, an ethylene/methacrylic acid deriv. copolymer, and ethylene/acrylic acid deriv. copolymer. When the compsn. is immersed in superpure water having a total org. carbon content of 40mug/l at a bath ratio by wt. of 1:1 at 80 deg.C for 7 days, the total org. carbon content of the water is 4mg/l or lower.

公开(公告)号：JPH0762237A

公开(公告)日：1995-03-07

申请号：JP21627893

申请日：1993-08-31

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  SAKAMOTO KOSUKE ,  KOBAYASHI KAZUHIKO

IPC: C08K3/00 ,  C08K5/3415 ,  C08K7/02 ,  C08L81/02

Abstract: PURPOSE:To obtain the subject composition useful for electric/electronic parts, etc., having excellent moldability, processability, etc., by blending a specific polyphenylene sulfide resin with a butanetetracarboxylic acid bisimide compound and a filler in a prescribed blending ratio. CONSTITUTION:This composition is obtained by blending (A) 100 pts.wt. of a polyphenylene sulfide resin satisfying a condition of formula I (Tmc is exothermic peak temperature followed by crystallization in temperature drop at 20 deg.C/ minute from a molten state by a differential scanning calorimeter; Tcc is exothermic peak temperature followed by crystallization in temperature rise and drop of a substantially nonmelted sample at 20 deg.C/minute from a molten state by a differential scanning calorimeter) with (B) 0.1-20 pts.wt. of a 1,2,3,4- butanetetracarboxylic acid bisimide compound of formula II (R1 and R2 are 4-28C alkyl or alkenyl) and (C) 0-400 pts.wt., preferably 30-300 pts.wt. of a filler such as glass fibers or silica.

公开(公告)号：JPH06166817A

公开(公告)日：1994-06-14

申请号：JP32203592

申请日：1992-12-01

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  SAKAMOTO KOSUKE ,  KOBAYASHI KAZUHIKO

IPC: C08K3/34 ,  C08L81/02

Abstract: PURPOSE:To obtain a resin compsn. which is excellent in moldability, esp. in mold release characteristics, crystallizes quickly, and has an improved molding cycle by compounding a polyphenylene sulfide resin with tetrasilicic fluoromica. CONSTITUTION:This resin compsn. is obtd. by compounding 100 pts.wt. polyphenylene sulfide resin with 0.1-30 pts.wt. tetrasilicic fluoromica having a molar ratio of Al to Si of 0.05 or lower and a molar ratio of F to Si of 0.1 or higher. Since the compsn. is excellent in moldability, esp. in mold release characteristics, crystallizes quickly, and has an improved molding cycle, it is useful for various electric, mechanical, and automotive parts.

公开(公告)号：JPH0641430A

公开(公告)日：1994-02-15

申请号：JP19565492

申请日：1992-07-22

Applicant: TORAY INDUSTRIES

Inventor： KOBAYASHI KAZUHIKO ,  SHIMASAKI NORIO ,  ISHIO ATSUSHI

IPC: C08L67/03 ,  C08L67/00 ,  C08L71/12 ,  C08L81/00 ,  C08L81/02 ,  C08L81/06

Abstract: PURPOSE:To obtain the resin composition which can give a molding excellent in properties such as strengths, dimensional stability and heat resistance within the scope of a combination of a PPS resin with an amorphous polymer and also in flowability, molding appearance, moldability, and suitable for especially injection molding. CONSTITUTION:The composition is prepared by kneading 100 pts.wt. mixture comprising 90-10wt.% polyphenylene sulfide resin with 10-90wt.% at least one amorphous polymer selected from among a polysulfone, a polyarylate and a polyphenylene oxide and having a glass transition point of 180 deg.C or above with 0.5-15 pts.wt. polyalkylene ether compound.

公开(公告)号：JPH05230371A

公开(公告)日：1993-09-07

申请号：JP3799692

申请日：1992-02-25

Applicant: TORAY INDUSTRIES

Inventor： KOBAYASHI KAZUHIKO ,  ISHIO ATSUSHI ,  SHIMASAKI NORIO

IPC: C08L67/00 ,  C08L81/02

Abstract: PURPOSE:To obtain the subject composition having excellent fluidity even in relatively low mold temperature by blending a mixture consisting of a polyphenylene sulfide resin and a thermotropic liquid polyester with a polyalkylene ether compound. CONSTITUTION:The objective composition is obtained by blending (A) 100 pts.wt. mixture consisting of (i) 90-10wt.% polyphenylene sulfide resin and (ii) 10-90wt.% thermotropic liquid crystal polyester having structural units of formula I, formula II, formula III and formula IV (R1 is formula V, formula VI, etc.; R2 is formula VII, etc.) [preferably copolymer obtained by blending and copolymerizing so that structural units of (formula I + formula II) may be 40-95mol% based on structural units of (formula I, formula II and formula III) and a structural unit of formula III may be 50-5mol% based on the structural units of (formula I + formula II + formula III) and a molar ratio of the structural unit of formula lathe structural unit of formula II may be (75/25) to (95/5) with (B) 1.0-15 pts.wt. polyalkylene ether compound.

公开(公告)号：JPH05202289A

公开(公告)日：1993-08-10

申请号：JP1188892

申请日：1992-01-27

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  KOBAYASHI KAZUHIKO

IPC: C08K3/00 ,  C08K5/06 ,  C08K7/02 ,  C08L81/02 ,  H05K1/03

Abstract: PURPOSE:To obtain the title compsn. which adheres well to an epoxy resin. CONSTITUTION:The title compsn. is prepd. by compounding 100 pts.wt. polyphenylene sulfide resin, 0-400 pts.wt. fibrous and/or nonfibrous filler, and a polyalkylene ether compd. in an amt. of 1.2-15 pts.wt. based on the sum of the resin and the filler.