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    RESIN COMPOSITION
    31.
    发明专利
    RESIN COMPOSITION 失效

    公开(公告)号：JPS5815554A

    公开(公告)日：1983-01-28

    申请号：JP11302381

    申请日：1981-07-21

    Applicant: TORAY INDUSTRIES

    Inventor： TANAKA CHIAKI ,  NAKAJIMA SHINOBU ,  KONDOU MAKOTO

    IPC: C08L23/00 ,  C08L23/26 ,  C08L33/00 ,  C08L33/02 ,  C08L67/00 ,  C08L71/00 ,  C08L71/02 ,  C08L77/00 ,  C08L77/12 ,  C08L101/00

    Abstract: PURPOSE:To provide a resin compsn. suitable for extensive applications ranging from high-viscosity and high-melt tension elastomer to heat-and cold-resistant flexible material, prepared by blending polyether ester amide and ionomer resin. CONSTITUTION:5-98wt% (A) polyether ester amide consisting of (a) 6C or higher aminocarboxylic acid or lactam, (b) poly(alkylene oxide) glycol with a number-average molecular weight of 300-6,000 and (c) 4-20C dicarboxylic acid, is blended with 2-95wt% (B) ionomer resin obtained by adding a mono- to tri-valent metallic ion to a copolymer of an alpha-olefn and a 3-8C alpha,beta-unsatd. carboxylic acid. Preferred component (a) are 11-aminoundecanoic acid and 12- amino-dodecanoic acid.

    PRODUCTION OF RESIN COMPOSITION REINFORCED WITH COMPOSITE PARTICLE
    32.
    发明专利
    PRODUCTION OF RESIN COMPOSITION REINFORCED WITH COMPOSITE PARTICLE 失效

    公开(公告)号：JPH09216910A

    公开(公告)日：1997-08-19

    申请号：JP2450496

    申请日：1996-02-09

    Applicant: TORAY INDUSTRIES

    Inventor： YAMANAKA TORU ,  TOGAWA MITSUNARI ,  NAKAJIMA SHINOBU

    IPC: C08K5/00 ,  C08F8/00 ,  C08K9/04 ,  C08L101/00

    Abstract: PROBLEM TO BE SOLVED: To obtain a resin composition reinforced with composite particles, excellent in rigidity, heat resistance, impact resistance, toughness, etc., by melt kneading a thermoplastic resin and an inorganic filler coated with an elastic polymer in the presence of a reactive compatible modifier. SOLUTION: An inorganic filler (e.g. silica) is coated with an elastic polymer having a glass transition temperature of -10 deg.C or lower (e.g. poly-n-butyl acrylate) to produce composite particles. The composite particles and a thermoplastic resin (e.g. polyester resin) are melt kneaded in the presence of a reactive compatible modifier (e.g. maleic anhydride) to give a resin composition which consists of a thermoplastic resin, an inorganic filler, an elastic polymer having a glass transition temperature of -10 deg.C or lower, and a reactive compatible modifier and comprises one reinforced with composite particles and wherein at least 30% of the dispersed particles of the elastic polymer are present in interfacial contact with the inorganic filler. The composition is suitable for engineering parts, structural material, etc.

    POLYAMIDE COMPOSITION
    34.
    发明专利
    POLYAMIDE COMPOSITION 失效

    公开(公告)号：JPH04236262A

    公开(公告)日：1992-08-25

    申请号：JP459491

    申请日：1991-01-18

    Applicant: TORAY INDUSTRIES

    Inventor： NAKAJIMA SHINOBU ,  MASUDA TAKASHI

    IPC: C08K3/10 ,  C08K3/16 ,  C08K5/3447 ,  C08K5/47 ,  C08L77/00 ,  C08L77/02

    Abstract: PURPOSE:To obtain a polyamide composition keeping excellent flexibility, heat- resistance, weather resistance and discoloration-preventing property over a long period by compounding a plasticized polyamide with a copper halide compound, a potassium halide and a polycarbonate oligomer. CONSTITUTION:The objective polyamide composition is produced by compounding (A) 100 pts.wt. of a plasticized polyamide produced by compounding 5-25wt.% of a low-molecular weight plasticizer (preferably p- toluenesulfonamide, etc.) to nylon 11 or nylon 12 with (B) 0.005-0.1 pts.wt. (in terms of Cu) of a copper halide compound, preferably a complex of a copper halide and 2-mercaptobenzimidazole or 2-mercaptobenzothiazole, (C) 0.05-1 pt.wt. (preferably 0.1-0.5 pts.wt.) of a potassium halide (preferably potassium iodide) and (D) 0.1-10 pts.wt. (preferably 0.5-5 pts.wt.) of a polycarbonate oligomer, preferably an oligomer produced by the reaction of bisphenol A and phosgene and containing 2-20 (preferably 5-10) recurring units of formula.

    POLYAMIDE COMPOSITION
    35.
    发明专利
    POLYAMIDE COMPOSITION 失效

    公开(公告)号：JPH04222860A

    公开(公告)日：1992-08-12

    申请号：JP40607390

    申请日：1990-12-25

    Applicant: TORAY INDUSTRIES

    Inventor： NAKAJIMA SHINOBU ,  YOSHIOKA KEIJI

    IPC: C08K3/10 ,  C08J5/18 ,  C08K3/16 ,  C08K13/02 ,  C08L77/00 ,  C08L77/02

    Abstract: PURPOSE:To obtain a polyamide composition excellent in heat resistance and weather resistance without damaging flexibility for a long period of time by blending a plasticized polyamide with a halogenated copper compound and a potassium halide. CONSTITUTION:(A) 100 pts.wt. plasticized polyamide obtained by blending nylon 11 or nylon 12 with 5-25wt.% low-molecular weight plasticizer (preferably N- butylbenzenesulfonamide or p-toluenesulfonamide) is mixed with (B) 0.005-0.1 pt.wt. calculated as copper atom of a halogenated copper compound, preferably complex of a copper halide and a compound selected from 2- mercaptobenzimidazole and 2-mercaptobenzthiazole, especially cuprous chloride and an equimolar amount of 2-mercaptobenzimidazole and (C) 0.05-1 pt. wt., preferably 0.1-0.5 pt.wt. potassium halide (preferably potassium iodide) preferably by dry blending of the component A before molding with the component B and the component C to give a polyamide composition.

    HYDROPHILIC POLYAMIDE ELASTOMER
    37.
    发明专利
    HYDROPHILIC POLYAMIDE ELASTOMER 失效

    公开(公告)号：JPS61162524A

    公开(公告)日：1986-07-23

    申请号：JP125785

    申请日：1985-01-08

    Applicant: TORAY INDUSTRIES

    Inventor： FURUTA YOKO ,  NAKAJIMA SHINOBU ,  YAMAMOTO YOSHIYUKI

    IPC: C08G69/00 ,  C08G69/42 ,  C08G69/44

    Abstract: PURPOSE:A polyamide elastomer having improved hydrophilic nature and mechanical strength, consisting of a polyamide unit containing a metallic sulfodicarboxylic acid derivative and a polyether ester unit. CONSTITUTION:An elastomer consisting of (A) 60-5wt% polyamide unit derived from >=6C aminocarboxylic acid or lactam and/or a salt of >=6C diamine and dicarboxylic acid, and (B) 40-95wt% polyether ester unit containing >=5wt% poly(ethylene oxide) unit, having 250-6,000 number-average molecular weight, and 4-20C dicarboxylic acid, wherein 0-100mol% total dicarboxylic acids forming the components A and B are replaced with a metallic sulfodicarboxylic acid derivative shown by the formula (X is Na or K; R is H, CH3, CH2CH2OH, etc.).

    RESIN COMPOSITION
    40.
    发明专利
    RESIN COMPOSITION 失效

    公开(公告)号：JPS5853946A

    公开(公告)日：1983-03-30

    申请号：JP15297181

    申请日：1981-09-29

    Applicant: TORAY INDUSTRIES

    Inventor： TANAKA CHIAKI ,  NAKAJIMA SHINOBU ,  KONDOU MAKOTO

    IPC: C08L71/00 ,  C08G59/00 ,  C08L63/00 ,  C08L67/00 ,  C08L71/08 ,  C08L77/00

    Abstract: PURPOSE:To provide a resin composition imparted with oil resistance, chemical resistance, abrasion resistance, hydrolysis resistance, and high-temperature mechanical characteristics, by adding a polyepoxide having >=2 functional groups to a polyether-ester-amide. CONSTITUTION:The objective resin composition is prepared by compounding (A) 100pts.wt. of a polyether-ester-amide with (B) 0.5-100pts.wt., preferably 1- 75pts.wt. of a polyepoxide having >=2 functional groups. The component (A) is preferably a poly(tetramethyleneoxide)-glycol having a molecular weight of 500-1,500. A polyepoxide compound or a polyglycidyl compound obtained by the epoxidization of an olefin is useful as the component (B). The mixing of the two components is carried out preferably by melt blending or solution blending.

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