33.
    发明专利
    未知

    公开(公告)号:DE60221947D1

    公开(公告)日:2007-10-04

    申请号:DE60221947

    申请日:2002-11-08

    Applicant: XEROX CORP

    Abstract: A silicon demultiplexer, a plurality of silicon switches and a silicon multiplexer are monolithically integrated on a single silicon chip. In embodiments, the silicon demultiplexer and the silicon multiplexer each comprise a diffraction grating. In other embodiments, the silicon demultiplexer and the silicon multiplexer each comprise an arrayed waveguide grating. In various exemplary embodiments, the silicon optical switches comprise optical switches, micromachined torsion mirrors, electrostatic micromirrors, and/or tilting micromirrors. In use, an optical signal comprising a multiplexed data stream is input into the monolithic reconfigurable optical multiplexer. An optical signal that comprises a modified multiplexed data stream may be output. In an optical communications system, the silicon demultiplexer communicates with an input optical fiber, the plurality of silicon optical switches communicate between the silicon demultiplexer and the silicon multiplexer, and the silicon multiplexer communicates with an output optical fiber. In various embodiments, the optical switches are fabricated to be self-aligned.

    34.
    发明专利
    未知

    公开(公告)号:DE69836519T2

    公开(公告)日:2007-09-13

    申请号:DE69836519

    申请日:1998-06-02

    Applicant: XEROX CORP

    Abstract: A magnetically actuated ink jet printing device for use in an ink jet printer ejects ink droplets by deforming a diaphragm (38) with the force generated on an electrode (40) in a magnetic field when an electric current pulse is applied thereto. In one embodiment, the diaphragm (38) of the device is provided by anisotropically etching a silicon substrate (32) with an etch stop which provides a thin membrane of silicon material for use as the diaphragm (38). An electrode (40) having an input and output terminal (45, 42) is patterned over the diaphragm (38) and a sacrificial layer (64) is deposited over the silicon substrate surface containing the diaphragm (38). The sacrificial layer (64) is patterned to subsequently provide the ink ejection chamber (49) over the diaphragm (38). A patternable layer (44) is deposited over the silicon substrate surface including the sacrificial layer and patterned to provide the nozzles (46) and expose the electrode terminals (45, 42). The sacrificial layer (64) is removed and an ink supply is connected to the space previously occupied by the sacrificial layer (64). Magnetic field generating means having a predetermined magnetic field strength are placed adjacent the device, and electric current applied to the electrode terminals (45, 42) in a predetermined direction relative to the magnetic field produces a force necessary to deform the diaphragm (38) and eject an ink droplet from the nozzles (46) of the printing device.

    36.
    发明专利
    未知

    公开(公告)号:DE69728930D1

    公开(公告)日:2004-06-09

    申请号:DE69728930

    申请日:1997-06-16

    Applicant: XEROX CORP

    Abstract: A system (140) for measuring the mass of a sheet (150) of material including an actuator (141), a position sensing system (42), and a tactile sensor system (200). The actuator (141) imparts a known force to the sheet (150), moving it through to the position sensing system (142), which measures the sheet velocity at various points. Afterward, the sheet (150) moves through the tactile sensor system (200), which determines the coefficient of friction of the sheet. Given these quantities, a controller can determine the mass of the sheet (150), which can be used alter the performance of paper handling devices in a reproductive machine. A second embodiment (Fig. 6) of the mass measuring system includes an actuator, a position sensing system, and a subsystem for eliminating friction. The actuator applies a force to a sheet to move it into and through the subsystem. The position sensing system incorporated in the subsystem senses the acceleration of the sheet. Given this quantity, a controller can determine the mass of the sheet.

    DRY-ETCHING METHOD FOR SEMICONDUCTOR SUBSTRATE

    公开(公告)号:JPH1051048A

    公开(公告)日:1998-02-20

    申请号:JP12400597

    申请日:1997-05-14

    Applicant: XEROX CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a dry etching method suitable for the manufacture of a micro device high in dimensional accuracy and a minute electromechanical system. SOLUTION: By this method, the dry etching to etch a semiconductor substrate 24 which has a p-n hetero junction 29 being made by bringing a p layer 28 and an n layer 26 into contact with each other is performed. In this case, reverse bias voltage lower than the p-n breakdown voltage is applied to the p-n hetero junction 29. Moreover; the n layer 29 is irradiated with a plasma flow 12 including chemical reactive ions 14, and the etching of the unmasked region of the substrate 24 is continued until it stops substantially at the hetero junction 29 where reverse voltage is applied. Furthermore, to suppress the sidewall damage to the substrate 24 in the progress of downward etching, the substrate 24 is coated again periodically with cooling or corrosible material.

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