1.
    发明专利
    未知

    公开(公告)号:DE2636685A1

    公开(公告)日:1977-03-03

    申请号:DE2636685

    申请日:1976-08-14

    Abstract: A thermoplastic copolyester elastomer which comprises dicarboxylic acid component mainly composed of terephthalic and phthalic acids, wherein the molar ratio of terephthalic acid to phthalic acid is from about 80/20 to 35/65, and diol component mainly composed of 1,4-butanediol. The elastomer has excellent thermal stability and weatherability and can be improved in the elastomeric properties by orientation of polymer molecule before crystallization.

    POLYESTER-AMIDE
    6.
    发明专利

    公开(公告)号:JPS58154725A

    公开(公告)日:1983-09-14

    申请号:JP2952683

    申请日:1983-02-25

    Abstract: PURPOSE:A polyester-amide useful in forming fibers, films, moldings, coating agents, etc., comprising specified polyester units and specified polyamide units. CONSTITUTION:A polyester-amide comprising 20-95wt% butylene terephthalate and/or butylene isophthalate unit represented by formulaI, wherein m and n are positive integers including 0, and 5-80wt% dodecanamide and/or undecanamide unit represented by formula II. The above polyester-amide is formed by melt- polymerizing terephthalic acid and/or isophthalic acid, 1,4-butanediol and 12- aminododecanoic acid and/or 11-aminoundecanoic acid with the aid of a catalyst such as tetrabutyl titanate.

    RESIN COMPOSITION
    7.
    发明专利

    公开(公告)号:JPS58125735A

    公开(公告)日:1983-07-26

    申请号:JP14402281

    申请日:1981-09-14

    Abstract: PURPOSE:A polyether-ester-amide-containing resin composition that is made by adding a specific ethylene copolymer, thus becoming flexible as well as higher in shock resistance. CONSTITUTION:The objective composition comprises (A) 15-95wt% of polyester-ether-amide consisting of an aminoacid or lactam of 6 or more carbon atoms or a salt of diamines and dicarboxylic acids of 6 or more carbon atoms, preferably 11-aminoundecanoic acid or 12-aminododecanoic acid, of poly(alkylene oxide)glycol, preferably poly(tetramethyleneoxide)glycol and dicarboxylic acids of 4-20 carbon atoms and (B) 85-5wt% of an olefin copolymer from alpha-olefins and/or nonconjugated diene, preferably of 5-24 carbon atoms, and ethylene, preferably the concentration of the ethylene component is 20-74.5wt% and its melting point is lower than 85 deg.C.

    PHOTOSENSITIVE RESIN COMPOSITION
    8.
    发明专利

    公开(公告)号:JPS58117537A

    公开(公告)日:1983-07-13

    申请号:JP66982

    申请日:1982-01-06

    Abstract: PURPOSE:To improve resilience and picture reproducibility by compounding 100pts.wt. polyether ester amide having a specific compsn. and 5-300pts.wt. a photopolymerizable vinyl monomer having ethylenic unsatd. bonds at terminals. CONSTITUTION:Amino carboxylic acid or lactam of >=6 carbon numbers or nylon mn salt of >=10 (m+n), poly (alkylene oxid) glycol of 200-6,000 number average mol. wt., and dicarboxylic acid of 4-20 carbon numbers are copolymerized to prepare polyether ester. 100pts.wt. such polyether ester and 5-300 pts.wt. a photopolymerizable vinyl monomer of >=150 deg.C b.p. having ethylenic unsatd. bonds at the terminals are compounded to obtain a photosensitive resin compsn. Said resin compsn. forms a photosensitive layer from the soln. thereof and is used as a plate material for flexographic printing.

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