Abstract:
Holes are formed in a ceramic substrate before sintering, magnetic parts and dielectric parts are fitted in the holes and the substrate is sintered at a temperature equal to or lower than the sintering temperature of the magnetic parts. It is possible to obtain a very compact high frequency integrated circuit, particularly, a micro wave integrated circuit which can be utilized in a frequency band of several tens GHz, by using hard ferrite as a material of the magnetic parts and magnetizing them after the sintering.
Abstract:
A varistor with no connecting legs extending from it, is mounted in a slot formed in a printed circuit board (20). The printed circuit board carries the normal circuit tracks (22, 24, 26). The physical and electrical connection between the printed circuit board (20) and the varistor is achieved by the use of solder (28). When the varistor overheats to a temperature beyond a predetermined temperature, the solder melts and the varistor is separated from the printed circuit board (20). A leaf spring (30) which is biased when the varistor is inserted into the slot pushes the varistor out of the slot when the solder (28) melts. Alternatively, when the solder (28) melts gravity causes the varistor to fall out of the printed circuit board (20).
Abstract:
Schaltungsplatte aus verformbarem Material, insbesondere aus Hartpapier oder faserverstärktem organischem Kunststoff, mit wenigstens einem rechteckigen Steckschlitz (2) zum Einstecken und klemmenden Halten von plättchenförmigen Bauelementen (3) mit schrägen Einsteckkanten an den Schmalseiten (5), wobei die Länge (12) des Steckschlitzes (2) etwas größer ist als die Breite (13) des Bauelementes (3) bzw. die Breite (13) des Bauelementes (3) im Steckbereich (4) und die Steckschlitzbreite (14) 0,2 bis 0,8 mm, insbesondere 0,3 bis 0,6 mm größer ist als die Dicke (15) des Bauelementes (3) bzw. seines Steckbereichs (4), und im Bereich der Schlitzenden (10,11) an beiden Längsseiten (16,17) an gegenüberliegenden Stellen nach innen ragende Zungen (18, 19) vorgesehen sind, deren lichte Weite (20) 0,05 bis 0,4 mm, insbesondere 0,1 bis 0,3 mm kleiner ist als die Dicke (15) des Bauelementes (3) bzw. seines Steckbereichs (4) und wobei die Zungen (18, 19) im Bereich der schrägen Einsteckkanten (5) derart angeordnet sind, daß sie erst ab einer bestimmten Einsetztiefe (23) des Bauelementes (3) mit diesem in Wirkverbindung treten können.
Abstract:
Die Erfindung betrifft ein Verfahren zur Kontaktierung der klebstoffseitigen Elektrode (4) eines auf einer elektrisch leitenden Trägerplatte (1) mit Hilfe eines isolierenden Klebstoffes (5) verbundenen elektrischen Bauteiles. das nicht nur eine sichere Kontaktgabe gewährleistet, sondern auch für eine Automatisierung geeignet ist. Dies wird gemäß der Erfindung dadurch erreicht, daß die vor dem Fügevorgang auf die Trägerplatte (1) aufgebrachte Klebstoffschicht (5) an einer oder mehreren Stellen durch kontaktbildende Mittel (6) beim unter Wärme- und Druckeinwirkung stattfindenden Füge- und Klebevorgang verdrängt wird. Als kontaktbildende Mittel können an der klebstoffbeschichteten Trägerplatte (1) eingeprägte Erhöhungen (6) verwendet sein (Fig. 3).
Abstract:
The invention relates to a method for making contact with and fastening ceramic pressure sensors (2) on a printed circuit board (1), wherein the pressure sensor has, on an outer side, a plurality of contact areas which are spaced apart from one another, and these contact areas are connected to corresponding contact areas (7) on the printed circuit board. In order to replace manual fastening of the pressure sensor on the printed circuit board, provision is made for the pressure sensor (2) to have a position identification means (9), for the printed circuit board (1) to be coated with a conductive layer so as to make a cohesive connection in automated fashion by means of stencils or printing methods, and for the pressure sensor (2) to be positioned onto the printed circuit board (1) by means of an automatic pick-and-place machine and for the cohesive connection to be produced.
Abstract:
A secondary cell protection circuit device comprising a PCB board, a PTC element integrally formed on the PCB board and a circuit provided on the board and adapted to control the voltage and current of a secondary cell; and a secondary cell assembly provided with the device. A PCB board (1) provided thereon with an electronic part (2) and a PTC element (3), wherein the PTC element (3) comprises a PTC material (6) sandwiched between upper and lower nickel foils (71, 72), an output electrode (4) disposed on the foil (71) and an output electrode (5) disposed under the foil and soldered to the PCB board (1).
Abstract:
A circuit protection device (31) suitable for surface mounting on a substrate (19). The device has a laminar PTC resistive element (3) which is composed of a conductive polymer composition and is positioned between first and second electrodes (5, 7). Attached to the first electrode is a first electrical terminal (33) containing an electrically conductive material which has a first attachment portion (35) connected to a first flexible portion (39) by means of a first connection portion (47). At least part of the first flexible portion is free of attachment to the first electrode. The first attachment portion is coplanar with at least one of the first connection portion and the first flexible portion, The first attachment portion may contain a slot (49) and a solid hinge portion (51). When the device is mounted on a substrate by means of a mounting component (41) extending from the first terminal, the first flexible portion allows contraction and expansion of the conductive polymer despite the rigid attachment of the mounting component onto the substrate.
Abstract:
An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising
(a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.
Abstract:
L'invention concerne le montage de d'éléments optiques sur un support. On réalise des fentes (24) en des endroits déterminés d'un support (20) isolant non rigide revêtu d'une piste conductrice (22) recouverte d'un matériau de soudure (30), on insère ensuite dans les fentes (24) un élément optique (25) présentant deux plages conductrices espacées (25′, 25˝), de telle sorte que des éléments (25) soient retenus dans les fentes (24) et que leurs plages conductrices (25′, 25˝) soient en contact avec le matériau de soudure (30) et on chauffe de manière à provoquer la fusion du matériau de soudure (30) pour souder les plages conductrices (25′, 25˝) à la piste conductrice (22) correspondante.