公开(公告)号：EP0917197A3

公开(公告)日：2000-09-20

申请号：EP98121227.7

申请日：1998-11-06

Applicant: NEC CORPORATION

Inventor： Furuya, Mitsuru ,  Myohga, Osamu ,  Okada, Yoshitsugu

IPC: H01L23/14 ,  H01L23/66

CPC classification number: H05K1/184 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/086 ,  H05K2201/10416 ,  H05K2201/10643 ,  H01L2924/00

Abstract: Holes are formed in a ceramic substrate before sintering, magnetic parts and dielectric parts are fitted in the holes and the substrate is sintered at a temperature equal to or lower than the sintering temperature of the magnetic parts. It is possible to obtain a very compact high frequency integrated circuit, particularly, a micro wave integrated circuit which can be utilized in a frequency band of several tens GHz, by using hard ferrite as a material of the magnetic parts and magnetizing them after the sintering.

公开(公告)号：EP0951807A1

公开(公告)日：1999-10-27

申请号：EP98900295.0

申请日：1998-01-06

Applicant: W.J. FURSE & CO. LTD.

Inventor： KARMAZYN, Harry

IPC: H01C7 ,  H01H37 ,  H05K1 ,  H02H9 ,  H05K3

CPC classification number: H01H37/761 ,  H01C7/10 ,  H01H2037/046 ,  H01H2037/763 ,  H02H9/042 ,  H05K1/0201 ,  H05K1/184 ,  H05K3/3442 ,  H05K2201/10181 ,  H05K2201/10643 ,  H05K2203/159 ,  H05K2203/176

Abstract: A varistor with no connecting legs extending from it, is mounted in a slot formed in a printed circuit board (20). The printed circuit board carries the normal circuit tracks (22, 24, 26). The physical and electrical connection between the printed circuit board (20) and the varistor is achieved by the use of solder (28). When the varistor overheats to a temperature beyond a predetermined temperature, the solder melts and the varistor is separated from the printed circuit board (20). A leaf spring (30) which is biased when the varistor is inserted into the slot pushes the varistor out of the slot when the solder (28) melts. Alternatively, when the solder (28) melts gravity causes the varistor to fall out of the printed circuit board (20).

公开(公告)号：EP0054211A2

公开(公告)日：1982-06-23

申请号：EP81109994.4

申请日：1981-11-28

Applicant: Stettner & Co.

Inventor： Horstmann, Jürgen

IPC: H05K1/18

CPC classification number: H05K1/184 ,  H05K1/119 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09854 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10643

Abstract: Schaltungsplatte aus verformbarem Material, insbesondere aus Hartpapier oder faserverstärktem organischem Kunststoff, mit wenigstens einem rechteckigen Steckschlitz (2) zum Einstecken und klemmenden Halten von plättchenförmigen Bauelementen (3) mit schrägen Einsteckkanten an den Schmalseiten (5), wobei die Länge (12) des Steckschlitzes (2) etwas größer ist als die Breite (13) des Bauelementes (3) bzw. die Breite (13) des Bauelementes (3) im Steckbereich (4) und die Steckschlitzbreite (14) 0,2 bis 0,8 mm, insbesondere 0,3 bis 0,6 mm größer ist als die Dicke (15) des Bauelementes (3) bzw. seines Steckbereichs (4), und im Bereich der Schlitzenden (10,11) an beiden Längsseiten (16,17) an gegenüberliegenden Stellen nach innen ragende Zungen (18, 19) vorgesehen sind, deren lichte Weite (20) 0,05 bis 0,4 mm, insbesondere 0,1 bis 0,3 mm kleiner ist als die Dicke (15) des Bauelementes (3) bzw. seines Steckbereichs (4) und wobei die Zungen (18, 19) im Bereich der schrägen Einsteckkanten (5) derart angeordnet sind, daß sie erst ab einer bestimmten Einsetztiefe (23) des Bauelementes (3) mit diesem in Wirkverbindung treten können.

Abstract translation: 具有至少一个矩形插塞槽（2）的可变形材料，特别是层压纸或纤维增强有机塑料的电路板，用于插入和夹紧小板形部件（3），其中倾斜插入边缘狭窄 （5）中，插头槽（2）的长度（12）略大于部件（3）的宽度（13）和插头区域（4）中部件（3）的宽度（13） ）和0.2至0.8mm，特别是0.3至0.6mm的插头槽宽度（14）大于部件（3）及其插塞区域（4）的厚度（15），并且突片（18,19） 在相对位置的两个纵向侧面（16,17）上的槽端部（10,11）的区域中，向内突出的透明宽度（20）为0.05至0.4mm，特别是0.1至0.3mm， 小于组件（3）和其插塞区域（4）的厚度（15），并且突片（18,19）布置在倾斜插入边缘（5）的区域中，使得t 嘿，不要与组件（3）进行有效的连接，直到插入到特定插入深度（23）为止。

公开(公告)号：EP0005265A2

公开(公告)日：1979-11-14

申请号：EP79101335.2

申请日：1979-05-02

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Schade, Reinhart

IPC: H05K3/00 ,  H05K3/30 ,  H01L41/04

CPC classification number: H01L24/33 ,  H01L24/83 ,  H01L41/29 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K3/202 ,  H05K3/305 ,  H05K3/325 ,  H05K2201/0382 ,  H05K2201/10287 ,  H05K2201/10643 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T156/1039 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Die Erfindung betrifft ein Verfahren zur Kontaktierung der klebstoffseitigen Elektrode (4) eines auf einer elektrisch leitenden Trägerplatte (1) mit Hilfe eines isolierenden Klebstoffes (5) verbundenen elektrischen Bauteiles. das nicht nur eine sichere Kontaktgabe gewährleistet, sondern auch für eine Automatisierung geeignet ist. Dies wird gemäß der Erfindung dadurch erreicht, daß die vor dem Fügevorgang auf die Trägerplatte (1) aufgebrachte Klebstoffschicht (5) an einer oder mehreren Stellen durch kontaktbildende Mittel (6) beim unter Wärme- und Druckeinwirkung stattfindenden Füge- und Klebevorgang verdrängt wird. Als kontaktbildende Mittel können an der klebstoffbeschichteten Trägerplatte (1) eingeprägte Erhöhungen (6) verwendet sein (Fig. 3).

Abstract translation: 在绝缘粘合剂的帮助下，在连接到导电载体板的电气部件的粘合剂侧电极上进行电接触，这不仅确保了良好的接触，而且也适用于自动化。 在一个或多个点处，在接合操作期间施加在承载板上的粘合剂层在由热和压力的影响下进行的接合和接合操作期间被接触形成突起压下。 可以使用粘合剂涂布的载体板上的压花突起作为进行接触的结构。

公开(公告)号：EP3064046A1

公开(公告)日：2016-09-07

申请号：EP14795567.8

申请日：2014-10-21

Applicant: MELECS EWS GmbH & Co KG

Inventor： HELLINGER, Leopold ,  NEUMANN, Gerhard

IPC: H05K3/30 ,  H05K1/11 ,  G01L19/14 ,  H05K3/32 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K3/303 ,  G01L19/0084 ,  G01L19/147 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/09063 ,  H05K2201/10151 ,  H05K2201/10643 ,  H05K2203/166 ,  H05K2203/168 ,  Y02P70/611 ,  Y02P70/613

Abstract: The invention relates to a method for making contact with and fastening ceramic pressure sensors (2) on a printed circuit board (1), wherein the pressure sensor has, on an outer side, a plurality of contact areas which are spaced apart from one another, and these contact areas are connected to corresponding contact areas (7) on the printed circuit board. In order to replace manual fastening of the pressure sensor on the printed circuit board, provision is made for the pressure sensor (2) to have a position identification means (9), for the printed circuit board (1) to be coated with a conductive layer so as to make a cohesive connection in automated fashion by means of stencils or printing methods, and for the pressure sensor (2) to be positioned onto the printed circuit board (1) by means of an automatic pick-and-place machine and for the cohesive connection to be produced.

公开(公告)号：EP1102338B1

公开(公告)日：2009-05-06

申请号：EP99919606.6

申请日：1999-05-17

Applicant: Tyco Electronics Raychem K.K.

Inventor： SATO, Takashi Tyco Electronics Raychem K.K. ,  MIYASAKA, Naofumi Tyco Elect. RAYCHEM K.K. ,  HASUNUMA, Takashi Tyco Electronics Raychem K.K.

IPC: H01M2/34 ,  H01M10/48 ,  H01M10/42

CPC classification number: H01M2/348 ,  H01C1/1406 ,  H01M10/4257 ,  H01M10/48 ,  H01M2200/10 ,  H01M2200/106 ,  H05K1/167 ,  H05K3/3442 ,  H05K2201/10643 ,  Y02P70/613

Abstract: A secondary cell protection circuit device comprising a PCB board, a PTC element integrally formed on the PCB board and a circuit provided on the board and adapted to control the voltage and current of a secondary cell; and a secondary cell assembly provided with the device. A PCB board (1) provided thereon with an electronic part (2) and a PTC element (3), wherein the PTC element (3) comprises a PTC material (6) sandwiched between upper and lower nickel foils (71, 72), an output electrode (4) disposed on the foil (71) and an output electrode (5) disposed under the foil and soldered to the PCB board (1).

公开(公告)号：EP1620863A1

公开(公告)日：2006-02-01

申请号：EP04750897.3

申请日：2004-04-30

Applicant: TYCO Electronics Corporation

Inventor： BECKER, Paul, N. ,  MANIRAJ, Sirikhit ,  PINEDA, Martin, ,  VRANICAR, Anthony ,  YANKELLO, Francis, M. ,  WASILEWSKI, Frank

IPC: H01C1/144 ,  H01C1/016 ,  H01C1/14

CPC classification number: H01C1/016 ,  H01C1/1406 ,  H01C1/144 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y02P70/613

Abstract: A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5, 7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion, The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.

公开(公告)号：EP0811993A3

公开(公告)日：1998-11-25

申请号：EP97202527

申请日：1993-07-08

Applicant: RAYCHEM CORP

Inventor： GRAVES GREGORY A ,  ZHANG MICHAEL ,  CHANDLER DANIEL ,  CHANG CHI-MING ,  FANG SHOU-MEAN

IPC: H01C1/01 ,  H01C1/14 ,  H01C7/00 ,  H01C7/02 ,  H01G4/228 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising

(a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and
(b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element.
Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

公开(公告)号：EP0338641A1

公开(公告)日：1989-10-25

申请号：EP89200978.8

申请日：1989-04-17

Applicant: PHILIPS COMPOSANTS ,  Philips Electronics N.V.

Inventor： Thillays, Jacques ,  Blondet, Michel ,  Guilleman, Lionel

IPC: H05K3/30

CPC classification number: H05K3/3442 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H05K1/184 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10515 ,  H05K2201/1059 ,  H05K2201/10643 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: L'invention concerne le montage de d'éléments opti­ques sur un support. On réalise des fentes (24) en des en­droits déterminés d'un support (20) isolant non rigide revêtu d'une piste conductrice (22) recouverte d'un matériau de sou­dure (30), on insère ensuite dans les fentes (24) un élément optique (25) présentant deux plages conductrices espacées (25′, 25˝), de telle sorte que des éléments (25) soient rete­nus dans les fentes (24) et que leurs plages conductrices (25′, 25˝) soient en contact avec le matériau de soudure (30) et on chauffe de manière à provoquer la fusion du matériau de soudure (30) pour souder les plages conductrices (25′, 25˝) à la piste conductrice (22) correspondante.

Abstract translation: 狭槽（24）在覆盖有钎焊材料（30）具有两个分离的传导区域的光学元件（25）涂覆有导电轨（22）的非刚性绝缘支撑件（20）的指定位置产生（25' ，25“”），然后在寻求一种方式DASS模具元件（25插入到槽（24））被保留在槽（24）和做他们的导电区域（25“ 25' ”）是与接触 焊接材料（30）和热寻求的方式被应用为对以焊接导电区（25“ 25' ”）与对应的导电轨（22），使所述钎焊材料（30）的熔点。

公开(公告)号：EP0069824B1

公开(公告)日：1987-01-07

申请号：EP82102295.1

申请日：1979-05-02

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Schade, Reinhart

IPC: H05K3/30 ,  H01L41/04

CPC classification number: H01L24/33 ,  H01L24/83 ,  H01L41/29 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K3/202 ,  H05K3/305 ,  H05K3/325 ,  H05K2201/0382 ,  H05K2201/10287 ,  H05K2201/10643 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T156/1039 ,  H01L2924/3512 ,  H01L2924/00