Abstract:
A composite structure is provided. The structure is formed of rigid composite material in which non-metallic continuous fibres reinforce a polymer matrix. The continuous fibres are electrically conductive. The structure has electrodes electrically connected to the continuous fibres. The composite material contains one or more insulating barriers which electrically divide the structure so that a first portion of the material in electrical contact with one of the electrodes can be held at a different electrical potential to a second portion of the material in electrical contact with the other electrode. In use, an electrical unit can be provided to electrically bridge the first and second portions of the material such that electrical signals can be transmitted between the electrodes and the electrical unit via the continuous fibres.
Abstract:
An imprinted multi-level micro-wire structure includes a substrate 6 and a first layer 10 formed over the substrate. The first layer includes first micro-wires 14 formed in first micro-channels 12 imprinted in the first layer. A second layer 20 is formed in contact with the first layer. The second layer includes second micro-wires 24 formed in second micro-channels 22 imprinted in the second layer. At least one of the second micro-wires is in electrical contact with at least one of the first micro-wires.
Abstract:
An article comprises an electronic component (2), such as an integrated circuit or packaged integrated circuit, and a circuit sheet arrangement (3). The circuit sheet arrangement may comprise a flexible planar substrate and conductive tracks (4) formed on a face of the substrate. The substrate is configured to have an aperture (17) enclosed by surrounding portion (10) of the substrate and to have at least two arms (11) supporting respective conductive tracks which extend into the aperture from the surrounding portions. The electronic component is disposed over the aperture and is attached to conductive tracks on the arms, for example, using conductive glue or ink.
Abstract:
Elektronische Vorrichtung (100), aufweisend eine elektrisch isolierende Trägerstruktur (102), eine elektrisch leitfähige Leiterbahn (104) an einer Oberfläche der Trägerstruktur (102), und eine elektrisch leitfähige Kontaktstruktur (106), die sich ausgehend von der Oberfläche in die Trägerstruktur (102) hinein erstreckt und unter Bildung eines gemeinsamen Leiterzugs (110) an einer Verbindungsstelle (108) an die Leiterbahn (104) elektrisch angeschlossen ist, wobei an der Verbindungsstelle (108) die Leiterbahn (104) und die Kontaktstruktur (106) verbreiterungsfrei ineinander übergehen.
Abstract:
The invention generally relates to polymerizable conductive ink formulations comprising at least one metal source, at least one monomer and/or oligomer and a polymerization initiator, and uses thereof for printing three-dimensional functional structures. In particular a method of fabricating a three-dimensional conductive pattern on a substrate is disclosed, the method comprising: a) forming a pattern on a surface region of a substrate by using an ink comprising at least one metal source, at least one liquid polymerizable monomer and/or oligomer, and at least one polymerization initiator; b) polymerizing at least a portion of said liquid monomer and/or oligomer; c) rendering the metal source a continuous percolation path for electrical conductivity (sintering); d) repeating steps (a), (b) and optionally (c) to obtain a three- dimensional conductive pattern.
Abstract:
An article comprises an electronic component, such as an integrated circuit or packaged integrated circuit, and a circuit sheet arrangement. The circuit sheet arrangement may comprise a flexible planar substrate and conductive tracks formed on a face of the substrate. The substrate is configured to have an aperture enclosed by surrounding portion of the substrate and to have at least two arms supporting respective conductive tracks which extend into the aperture from the surrounding portions. The electronic component is disposed over the aperture and is attached to conductive tracks on the arms, for example, using conductive glue or ink.
Abstract:
The invention relates to an electronic device (100) having an electrically insulating support structure (102), an electrically conductive conductor path (104) on a surface of the support structure (102), and an electrically conductive contact structure (106) which extends from the surface into the support structure (102) and is electrically connected to the conductor path (104) at a connection point (108), thereby forming a common conductor track (110). The conductor path (104) and the contact structure (106) transition into each other in an enlargement-free manner at the connection point (108).